CN-224209628-U - Silicon core grinding mechanism and silicon core chamfering device
Abstract
The utility model relates to the technical field of silicon core processing, in particular to a silicon core grinding mechanism and a silicon core chamfering device, wherein the silicon core grinding mechanism comprises a first guide rail, a traveling bracket, a mounting bracket and a grinding wheel, and the length direction of the first guide rail is parallel to the placing direction of a silicon core; the travelling support is slidably arranged on the first guide rail, the mounting support is slidably arranged on the travelling support, the moving direction of the mounting support is perpendicular to the length direction of the first guide rail, and the grinding wheel is arranged on the mounting support. According to the utility model, the mounting bracket with the moving direction perpendicular to the length direction of the first guide rail is arranged, so that the grinding wheel can perform chamfering grinding on the whole silicon core along the placing direction of the silicon core along the walking bracket, and simultaneously can perform left-right reciprocating movement relative to the silicon core based on the mounting bracket, the usable area of the grinding wheel grinding surface of the grinding wheel can be fully utilized, the service life of the grinding wheel is ensured, the production cost is reduced, the reduction of machining precision is avoided, and the quality of grinding chamfer is ensured.
Inventors
- ZHAO KEJIAN
- Hou Ziyu
- ZHANG PUHE
- SUN ZHEN
Assignees
- 三谷泰机先进技术研究(无锡)有限公司
Dates
- Publication Date
- 20260508
- Application Date
- 20250520
Claims (12)
- 1. A silicon core grinding mechanism, comprising: the length direction of the first guide rail (1) is parallel to the placing direction of the silicon core; A walking bracket (2) slidably mounted on the first guide rail (1); The mounting bracket (3) is slidably arranged on the walking bracket (2), and the moving direction of the mounting bracket (3) is perpendicular to the length direction of the first guide rail (1); and the grinding wheel (4), and the grinding wheel (4) is arranged on the mounting bracket (3).
- 2. The silicon core grinding mechanism according to claim 1, wherein the first guide rail (1) is a roller guide rail (11), one side of the roller guide rail (11) is provided with a rack (12) parallel to the roller guide rail (11) and a gear (13) matched with the rack (12), and the walking bracket (2) is provided with a sliding block (14) suitable for sliding on the roller guide rail (11) and a first driving module (21) for driving the gear (13) to rotate.
- 3. The silicon core grinding mechanism according to claim 1, wherein the mounting bracket (3) is slidably mounted on the walking bracket (2) through a second guide rail (31), a second driving module (32) is mounted on the walking bracket (2), the second driving module (32) is used for driving the mounting bracket (3) to move along the length direction of the second guide rail (31), and the length direction of the second guide rail (31) is perpendicular to the length direction of the first guide rail (1).
- 4. The silicon core grinding mechanism according to claim 1, characterized in that a distance adjusting module (6) is arranged on the walking bracket (2), the mounting bracket (3) is slidably mounted on the distance adjusting module (6), and the distance adjusting module (6) is used for adjusting the distance between the mounting bracket (3) and the silicon core.
- 5. The silicon core grinding mechanism according to claim 4, wherein the distance adjusting module (6) comprises a lifting support (61), the lifting support (61) comprises a first platform support (611) and a second platform support (612), the first platform support (611) and the second platform support (612) are connected through a guide shaft (613), the guide shaft (613) is movably connected with the walking support (2) through a linear bearing (616), the mounting support (3) is slidably mounted on the second platform support (612), a screw motor (62) is mounted on the first platform support (611), and the screw motor (62) is used for driving the lifting support (61) to move up and down along the guide shaft (613) relative to the walking support (2).
- 6. The silicon core grinding mechanism according to claim 1 or 4, further comprising a grinding wheel motor (7) mounted on the mounting bracket (3), an output shaft (71) of the grinding wheel motor (7) being connected with a rotation shaft (41) of the grinding wheel (4).
- 7. The silicon core grinding mechanism as set forth in claim 6 wherein the grinding wheel motor (7) is mounted on a motor mounting plate (75), the motor mounting plate (75) being disposed on the mounting bracket (3) by a damper (76).
- 8. The silicon core grinding mechanism according to claim 1, further comprising a cooling module (8) mounted on the walking bracket (2) or the mounting bracket (3), wherein the cooling module (8) comprises a water pipe (81) and a spray head (82) connected with the water pipe (81), and the spray head (82) is used for spraying water to cool the grinding wheel (4) and/or the silicon core.
- 9. The silicon core grinding mechanism according to claim 1, further comprising pressing modules (9) located on front and rear sides of the grinding wheel (4), the pressing modules (9) comprising pressing wheels (91) and pressing force adjusting units (92) mounted on the mounting bracket (3), chamfer grooves being formed on the radially outer surfaces of the pressing wheels (91), the pressing wheels (91) being mounted on the pressing force adjusting units (92), the pressing force adjusting units (92) being used for adjusting pressing forces of the pressing wheels (91) relative to the silicon core.
- 10. The silicon core grinding mechanism according to claim 9, wherein the pressing force adjusting unit (92) comprises an installing plate (921) installed on the installing support (3), a movable plate (923) rotatably connected with the installing plate (921) through a rotating shaft (922), a wheel connecting portion (923 a) of the movable plate (923) rotatably installed with the pressing wheel (91), an adjusting portion (923 b) of the movable plate (923) is located on one side of a limiting portion (921 a) of the installing plate (921), a supporting column (924) with one end located on one side of the limiting portion (921 a) away from the adjusting portion (923 b), the other end of the supporting column (924) is limited on one side of the adjusting portion (923 b) away from the limiting portion (921 a) through a limiting block (925), a space suitable for the adjusting portion (923 b) is formed between the limiting portion (921 a) and the limiting block (925), and a limiting spring (926) is arranged on one end of the supporting column (924) and one end of the supporting column (926), and the other end of the supporting column (926) is connected with a threaded nut (926).
