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CN-224208391-U - IGBT contact pin gluing device

CN224208391UCN 224208391 UCN224208391 UCN 224208391UCN-224208391-U

Abstract

The utility model belongs to the technical field of electric elements, and particularly relates to an IGBT contact pin gluing device, wherein the IGBT contact pin gluing device comprises a vertical moving pair, a gluing gun, a gluing head, a glue coating head and a glue coating cavity, wherein the vertical moving pair is arranged on the side wall of a moving sliding block of a horizontal moving pair, the glue coating gun is vertically arranged on the side wall of the sliding plate of the vertical moving pair and is communicated with a glue cylinder, the glue coating gun is internally provided with a buffer cavity, the glue coating head is detachably sleeved on the bottom wall of the outer end of the glue coating gun, a plurality of stepped slow flow apertures are formed in the inner matrix, glue flows into the buffer cavity, the buffer cavity is suitable for balancing the flow speed and the pressure distribution of glue, when the glue flows downwards through the stepped slow flow apertures, the flow speed of the glue can be further reduced through the buffer cavity and the stepped slow flow apertures, and the glue is prevented from dropping downwards when glue coating is stopped.

Inventors

  • TANG GUANGMING
  • LI ANG
  • GAO WENXIANG
  • SHANG JIAN
  • CHENG YANG
  • YE WEI

Assignees

  • 常州科瑞尔科技有限公司

Dates

Publication Date
20260508
Application Date
20250317

Claims (9)

  1. 1. IGBT contact pin rubber coating device, characterized by includes: a horizontal shifting pair (11); A vertical moving pair (1) which is provided on the side wall of a moving slider (12) of the horizontal moving pair (11); a glue gun (2) which is vertically arranged on the side wall of a sliding plate (13) of the vertical moving pair (1) and is communicated with the glue cylinder (10), and A buffer cavity (20) is arranged in the gluing gun (2); The gluing head (3) is detachably sleeved on the bottom wall of the outer end of the gluing gun (2), is positioned below the buffer cavity (20), and is provided with a plurality of stepped slow flow apertures (30) in a matrix through way.
  2. 2. The IGBT pin gluing device according to claim 1, wherein, A plurality of guide fins (21) are axially arranged in the buffer cavity (20).
  3. 3. An IGBT pin gluing device according to claim 2, characterized in that, The guide fins (21) are obliquely arranged and form an included angle of 15 degrees with the horizontal plane.
  4. 4. An IGBT pin gluing device according to claim 2, characterized in that, The length of the guide fins (21) is 2/3-4/5 of the height of the buffer cavity (20), so that the glue solution fully contacts the guide fins (21).
  5. 5. The IGBT pin gluing device according to claim 1, wherein, The stepped slow flow aperture (30) is divided into three stages from an inlet to an outlet, and the aperture is gradually reduced.
  6. 6. The IGBT pin gluing device according to claim 5, wherein, The depth gradient of each stage of pore diameter of the stepped slow flow pore diameter (30) is increased.
  7. 7. The IGBT pin gluing device according to claim 6, wherein, The stepped slow flow apertures (30) are arranged in a honeycomb hexagonal shape, and the distance between two adjacent apertures is 1.5 times larger than the diameter of the aperture.
  8. 8. IGBT contact pin rubber coating device, characterized by includes: The workbench (4) is rotatably provided with a glue-drawing rotary table (8); The feeding mechanical arm (5) is arranged at one side of the glue dividing rotary table (8) and is suitable for placing a workpiece on a station of the glue dividing rotary table (8); the gluing device (6) is arranged above the gluing rotary table (8) and is suitable for gluing the workpiece; The gluing gun (2) is arranged at the lower end of the gluing device; The detecting device is arranged on one side of the glue dividing rotary table (8) and is suitable for detecting whether glue on the surface of a workpiece is qualified or not.
  9. 9. The IGBT pin gluing device according to claim 8, wherein, One side of the workbench (4) is provided with a lifting mechanism (7) close to the feeding manipulator (5), and the lifting mechanism (7) is suitable for driving a tray for bearing a workpiece to move up and down.

Description

IGBT contact pin gluing device Technical Field The utility model belongs to the technical field of electrical elements, and particularly relates to an IGBT contact pin gluing device. Background An IGBT (insulated gate bipolar transistor) Pin machine is a key device used in the IGBT module assembly process and is responsible for inserting pins (pins) into specified positions of the IGBT modules. In the related art, after the pin inserting procedure is completed, the surface of the chip needs to be glued and capped, but when the gluing head glues the surface of the chip, excessive glue drops on the chip, so that the phenomenon of glue overflow occurs when the cap is capped, and the signal transmission path change is influenced by the glue overflow. Therefore, how to avoid the excessive glue from dripping on the chip during the glue spreading is a technical problem in the art. It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and therefore the above description is not to be construed as constituting information of the related art. Disclosure of utility model The embodiment of the disclosure at least provides an IGBT contact pin gluing device. In a first aspect, an embodiment of the present disclosure provides an IGBT pin gluing device, including: a horizontal shifting pair; the vertical moving pair is arranged on the side wall of the moving slide block of the horizontal moving pair; a glue gun vertically arranged on the side wall of the sliding plate of the vertical moving pair and communicated with the glue cylinder, and A buffer cavity is arranged in the gluing gun; the gluing head is detachably sleeved on the bottom wall of the outer end of the gluing gun, is positioned below the buffering cavity and is penetrated with a plurality of stepped slow flow apertures distributed in a matrix mode. In an alternative embodiment, a plurality of guide fins are axially arranged in the buffer cavity. In an alternative embodiment, the guide fins are obliquely arranged and form an angle of 15 degrees with the horizontal plane. In an alternative embodiment, the length of the guide fins is 2/3-4/5 of the height of the buffer cavity, so that the glue fully contacts the guide fins. In an alternative embodiment, the stepped slow flow pore size is divided into three stages from the inlet to the outlet, and the pore size gradually decreases. In an alternative embodiment, the depth gradient of each stage of pore diameter of the stepped slow flow pore diameter increases. In an alternative embodiment, the stepped slow flow apertures are arranged in a honeycomb hexagonal shape, and the distance between two adjacent apertures is 1.5 times greater than the diameter of the aperture. In a second aspect, an embodiment of the present disclosure further provides an IGBT pin gluing device, including: The workbench is rotatably provided with a glue-drawing rotary table; The feeding mechanical arm is arranged on one side of the glue dividing rotary table and is suitable for placing a workpiece on a station of the glue dividing rotary table; the gluing device is arranged above the gluing rotary table and is suitable for gluing the workpiece; the glue coating gun is arranged at the lower end of the glue coating device; The detecting device is arranged on one side of the glue dividing rotary table and is suitable for detecting whether glue on the surface of a workpiece is qualified or not. In an alternative embodiment, a lifting mechanism is arranged on one side of the workbench near the feeding manipulator, and the lifting mechanism is suitable for driving a tray for bearing the workpiece to move up and down. The IGBT pin gluing device has the beneficial effects that the buffer cavity is arranged in the gluing gun, and the stepped slow flow aperture is arranged in the gluing head, so that the instant glue outlet amount during gluing can be prevented, the pulse type glue overflow is prevented, meanwhile, the glue is prevented from dripping downwards when the gluing is stopped, the excessive glue is prevented from dripping on a chip, and the gluing quality is improved. Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and drawings. In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below. Drawings In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the related art, the drawings that are required to be used in the description of the embodiments or the rel