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CN-224209695-U - Polishing device for wafer processing

CN224209695UCN 224209695 UCN224209695 UCN 224209695UCN-224209695-U

Abstract

The utility model provides a polishing device for wafer processing, which comprises a wafer rotating disc for placing a wafer and a driving mechanism, wherein the driving mechanism comprises a swinging motor unit and a fixing frame, the fixing frame is used for being equipped with a polishing clamp in contact connection with the wafer, a rocker arm is arranged on the swinging motor unit, a limiting rod and a guide rod are arranged on the rocker arm, a locking hole and a guide hole for the limiting rod and the guide rod are formed in one side, away from the polishing clamp, of the fixing frame, the fixing frame is nested in the limiting rod and the guide rod through the locking hole and the guide hole, a locking piece is further arranged in the fixing frame, and the locking piece is propped against the side wall of the limiting rod penetrating through the locking hole. The movable connection adopted between the fixing frame and the rocker arm can realize convenient adjustment of the height of the fixing frame with the help of the supporting nut and the locking piece.

Inventors

  • CHENG PING
  • WANG QIANG
  • Chai fu

Assignees

  • 安徽三晶半导体有限公司

Dates

Publication Date
20260508
Application Date
20250530

Claims (7)

  1. 1. Grinding device for wafer processing, characterized in that includes: The wafer polishing device comprises a wafer rotating disc (101) for placing a wafer and a driving mechanism, wherein the driving mechanism comprises a swinging motor unit (103) and a polishing clamp (102) connected with a fixing frame (200), and the fixing frame (200) is used for being equipped with the wafer in contact connection; The swing motor unit (103) is provided with a rocker arm (300), the rocker arm (300) is provided with a limiting rod (310) and a guide rod (320), one side, far away from the grinding clamp (102), of the fixing frame (200) is provided with a locking hole (201) and a guide hole (202) which are used for limiting the rod (310) and the guide rod (320), and the fixing frame (200) is nested in the limiting rod (310) and the guide rod (320) through the locking hole (201) and the guide hole (202); And a locking piece (220) is further arranged in the fixing frame (200), the locking piece (220) is propped against the side wall of the limiting rod (310) in the penetrating locking hole (201), and when the distance between the fixing frame (200) and the wafer rotating disc (101) needs to be changed, the locking position of the locking piece (220) and the limiting rod (310) is locked by lifting or lowering.
  2. 2. A polishing apparatus for wafer processing according to claim 1, wherein the outer wall of the limiting rod (310) is provided with a screw thread, the limiting rod (310) is further provided with a support nut (230), and when the height of the fixing frame (200) is adjusted, the support nut (230) is rotated to support the end surface of the fixing frame (200) close to the wafer rotating disc (101).
  3. 3. A polishing apparatus for wafer processing according to claim 2, wherein the number of the restricting levers (310) is two, and the restricting levers (310) and the guide levers (320) form a triangular structure.
  4. 4. A polishing apparatus for wafer processing according to claim 3, wherein the locking member (220) comprises a locking bolt (221) and a U-shaped rod (222), a sliding cavity (203) is provided in the fixing frame (200), the U-shaped rod (222) is provided in the sliding cavity (203), a sliding guide groove is provided between the sliding cavity (203) and the locking hole (201), and both ends of the U-shaped rod (222) extend from the sliding guide groove to different locking holes (201).
  5. 5. A polishing apparatus for wafer processing according to claim 4, wherein the sliding chamber (203) is further provided with a screw hole communicating with the outside, and the locking bolt (221) extends from the outside of the fixing frame (200) to the inside of the sliding chamber (203) through the screw hole and abuts against an end of the U-shaped rod (222) away from the locking hole (201).
  6. 6. A polishing apparatus for wafer processing according to claim 5, wherein the front end of the U-shaped bar (222) is provided with a rubber pad (223), and the U-shaped bar (222) is in contact connection with the limiting bar (310) through the rubber pad (223).
  7. 7. A polishing apparatus for wafer processing according to claim 6, wherein the cross section of the restricting lever (310) is of an arcuate configuration, and the cross section of the locking hole (201) is adapted to the cross section of the restricting lever (310).