- 11. The silicon core chamfering device is characterized by comprising the silicon core grinding mechanism (10) and a silicon core placing frame (20) according to any one of claims 1-10, wherein the silicon core placing frame (20) is used for placing silicon cores, and the length direction of a first guide rail (1) of the silicon core grinding mechanism (10) is parallel to the placing direction of the silicon cores.
- 12. The silicon core chamfering device according to claim 11, further comprising two groups of feeding and discharging components (30) positioned on two sides of the silicon core placing frame (20), wherein the feeding and discharging components (30) comprise a first discharging module (301), the first discharging module (301) comprises a first placing frame (3011) and first silicon core placing blocks (3012) arranged on the first placing frame (3011), and a plurality of first grooves (3012 a) which are formed in the first silicon core placing blocks (3012) and are suitable for placing silicon cores are formed at equal intervals; the second discharging module (302), the second discharging module (302) comprises a second silicon core placing block (3021), a plurality of second grooves (3021 a) which are arranged on the second silicon core placing block (3021) at equal intervals and are suitable for placing silicon cores, channels which are suitable for the silicon cores to pass through are formed in the second grooves (3021 a) and the first grooves (3012 a), the jacking module (303) comprises a jacking bracket (3031) and a jacking cylinder (3032) arranged on the jacking bracket (3031), the jacking cylinder (3032) is used for driving the second discharging module (302) to lift, the traversing module (304) comprises a traversing cylinder (3041), the transverse moving cylinder (3041) is used for driving the jacking bracket (3031) to move along the feeding or discharging direction of the silicon core.
Description
Silicon core grinding mechanism and silicon core chamfering device Technical Field The utility model relates to the technical field of silicon core processing, in particular to a silicon core grinding mechanism and a silicon core chamfering device. Background After the silicon rod is cut into elongated silicon cores, the silicon cores are generally required to be ground and chamfered. At present, the conventional silicon core chamfering device is provided with a grinding wheel in a silicon core grinding mechanism to grind and chamfer the silicon core. When the silicon core B is subjected to single chamfering and grinding chamfering, the silicon core B is mostly fixed, so that the contact position of the grinding wheel A and the silicon core B is mostly concentrated in the central area of the grinding wheel grinding surface C, as shown in figure 1, other areas of the grinding wheel grinding surface C except the central area are difficult to fully utilize, the service life of the grinding wheel A is shortened, the machining precision is reduced, the quality of the grinding chamfer is affected, and in order to ensure the quality of the grinding chamfer, the grinding wheel needs to be replaced frequently, so that the production cost is high. Disclosure of utility model The utility model solves the problems in the related art, and provides a silicon core grinding mechanism and a silicon core chamfering device, which can fully utilize the usable area of a grinding surface of a grinding wheel, ensure the service life of the grinding wheel, reduce the production cost, avoid the reduction of the machining precision and ensure the quality of grinding chamfer. In order to solve the technical problems, the utility model is realized by the following technical scheme: The silicon core grinding mechanism comprises a first guide rail, a walking support, a mounting support and a grinding wheel, wherein the length direction of the first guide rail is parallel to the placing direction of a silicon core, the walking support is slidably mounted on the first guide rail, the mounting support is slidably mounted on the walking support, the moving direction of the mounting support is perpendicular to the length direction of the first guide rail, and the grinding wheel is mounted on the mounting support. According to one embodiment of the utility model, the first guide rail is a roller guide rail, one side of the roller guide rail is provided with a rack parallel to the roller guide rail and a gear matched with the rack, and the walking bracket is provided with a sliding block suitable for sliding on the roller guide rail and a first driving module for driving the gear to rotate. According to one embodiment of the utility model, the mounting bracket is slidably mounted on the walking bracket through a second guide rail, a second driving module is mounted on the walking bracket, the second driving module is used for driving the mounting bracket to move along the length direction of the second guide rail, and the length direction of the second guide rail is perpendicular to the length direction of the first guide rail. According to one embodiment of the utility model, the walking support is provided with a distance adjusting module, the mounting support is slidably mounted on the distance adjusting module, and the distance adjusting module is used for adjusting the distance between the mounting support and the silicon core. According to one embodiment of the utility model, the distance adjusting module comprises a lifting support, a screw motor and a screw motor, wherein the lifting support comprises a first platform support and a second platform support, the first platform support and the second platform support are connected through a guide shaft, the guide shaft is movably connected with the walking support through a linear bearing, the mounting support is slidably mounted on the second platform support, and the screw motor is mounted on the first platform support and is used for driving the lifting support to move up and down along the guide shaft relative to the walking support. According to one embodiment of the utility model, the grinding wheel motor is mounted on the mounting bracket, and an output shaft of the grinding wheel motor is flexibly connected with the rotating shaft of the grinding wheel. According to one embodiment of the utility model, the grinding wheel motor is mounted on a motor mounting plate, and the motor mounting plate is arranged on the mounting bracket through a shock absorber. According to one embodiment of the utility model, the silicon chip grinding machine further comprises a cooling module, wherein the cooling module is arranged on the walking support or the mounting support and comprises a water conveying pipe and a spray head connected with the water conveying pipe, and the spray head is used for spraying water to cool the grinding wheel and/or the silicon chip. According to one embodiment of the u