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CN-224209261-U - Laser processing device and solar cell processing system

CN224209261UCN 224209261 UCN224209261 UCN 224209261UCN-224209261-U

Abstract

The embodiment of the application provides a laser processing device and a solar cell processing system. The laser processing device comprises a laser, a beam shaping part and at least one set of optical components, wherein the laser is used for emitting flat-top light spots, the beam shaping part is positioned on the light emitting side of the laser and comprises a closed opening part, the closed opening part is used for cutting the flat-top light spots emitted by the laser, the at least one set of optical components is positioned on the light emitting side of the beam shaping part and used for forming focusing light spots, and the focusing light spots act on a workpiece to be processed.

Inventors

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Assignees

  • 无锡光导精密科技有限公司

Dates

Publication Date
20260508
Application Date
20250314

Claims (11)

  1. 1. A laser processing apparatus, comprising: The laser (1) is used for emitting flat-top light spots; The laser device comprises a beam shaping part (2) and a laser device (1), wherein the beam shaping part (2) is positioned on the light emitting side of the laser device (1), the beam shaping part (2) comprises a closed opening part (20), the closed opening part (20) comprises four movable parts, the four movable parts are spliced to form the closed opening part (20), the opening shape of the closed opening part (20) is square, the closed opening part (20) is used for cutting flat-top light spots emitted by the laser device (1), a metal sheet is arranged at the edge part of the closed opening part (20), and a cutting edge is formed on the metal sheet and faces the inside of the closed opening part (20); And the optical assembly (3) is positioned on the light emitting side of the beam shaping part (2), and the optical assembly (3) is used for forming a focusing light spot which acts on a workpiece to be processed.
  2. 2. The laser processing device according to claim 1, characterized in that the beam shaping part (2) further comprises an adjusting mechanism (25), the adjusting mechanism (25) being adapted to adjust the opening size of the closed opening (20).
  3. 3. The laser processing device according to claim 1, characterized in that the optical assembly (3) comprises a phase retarder (31) and a beam splitting element (32) arranged in sequence along the transmission direction of the outgoing light spot of the laser (1), the optical assembly (3) further comprising a focusing lens group (33) located in the reflection light path of the beam splitting element (32); The phase delay plate (31) is used for changing the polarization direction of linearly polarized light; The light splitting element (32) is used for splitting one beam of light into two beams of light, and the light splitting element (32) is used for reflecting one of the two beams of light and transmitting the other of the two beams of light; The focusing lens group (33) is used for receiving the light reflected by the light splitting element (32) and focusing the light on a workpiece to be machined.
  4. 4. A laser machining device according to claim 3, characterized in that the phase retarder (31) is a half-wave plate, which is configured to be rotatable.
  5. 5. A laser processing apparatus according to claim 3, wherein the spectroscopic element (32) is provided with a spectroscopic film near the surface of the phase retarder (31).
  6. 6. The laser processing device according to claim 3 or 5, characterized in that the surface of the light-splitting element (32) facing away from the phase retarder (31) is provided with an antireflection film.
  7. 7. A laser processing device according to claim 1 or 3, characterized in that the laser processing device comprises at least two sets of optical components (3), at least two sets of the optical components (3) being arranged in sequence along the transmission direction of the outgoing light spot of the laser (1), and in that the phase retarder (31) in the downstream optical component (3) of the adjacent two sets of the optical components (3) is arranged to receive light transmitted by the light splitting element (32) in the upstream optical component (3).
  8. 8. The laser machining device according to claim 7, characterized in that the laser machining device further comprises a collimating element (4), the collimating element (4) being located between the beam shaping part (2) and the optical assembly (3).
  9. 9. The laser processing device according to claim 8, characterized in that the collimating element (4) is a relay lens group.
  10. 10. The laser processing device according to claim 8 or 9, characterized in that it further comprises a mirror group, which is located between the beam shaping part (2) and the collimating element (4).
  11. 11. A solar cell processing system, characterized in that the solar cell processing system comprises a laser processing device according to any one of claims 1-10.

Description

Laser processing device and solar cell processing system Technical Field The embodiment of the application relates to the technical field of laser processing, in particular to a laser processing device and a solar cell processing system. Background The laser scribing process is involved in the production flow of the thin film solar cell. However, laser light is a high intensity energy process, and the scribing process inevitably induces heat affected zones at the edges of the grooves, accompanied by material accumulation effects (commonly known as craters). How to effectively control and reduce the width of the heat affected zone and simultaneously inhibit the height of the crater has become a technical problem to be solved in the current industry. In view of the foregoing, there is a need to provide a new technical solution to solve the above-mentioned problems. Disclosure of utility model The application aims to provide a novel technical scheme of a laser processing device and a solar cell processing system. In a first aspect, an embodiment of the present application provides a laser processing apparatus. The laser processing device comprises a laser for emitting flat-top light spots; The beam shaping part is positioned on the light emitting side of the laser and comprises a closed opening part, a light emitting part and a light emitting part, wherein the closed opening part is used for cutting flat-top light spots emitted by the laser; And the optical assembly is positioned on the light emitting side of the beam shaping part and is used for forming a focusing light spot, and the focusing light spot acts on a workpiece to be processed. Optionally, the edge of the closed opening is provided with a metal sheet, and the metal sheet is formed with a blade, and the blade faces the inside of the closed opening. Optionally, the beam shaping part further comprises an adjusting mechanism for adjusting the opening size of the closed opening. Optionally, along the transmission direction of the outgoing light spot of the laser, the optical assembly comprises a phase delay plate and a light splitting element which are sequentially arranged, and the optical assembly further comprises a focusing lens group positioned on a reflection light path of the light splitting element; The phase delay sheet is used for changing the polarization direction of polarized light; the light splitting element is used for splitting one beam of light into two beams of light, and the light splitting element is used for reflecting one of the two beams of light and transmitting the other of the two beams of light; the focusing lens group is used for receiving the light reflected by the light splitting element and focusing the light on a workpiece to be machined. Optionally, the phase retarder is a half-wave plate, the half-wave plate being configured to be rotatable. Optionally, a light splitting film is disposed on a surface of the light splitting element near the phase retarder. Optionally, an antireflection film is disposed on a surface of the light splitting element facing away from the phase retarder. Optionally, the laser processing device comprises at least two sets of optical components, wherein the at least two sets of optical components are sequentially arranged along the transmission direction of the emergent light spots of the laser, and the phase delay plate in the optical component positioned at the downstream in the two adjacent sets of optical components is used for receiving the light transmitted by the light splitting element positioned at the upstream in the optical component. Optionally, the laser processing device further comprises a collimating element, which is located between the beam shaping part and the optical component. Optionally, the collimating element is a relay lens group. Optionally, the laser processing device further comprises a mirror group, and the mirror group is located between the beam shaping part and the collimating element. In a second aspect, the embodiment of the application also provides a solar cell processing system. The solar cell processing system comprises the laser processing device according to the first aspect. According to the embodiment of the application, the laser processing device comprises the laser for directly emitting the flat-top light spot, the beam shaping part for cutting the flat-top light spot and the optical component for focusing the cut flat-top light spot. Other features of the present specification and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings. Drawings The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and together with the description, serve to explain the principles of the specification. Fig. 1 is a schematic structural diagram of a laser processing app