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CN-224205663-U - Patch diode

CN224205663UCN 224205663 UCN224205663 UCN 224205663UCN-224205663-U

Abstract

The utility model discloses a patch diode, which belongs to the technical field of diodes and comprises a chip body, an upper pin, a lower pin and a packaging piece, wherein the upper end and the lower end of the chip body are respectively connected with the upper pin and the lower pin, parts of the chip body, the upper pin and parts of the lower pin are packaged in the packaging piece, ceramic insulation columns are arranged outside horizontal sections of the upper pin and the lower pin, the ceramic insulation columns are packaged in the packaging piece, and the tail ends of the ceramic insulation columns are flush with the tail ends of the packaging piece. According to the utility model, the ceramic insulation column is arranged, so that acting force can not directly act on the plastic package part when the upper pin or the lower pin is cut, the probability of breakage of the plastic package part is reduced through buffering of the ceramic insulation column, the yield and the processing efficiency are improved, and meanwhile, the ceramic insulation column has a good heat dissipation effect and the heat dissipation effect is improved.

Inventors

  • ZHOU JIANGQUN
  • ZHANG YUNFENG

Assignees

  • 深圳市鑫环电子有限公司

Dates

Publication Date
20260505
Application Date
20250729

Claims (5)

  1. 1. The utility model provides a paster diode, includes chip body (1), goes up pin (2), lower pin (3) and package (4), both ends are connected respectively about chip body (1) go up pin (2) with lower pin (3), the local of chip body (1), last pin (2) and the local package of lower pin (3) are in package (4), its characterized in that, go up pin (2) with the horizontal segment outside of lower pin (3) is equipped with ceramic insulation post (5), ceramic insulation post (5) encapsulation is in package (4), ceramic insulation post (5) end flushes with package (4) end.
  2. 2. A chip diode according to claim 1, wherein a plurality of extension strips (51) are uniformly distributed on the upper and lower sides of the ceramic insulating column (5), and the extension strips (51) are encapsulated in the encapsulation (4).
  3. 3. A chip diode as claimed in claim 1, characterized in that the ceramic insulating pillars (5) are stepped pillars.
  4. 4. A chip diode as claimed in claim 3, characterized in that the ceramic insulating pillars (5) increase in size from inside to outside within the package (4).
  5. 5. A chip diode as claimed in claim 1, characterized in that the ceramic insulating pillars (5) are of an i-pillar shape.

Description

Patch diode Technical Field The utility model relates to the technical field of diodes, in particular to a patch diode. Background In the production process, the pins of the patch diode are designed to be of specific lengths so as to meet different welding and heat dissipation requirements. In the manufacturing process of the patch diode, after the plastic packaging is completed, the pins of the diode are required to be subjected to rib cutting treatment. However, in the cutting process, the pins directly act on the plastic package, which is easy to cause plastic package cracking, thereby damaging the diode and affecting the processing efficiency. The present utility model is directed to solving the above-described problems. Disclosure of utility model Aiming at the technical defects, the utility model aims to provide the patch diode, by arranging the ceramic insulation column, when an upper pin or a lower pin is cut, acting force can not directly act on a plastic package part, and the probability of breakage of the plastic package part is reduced by buffering of the ceramic insulation column, so that the technical problem in the background technology is solved. The chip body, part of the upper pin and part of the lower pin are packaged in the packaging piece, ceramic insulation columns are arranged on the outer sides of horizontal sections of the upper pin and the lower pin, the tail ends of the ceramic insulation columns are flush with the tail ends of the packaging piece, acting force is not directly exerted on the plastic packaging piece when the upper pin or the lower pin is cut through the ceramic insulation columns, the probability of breakage of the plastic packaging piece is reduced through buffering of the ceramic insulation columns, yield and processing efficiency are improved, and meanwhile the ceramic insulation columns have good heat dissipation effect and improve heat dissipation effect. Preferably, the upper side surface and the lower side surface of the ceramic insulating column are uniformly provided with a plurality of extension strips, the extension strips are encapsulated in the encapsulation piece, and the connection strength of the ceramic insulating column and the encapsulation piece is improved and the heat dissipation effect is further improved by arranging the extension strips. Preferably, the ceramic insulating column is in a stepped column shape, and the number of steps of the stepped column is more than or equal to 2. Preferably, the size of the ceramic insulating column is gradually increased from inside to outside in the packaging piece, and the ceramic insulating column is in a stepped column shape, so that the connection strength is improved. Preferably, the ceramic insulating column is in an I-shaped column shape, the contact area of the packaging piece is increased, the connection strength is improved, and meanwhile, the connection strength is further enhanced through I-shaped design. The utility model has the beneficial effects that: 1. According to the utility model, the ceramic insulation column is arranged, so that acting force can not directly act on the plastic package part when the upper pin or the lower pin is cut, the probability of breakage of the plastic package part is reduced through buffering of the ceramic insulation column, the yield and the processing efficiency are improved, and meanwhile, the ceramic insulation column has a good heat dissipation effect and the heat dissipation effect is improved. 2. According to the utility model, the extension strips are arranged, so that the connection strength of the ceramic insulating column and the packaging piece is improved, and the heat dissipation effect is further improved. Drawings In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Fig. 1 is a schematic structural diagram of a patch diode according to an embodiment of the present utility model. Fig. 2 is a schematic structural view of the non-mounted package in fig. 1. Fig. 3 is a schematic structural diagram of a patch diode according to a second embodiment of the present utility model. Fig. 4 is a schematic structural view of the non-mounted package in fig. 3. Fig. 5 is a schematic structural diagram of a patch diode according to a third embodiment of the present utility model. Fig. 6 is a schematic structural view of the non-mounted package of fig. 5. Reference numerals illustrate: 1-chip body, 2-upper pin, 3-lower pin, 4-package, 5-ceramic insulating column, 51-extension strip. Detailed Description The following description of the embodiments of