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CN-224207871-U - High-pressure homogenizing equipment for semiconductor nanometer finishing agent

CN224207871UCN 224207871 UCN224207871 UCN 224207871UCN-224207871-U

Abstract

The utility model relates to the technical field of processing of semiconductor nano finishing agents, in particular to high-pressure homogenizing equipment of a semiconductor nano finishing agent, which comprises a homogenizer body, wherein a pre-homogenizing box body assembly is arranged above the homogenizer body, a conveying pipe is connected between the pre-homogenizing box body assembly and the homogenizer body, and a switch valve is arranged on the conveying pipe; the pre-homogenizing box body assembly comprises a circular box body and a circular cover plate, wherein the upper plane of the circular cover plate is connected with a feed hopper, a rotating shaft penetrates through the center of the circular cover plate, the upper end of the rotating shaft is connected with a circumference driving device, a spiral feeder is sleeved on the outer circle of the lower end of the rotating shaft, two stirrer assemblies are symmetrically arranged between the outer side of the spiral feeder and the inner wall of the circular box body, the pre-homogenizing box body assembly further comprises a revolution driving mechanism and a rotation driving mechanism, the revolution driving mechanism is suitable for driving the stirrer assemblies to rotate circumferentially along the rotating shaft, and the rotation driving mechanism is suitable for driving the stirrer assemblies to rotate. The utility model has reasonable structure and solves the problem of poor homogenizing effect caused by uneven distribution of particles in raw materials.

Inventors

  • ZHANG WEI
  • LI HUBAO
  • ZHANG CHI

Assignees

  • 江苏晶久微电子材料有限公司

Dates

Publication Date
20260508
Application Date
20250217

Claims (6)

  1. 1. The high-pressure homogenizing equipment of the semiconductor nano finishing agent comprises a homogenizer body (1) and is characterized in that a pre-homogenizing box body assembly (20) is arranged above the homogenizer body (1), a conveying pipe (3) is connected between the pre-homogenizing box body assembly (20) and the homogenizer body (1), and a switching valve (4) is arranged on the conveying pipe (3); The pre-homogenizing box assembly (20) comprises a circular box (21) and a circular cover plate (22) arranged at the top opening of the circular box, the upper plane of the circular cover plate (22) is connected with a feed hopper (23), a rotating shaft (24) is arranged in the center of the circular cover plate (22) in a penetrating way, the upper end of the rotating shaft (24) is connected with a circumference driving device (25), and the outer circle of the lower end of the rotating shaft is sleeved with a spiral feeder (26); Two stirrer assemblies (50) are symmetrically arranged between the outer side of the spiral feeder (26) and the inner wall of the circular box body (21), and the spiral feeder also comprises a revolution driving mechanism (60) and a rotation driving mechanism (70); The revolution driving mechanism (60) is respectively connected with the two stirrer assemblies (50) and is suitable for driving the stirrer assemblies (50) to rotate circumferentially along the rotating shaft (24), and the rotation driving mechanism (70) is respectively connected with the two stirrer assemblies (50) and is suitable for driving the stirrer assemblies (50) to rotate.
  2. 2. The high-pressure homogenizing device of the semiconductor nano finishing agent according to claim 1, wherein the spiral feeder (26) comprises a cylinder (261) and spiral blades (262) concentrically arranged in the inner cavity of the cylinder, the spiral blades (262) are sleeved and connected to the outer circle of the lower end of the rotating shaft (24), a plurality of supporting blocks (263) are connected to the lower annular array of the cylinder (261), and the supporting blocks (263) are connected to the bottom of the inner cavity of the circular box body (21).
  3. 3. The high-pressure homogenizing device of the semiconductor nano-finishing agent according to claim 1, wherein the agitator assembly (50) comprises a cylinder (51), a plurality of agitating blades (52) are connected to the outer circle of the cylinder (51) at intervals, and a connecting shaft (53) is connected to the upper end of the cylinder (51).
  4. 4. A high-pressure homogenizing apparatus for a semiconductor nano-finishing agent according to claim 3, wherein the revolution driving mechanism (60) comprises a strip-shaped mounting plate (61) arranged above the spiral feeder (26), mounting holes (62) are respectively formed at two ends of the strip-shaped mounting plate (61), the mounting holes (62) are sleeved on the outer circle of the connecting shaft (53) and are rotationally connected with the connecting shaft, a fixing hole (63) is formed in the center of the strip-shaped mounting plate (61), and the fixing hole (63) is sleeved on the outer circle of the rotating shaft (24) and is fixedly connected with the outer circle of the rotating shaft.
  5. 5. A high-pressure homogenizing apparatus of a semiconductor nano-finish according to claim 3, wherein the rotation driving mechanism (70) comprises an inner gear ring (71) and gears (72) respectively sleeved on the connecting shafts (53), the gears (72) are meshed with the inner gear ring (71), and the inner gear ring (71) is sleeved on the inner wall of the circular box body (21).
  6. 6. The high-pressure homogenizing device of the semiconductor nano finishing agent according to claim 1, wherein one end of the homogenizer body (1) is connected with a discharging pipe (8), and a plurality of supporting legs (9) are connected with a bottom annular array of the circular box body (21).

