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CN-224208416-U - Adhesive dispensing device for semiconductor chip

CN224208416UCN 224208416 UCN224208416 UCN 224208416UCN-224208416-U

Abstract

The utility model belongs to the field of adhesive dispensing devices, in particular to a semiconductor chip adhesive dispensing device which comprises a frame, wherein a pair of first sliding rails are arranged on the inner wall of the frame, a second sliding rail is arranged between the first sliding rails, a third sliding rail is connected in the middle of the second sliding rail in a sliding manner, an installation seat is connected in the middle of the third sliding rail in a sliding manner, a nozzle is arranged at the bottom of the installation seat, a box body is fixedly connected in the middle of the installation seat, an air pipe is communicated with the end part of the box body, a plurality of spray heads are communicated with the other end of the box body, a plurality of filter plates are arranged in the box body, and hot air flow can pass through the air pipe and be sprayed to the surface of a colloid from the spray heads through the cooperation of the air pipe and the spray heads, so that the device can heat the chip adhesive when the chip is dispensed, and the solidifying speed of the colloid on the surface of the chip is accelerated.

Inventors

  • ZHANG SHIZU
  • Zou Chenhu
  • XU XINYAO

Assignees

  • 成都鸿辰光子半导体科技有限公司

Dates

Publication Date
20260508
Application Date
20250528

Claims (6)

  1. 1. The semiconductor chip dispensing device comprises a frame (1) and is characterized in that a pair of first sliding rails (12) are arranged on the inner wall of the frame (1), a second sliding rail (13) is arranged between the first sliding rails (12), a third sliding rail (111) is connected to the middle of the second sliding rail (13) in a sliding mode, an installation seat (14) is connected to the middle of the third sliding rail (111) in a sliding mode, a nozzle (15) is arranged at the bottom of the installation seat (14), a box body (16) is fixedly connected to the middle of the installation seat (14), an air pipe (17) is communicated with the end portion of the box body (16), a plurality of spray heads (19) are communicated with the other end of the box body (16), a plurality of filter plates (18) are arranged inside the box body (16), and a vacuum chuck (110) is arranged on the inner wall of the frame (1).
  2. 2. The semiconductor chip dispensing device according to claim 1 is characterized in that a pair of connecting rods (2) are symmetrically and rotatably connected to the middle of a box body (16), the connecting rods (2) are connected with the box body (16) through torsion springs, clamping plates (22) are fixedly connected to the ends of the adjacent connecting rods (2), and handles (23) are fixedly connected to the middle of the clamping plates (22).
  3. 3. The semiconductor chip dispensing device according to claim 2, wherein the bottom of the mounting seat (14) is symmetrically and fixedly connected with a spring telescopic rod (3), and the bottom of the spring telescopic rod (3) is fixedly connected with a pressing plate (32).
  4. 4. A semiconductor chip dispensing device according to claim 3, wherein a plurality of balls (4) are rotatably connected to the bottom of the pressing plate (32), and the balls (4) are arranged in an array.
  5. 5. The semiconductor chip dispensing device according to claim 4, wherein an air bag (5) is fixedly connected to the middle of the pressing plate (32), and a plug (52) is connected to the middle of the air bag (5) in a threaded manner.
  6. 6. The semiconductor chip dispensing device according to claim 5, wherein a plurality of reinforcing plates (6) are fixedly connected to the middle part of the air bag (5), and the reinforcing plates (6) are arranged in a circumferential array.

Description

Adhesive dispensing device for semiconductor chip Technical Field The utility model relates to the field of adhesive dispensing devices, in particular to a semiconductor chip adhesive dispensing device. Background The semiconductor refers to a material with conductivity between that of a conductor and an insulator at normal temperature, and can be divided into four types of integrated circuits, discrete devices, sensors and optoelectronic devices according to the standard mode of internationally-popular semiconductor products, and the semiconductor can be collectively called as a semiconductor device and is widely applied to the fields of electronics, communication, computers, energy sources, medical treatment, automobiles and the like. In the process of processing a semiconductor chip, dispensing is an important step, and glue is filled in a gap between the chip and a substrate to strengthen the connection between the chip and the substrate, improve mechanical reliability, and prevent intrusion of moisture and pollutants. When the conventional semiconductor chip is glued, the glue is generally coated on the surface of the chip in an indoor environment, and the glue needs to be naturally shaped in the glue dispensing mode, so that the time required for curing the glue is increased. Therefore, a dispensing device for semiconductor chips is proposed to solve the above problems. Disclosure of utility model In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved. The technical scheme includes that the semiconductor chip dispensing device comprises a frame, a pair of first sliding rails are arranged on the inner wall of the frame, a second sliding rail is arranged between the first sliding rails, a third sliding rail is connected in a sliding mode to the middle of the second sliding rail, a mounting seat is connected in a sliding mode to the middle of the third sliding rail, a nozzle is arranged at the bottom of the mounting seat, a box body is fixedly connected to the middle of the mounting seat, the end portion of the box body is communicated with an air pipe, the other end of the box body is communicated with a plurality of spray heads, a plurality of filter plates are arranged in the box body, hot air flows can pass through the air pipe and are sprayed to the surface of a colloid from the spray heads through the cooperation of the air pipe and the spray heads, heating of the device for chip dispensing is achieved, and the solidifying speed of the colloid on the surface of the chip is accelerated. Preferably, the middle part of the box body is symmetrically and rotationally connected with a pair of connecting rods, the connecting rods are connected with the box body through torsion springs, clamping plates are fixedly connected to the end parts of the adjacent connecting rods, handles are fixedly connected to the middle parts of the clamping plates, the clamping plates can be driven to be far away from the filter plates by rotating the connecting rods through the cooperation of the connecting rods and the clamping plates, the filter plates can be quickly assembled and disassembled by the device, and the convenience of filter plate replacement and cleaning is improved. The mounting seat is symmetrically and fixedly connected with a spring telescopic rod, the bottom of the spring telescopic rod is fixedly connected with a pressing plate, when the nozzle is used for dispensing the chip, the mounting seat can move towards the chip together with the nozzle, in the process, the pressing plate can be contacted with the chip firstly, then the pressing plate can transmit pressure to the spring telescopic rod to enable the spring telescopic rod to be in a compressed state, the spring telescopic rod can exert elastic force on the pressing plate to enable the pressing plate to squeeze the chip, so that the chip can be subjected to additional squeezing action when dispensing, and meanwhile the nozzle can move along the surface side line of the chip when dispensing, so that the surface of the pressing plate can be sprayed with a wear-resistant coating to reduce abrasion between the pressing plate and the chip due to friction. Preferably, the bottom of the pressing plate is rotationally connected with a plurality of balls, the balls are arranged in an array, and the balls can be contacted with the chip when the pressing plate is contacted with the chip by arranging the balls, and the balls can rotate under the contact action with the chip, so that the friction action between the pressing plate and the chip is reduced, and the abrasion action between the pressing plate and the chip is further reduced. The air bag is in an expanded state, when the pressing plate moves and contacts with the chip surface element, the air bag contacts with the pressing plate earlier than the pressing plate, and the air bag surface has elasticity due to the action of air pre