CN-224209282-U - Chopping board laser marking device
Abstract
The utility model relates to the technical field of chopping board processing, in particular to a chopping board laser marking device, which comprises a first supporting board and a second supporting board, wherein an L-shaped limiting board for limiting a rectangular chopping board is arranged on the first supporting board, a semi-arc limiting board for limiting a round chopping board is arranged on the second supporting board, and the first supporting board and the second supporting board move to the position right below the laser marking device, so that the chopping board laser marking device can be suitable for limiting the round chopping board and the rectangular chopping board.
Inventors
- JI WEILIANG
Assignees
- 福建华韵竹木有限公司
Dates
- Publication Date
- 20260508
- Application Date
- 20250716
Claims (6)
- 1. A chopping board laser marking device, comprising: a work table; The first support plate is reversely and movably connected to the workbench along the X direction or the X direction, and a plurality of first through holes are formed in the first support plate; the first driving piece is used for driving the first supporting plate to move; the L-shaped limiting plate is locked with the first through hole through a bolt and used for limiting two adjacent edges of the rectangular chopping board; The second support plate is positioned in the X direction of the first support plate and is provided with three second through holes which are arranged in a semi-arc shape; The semi-arc limiting plate is locked with the second through hole through a bolt and used for limiting the outer circumference of the round chopping block; The second driving piece is used for driving the second supporting plate to move; the laser marking device is positioned above the workbench; The first driving piece and the second driving piece are used for driving the first supporting plate and the second supporting plate to be switched between a first state and a second state; The first state, the first support plate is located under the laser marking device, and the second support plate is located on the X-direction reverse side of the first support plate; In the second state, the second support plate is located directly below the laser marking device, and the first support plate is located on one side of the second support plate in the X direction.
- 2. The chopping board laser marking device of claim 1, wherein the plurality of first through holes are in a rectangular array on the first support plate.
- 3. The chopping board laser marking device of claim 1, wherein three second through holes are arranged in a Y-direction array.
- 4. The chopping board laser marking device according to claim 1, wherein the workbench is provided with a limit groove, the first driving piece is a first air cylinder, the second driving piece is a second air cylinder, a guide rail along the X direction is arranged in the limit groove, the cylinder body of the first air cylinder is connected to one side of the workbench in the X direction, the first supporting plate is provided with a first sliding block, the first sliding block is connected with the cylinder body of the first air cylinder, the first sliding block is in sliding connection with the guide rail, the cylinder body of the second air cylinder is connected to the opposite side of the workbench in the X direction, the second supporting plate is provided with a second sliding block, the second sliding block is connected with the cylinder body of the second air cylinder, and the axial directions of the cylinder bodies of the first air cylinder and the second air cylinder are uniform in the X direction.
- 5. The chopping board laser marking device according to claim 4, wherein a third air cylinder is arranged in the limiting groove, the cylinder body axial direction of the third air cylinder is in the vertical direction, a third supporting plate is arranged on a piston rod of the third air cylinder, and the third supporting plate is located under the laser marking device.
- 6. The chopping board laser marking device according to claim 1, wherein the workbench is further provided with a dust collection pipeline.
Description
Chopping board laser marking device Technical Field The utility model relates to the technical field of chopping board processing, in particular to a chopping board laser marking device. Background After the chopping board in the prior art is produced, the information and patterns of some products can be marked through laser marks, the chopping board is divided into round chopping boards and rectangular chopping boards, and the existing equipment can only limit one of the round chopping boards or the rectangular chopping boards when the chopping board is limited by utilizing a laser device, so that a chopping board laser marking device is needed, and the chopping board laser marking device can be suitable for limiting the round chopping boards and the rectangular chopping boards. Disclosure of utility model The utility model aims to solve the technical problem of providing the chopping board laser marking device which can be suitable for limiting round chopping boards and rectangular chopping boards. In order to solve the technical problems, the utility model adopts the technical scheme that the chopping board laser marking device comprises: a work table; The first support plate is reversely and movably connected to the workbench along the X direction or the X direction, and a plurality of first through holes are formed in the first support plate; the first driving piece is used for driving the first supporting plate to move; the L-shaped limiting plate is locked with the first through hole through a bolt and used for limiting two adjacent edges of the rectangular chopping board; The second support plate is positioned in the X direction of the first support plate and is provided with three second through holes which are arranged in a semi-arc shape; The semi-arc limiting plate is locked with the second through hole through a bolt and used for limiting the outer circumference of the round chopping block; The second driving piece is used for driving the second supporting plate to move; the laser marking device is positioned above the workbench; The first driving piece and the second driving piece are used for driving the first supporting plate and the second supporting plate to be switched between a first state and a second state; The first state, the first support plate is located under the laser marking device, and the second support plate is located on the X-direction reverse side of the first support plate; In the second state, the second support plate is located directly below the laser marking device, and the first support plate is located on one side of the second support plate in the X direction. Further, the first through holes are arranged on the first supporting plate in a rectangular array. Further, three second through holes are arranged in the Y-direction array. Further, be provided with the spacing groove on the workstation, first driving piece is first cylinder, the second driving piece is the second cylinder, set up along X to the guide rail in the spacing groove, the cylinder body of first cylinder is connected in the X to one side of workstation, be equipped with first slider in the first backup pad, first slider is connected with the cylinder body of first cylinder, first slider and guide rail sliding connection, the cylinder body of second cylinder is connected in the X to reverse one side of workstation, the second backup pad is equipped with the second slider, the second slider is connected with the cylinder body of second cylinder, the cylinder body axial of first cylinder and second cylinder is even X to. Further, a third air cylinder is arranged in the limiting groove, the cylinder body axial direction of the third air cylinder is in the vertical direction, a third supporting plate is arranged on a piston rod of the third air cylinder, and the third supporting plate is located under the laser marking device. Further, the workbench is also provided with a dust collection pipeline. The utility model has the advantages that when the rectangular chopping board is required to be subjected to laser marking, the first supporting plate is driven to move by the first driving piece, so that the first supporting plate is positioned right below the laser marking device, then the rectangular chopping board is manually placed on the first supporting plate, the rectangular chopping board is limited by the L-shaped limiting plate, when the round chopping board is required to be subjected to laser marking, the second supporting plate is driven to move by the second driving piece, so that the second supporting plate is recognized to be positioned right below the laser marking device, then the round chopping board is manually placed on the second supporting plate, and the semi-arc limiting plate is bonded with the outer circumference of the round chopping board to limit, therefore, compared with the prior art, the limiting of the round chopping board and the rectangular chopping board can be applied by