Description

High-pressure homogenizing equipment for semiconductor nanometer finishing agent Technical Field The utility model relates to the technical field of processing of semiconductor nano finishing agents, in particular to high-pressure homogenizing equipment of a semiconductor nano finishing agent. Background The semiconductor nano finishing agent is a chemical agent which takes semiconductor nano materials as key components and is prepared by a specific process and is used for carrying out surface treatment or functional modification on various materials so as to obtain specific performance. The characteristics of the semiconductor nano-finish result from the specific properties of the semiconductor nano-material. Due to the small size effect, quantum size effect, surface effect and the like of the nano material, the semiconductor nano finishing agent has different optical, electrical, catalytic and other performances compared with the traditional finishing agent. For example, by utilizing quantum size effect, semiconductor nano particles can generate special photoelectric effect under the action of light, so that the finished material has unique optical or electrical properties. During the production of semiconductor nano-finishes, the raw materials need to be crushed and homogenized using high pressure homogenizers that homogenize at high speed by pushing the material through a very narrow gap, which typically involves forcing the material through a very narrow gap or pore under high pressure, which results in high shear and pressure, thus making the material finer and more uniform. In view of the above-mentioned related art, the inventors found that, in the process of homogenizing a raw material of a semiconductor nano-sized agent using a high-pressure homogenizer, particles in the raw material are precipitated to the bottom of a cavity when not homogenized, so that when restarting, the particle distribution is uneven, resulting in poor homogenization effect, and the quality of the semiconductor nano-sized agent is lowered. Disclosure of utility model The utility model mainly solves the technical problem of providing high-pressure homogenizing equipment of a semiconductor nano finishing agent, and solves the problem of poor homogenizing effect caused by uneven particle distribution in raw materials. In order to solve the technical problems, the utility model adopts a technical scheme that the high-pressure homogenizing equipment for the semiconductor nano finishing agent comprises a homogenizer body, wherein a pre-homogenizing box body assembly is arranged above the homogenizer body, a conveying pipe is connected between the pre-homogenizing box body assembly and the homogenizer body, and a switch valve is arranged on the conveying pipe; the pre-homogenizing box assembly comprises a circular box body and a circular cover plate arranged at the top opening of the circular box body, the upper plane of the circular cover plate is connected with a feed hopper, a rotating shaft penetrates through the center of the circular cover plate, the upper end of the rotating shaft is connected with a circumference driving device, and the outer circle of the lower end of the rotating shaft is sleeved with a spiral feeder; Two stirrer assemblies are symmetrically arranged between the outer side of the spiral feeder and the inner wall of the circular box body, and the spiral feeder also comprises a revolution driving mechanism and a rotation driving mechanism; the revolution driving mechanism is respectively connected with the two stirrer assemblies and is suitable for driving the stirrer assemblies to do circumferential rotation along the rotating shaft, and the rotation driving mechanism is respectively connected with the two stirrer assemblies and is suitable for driving the stirrer assemblies to conduct rotation. Through adopting above-mentioned technical scheme, when using, the raw materials with the semiconductor nanometer finishing agent is input into the circular box of prehomogeneous box subassembly through the feeder hopper, operation circumference drive arrangement work drives the pivot and rotates, the pivot drives spiral conveyer and carries out work, the spiral conveyer is upwards transmitted the raw materials of bottom in the circular box and is flowed all around, the raw materials flows downwards between the inner wall of spiral conveyer and circular box promptly, thereby make the raw materials be circulation flow, simultaneously, the pivot passes through revolution actuating mechanism and drives two agitator subassemblies and do circumference rotation along the pivot, the agitator subassembly stirs the raw materials, through rotation actuating mechanism's use, rotation actuating mechanism drives the agitator subassembly and rotates, the agitator subassembly also rotates in carrying out revolution's in-process promptly, the homogeneity to the granule distribution in the raw materials has been strengthened, the