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CN-224206188-U - Laser module and aerosol generating device

CN224206188UCN 224206188 UCN224206188 UCN 224206188UCN-224206188-U

Abstract

The utility model discloses a laser module and an aerosol generating device. The laser module is used for aerosol generating device, and the laser module includes chip, electrode layer, radiating member and insulating member, and the chip is used for transmitting laser, and the electrode layer is including anodal and the negative pole that the interval set up, and anodal and negative pole all are connected with the chip electricity, and the radiating member sets up in one side of chip, insulating member isolated electrode layer and radiating member to be connected with the radiating member heat conduction. In the laser module of the embodiment of the utility model, the electrode layer can supply power to the chip, so that the chip emits laser, and the heat dissipation part can absorb heat generated by the chip when the chip emits laser, thereby being beneficial to improving the heat dissipation efficiency of the laser module.

Inventors

  • CHEN XIAOPEI
  • SONG BIN
  • GUO YU
  • LIANG FENG

Assignees

  • 思摩尔国际控股有限公司

Dates

Publication Date
20260508
Application Date
20250314

Claims (10)

  1. 1. A laser module for an aerosol-generating device, comprising: a chip for emitting laser light; The electrode layer comprises a positive electrode and a negative electrode which are arranged at intervals, and the positive electrode and the negative electrode are electrically connected with the chip; A heat dissipation member disposed at one side of the chip, and And the insulating piece is used for isolating the electrode layer and the heat dissipation piece and is in heat conduction connection with the heat dissipation piece.
  2. 2. The laser module according to claim 1, wherein the insulating member includes an insulating substrate, the electrode layer and the heat sink are provided on both sides in a thickness direction of the insulating substrate, respectively, and the chip and the electrode layer are provided on the same side of the insulating substrate.
  3. 3. The laser module of claim 2, wherein the laser module comprises a thermally conductive layer connecting the insulating substrate and the heat sink.
  4. 4. The laser module of claim 2, wherein the negative electrode and the positive electrode are both disposed on a surface of the insulating substrate, the chip includes a first electrode and a second electrode that are opposite to each other, the first electrode is connected to the positive electrode through a lead, and the chip is disposed on the negative electrode through the second electrode.
  5. 5. The laser module of claim 1, wherein the insulating member comprises an insulating substrate and an insulating layer, the insulating substrate, the electrode layer, the insulating layer and the heat sink are sequentially stacked, and the chip is located on a side of the insulating substrate facing away from the electrode layer.
  6. 6. The laser module of claim 5, wherein the laser module comprises a first conductive layer, the first conductive layer and the chip are disposed on a same side of the insulating substrate, the first conductive layer comprises a first conductive portion and a second conductive portion, the first conductive portion is electrically connected with the positive electrode, the second conductive portion is electrically connected with the negative electrode, the chip comprises a first electrode and a second electrode opposite to each other, the first electrode is connected with the first conductive portion through a lead, and the chip is disposed on the second conductive portion through the second electrode.
  7. 7. The laser module of claim 6, comprising a second conductive layer disposed between the electrode layer and the insulating substrate, the electrode layer being electrically connected to the first conductive layer through the second conductive layer.
  8. 8. The laser module of claim 7, wherein the insulating substrate has a via formed therethrough in a thickness direction, and wherein a conductive material is disposed in the via, the conductive material connecting the first conductive layer and the second conductive layer.
  9. 9. The laser module of claim 1, wherein the number of the chips is plural, a plurality of the chips are connected in parallel to form a plurality of light emitting units, the plurality of the light emitting units are connected in series, the electrode layer comprises one negative electrode and at least one positive electrode, and the negative electrode and the positive electrode are connected in series with at least one light emitting unit.
  10. 10. An aerosol-generating device, comprising: the laser module of any one of claims 1-9; The shell, the shell forms and holds the chamber, laser module sets up hold the intracavity.

Description

Laser module and aerosol generating device Technical Field The utility model relates to the technical field of atomization, in particular to a laser module and an aerosol generating device. Background An aerosol-generating device is a small device that can act on an aerosol-generating substrate and generate an aerosol using a heated non-combustion technique. In particular, aerosol-generating devices typically heat an aerosol-generating substrate to a temperature that is sufficient to generate an aerosol but insufficient to burn, so that the aerosol-generating substrate can be left unburned to generate an aerosol for inhalation by a user. At present, a laser chip is generally adopted to emit laser so as to heat aerosol generating products, and a large amount of heat is generated by the laser chip in the process of emitting laser, so that the temperature of the laser chip is increased, the emission efficiency of the laser chip is reduced, and therefore, the heat sink is utilized to absorb waste heat so as to cool the laser chip. In the related art, the surface of the laser chip, which is in contact with the heat sink, is electrified, so that the heat sink is electrified, and the use of a complete machine hardware system is affected. Disclosure of utility model The utility model provides a laser module and an aerosol generating device. The laser module of the embodiment of the application is used for an aerosol generating device, and comprises a chip, an electrode layer, a heat dissipation piece and an insulating piece, wherein the chip is used for emitting laser, the electrode layer comprises a positive electrode and a negative electrode which are arranged at intervals, the positive electrode and the negative electrode are electrically connected with the chip, the heat dissipation piece is arranged on one side of the chip, and the insulating piece isolates the electrode layer and the heat dissipation piece and is in heat conduction connection with the heat dissipation piece. In the laser module of the embodiment of the application, the electrode layer can supply power to the chip, so that the chip emits laser, and the heat dissipation part can absorb heat generated by the chip when the chip emits laser, thereby being beneficial to improving the heat dissipation efficiency of the laser module. In some embodiments, the insulating member includes an insulating substrate, the electrode layer and the heat sink are disposed on both sides of the insulating substrate in a thickness direction of the insulating substrate, and the chip and the electrode layer are disposed on the same side of the insulating substrate. In this way, the insulating substrate can function as an insulator, preventing current from flowing from the electrode layer to the heat sink. In some embodiments, the laser module includes a thermally conductive layer connecting the insulating substrate and the heat sink. Therefore, the heat conducting layer can conduct heat, and the heat radiating efficiency is improved. In some embodiments, the negative electrode and the positive electrode are both disposed on the surface of the insulating substrate, the chip includes a first electrode and a second electrode that are opposite to each other, the first electrode is connected to the positive electrode through a lead, and the chip is disposed on the negative electrode through the second electrode. Therefore, the chip and the electrode layer are arranged on the same side of the insulating substrate, and both the positive electrode and the negative electrode can be electrically connected with the chip. In some embodiments, the insulating member includes an insulating substrate and an insulating layer, where the insulating substrate, the electrode layer, the insulating layer, and the heat sink are sequentially stacked, and the chip is located on a side of the insulating substrate facing away from the electrode layer. In this way, the insulating layer may act as an insulator, preventing current from flowing from the electrode layer to the heat sink. In some embodiments, the laser module includes a first conductive layer, the first conductive layer and the chip are disposed on the same side of the insulating substrate, the first conductive layer includes a first conductive portion and a second conductive portion, the first conductive portion is electrically connected with the anode, the second conductive portion is electrically connected with the cathode, the chip includes a first electrode and a second electrode opposite to each other, the first electrode is connected with the first conductive portion through a lead wire, and the chip is disposed on the second conductive portion through the second electrode. Thus, the first conductive layer can conduct the current of the electrode layer to the chip, so that the positive electrode and the negative electrode are electrically connected with the chip. In some embodiments, the laser module includes a second conductiv