Description

Polishing device for wafer processing Technical Field The utility model belongs to the technical field of polishing processing, and particularly relates to a polishing device for wafer processing. Background The wafer processing process often needs to polish the processing to the wafer surface, can adopt the grinding and polishing equipment to realize the processing of polishing to the wafer among the prior art, this kind of grinding and polishing equipment mainly by grinding anchor clamps, bear carousel and the fixed bolster of assembly grinding anchor clamps, in order to promote the processing effect, still can adopt rotatory equipment of swaing to swing the operation to the fixed bolster. In the prior art, a fixed support and rotary swinging equipment are connected by adopting a fixed structure, when the height of the fixed support needs to be adjusted in the machining process, the rotary swinging equipment is required to be integrally adjusted generally, the equipment is inconvenient to operate, and the height of the fixed support is not easy to adjust. Disclosure of utility model The utility model provides a polishing device for wafer processing, and aims to solve the problems that when the height of a fixed support is required to be adjusted in the existing processing process, the whole rotation swinging equipment is required to be adjusted, the operation of the equipment is inconvenient, and the adjustment of the height of the fixed support is difficult to realize. The utility model is realized in that a polishing device for wafer processing comprises: The wafer rotating disc is used for placing the wafer, and the driving mechanism comprises a swinging motor unit and a grinding clamp connected to a fixing frame, wherein the fixing frame is used for being equipped with the grinding clamp in contact connection with the wafer; the swing motor unit is provided with a rocker arm, the rocker arm is provided with a limiting rod and a guide rod, one side of the fixing frame, which is far away from the grinding clamp, is provided with a locking hole and a guide hole which are respectively connected with the limiting rod and the guide rod, and the fixing frame is nested in the limiting rod and the guide rod through the locking hole and the guide hole; And a locking piece is further arranged in the fixing frame and is propped against the side wall of the limiting rod penetrating through the locking hole, and when the distance between the fixing frame and the wafer rotating disc needs to be changed, the locking position of the locking piece and the limiting rod is locked by lifting or lowering the locking piece. Preferably, the outer wall of the limiting rod is provided with threads, the limiting rod is further provided with a supporting nut, and when the height of the fixing frame is adjusted, the supporting nut is rotated to enable the fixing frame to be close to the end face of the wafer rotating disc. Preferably, the number of the limiting rods is two, and the limiting rods and the guide rods form a triangular structure. Preferably, the locking piece comprises a locking bolt and a U-shaped rod, a sliding cavity is arranged in the fixing frame, the U-shaped rod is arranged in the sliding cavity, a sliding guide groove is arranged between the sliding cavity and the locking hole, and two ends of the U-shaped rod extend from the sliding guide groove to different locking holes. Preferably, the sliding cavity is further provided with a threaded hole communicated with the outside, and the locking bolt extends from the outside of the fixing frame to the inside of the sliding cavity through the threaded hole and abuts against one end, far away from the locking hole, of the U-shaped rod. Preferably, the front end of the U-shaped rod is provided with a rubber pad, and the U-shaped rod is in contact connection with the limiting rod through the rubber pad. Preferably, the cross section of the limiting rod is of an arch structure, and the cross section of the locking hole is matched with the cross section of the limiting rod. Compared with the prior art, the embodiment of the application has the following main beneficial effects: According to the polishing device for processing the wafer, the fixing frame is movably connected with the rocker arm, locking is completed under the assistance of the supporting nut and the locking piece, when the height of the fixing frame needs to be adjusted, the fixing positions of the fixing frame, the limiting rod and the guide rod can be directly changed without complex adjustment, and therefore the convenient adjustment of the height of the fixing frame is achieved. Drawings Fig. 1 is a schematic structural diagram of a polishing apparatus for wafer processing according to the present utility model. Fig. 2 is a schematic view of a fixing frame and a rocker arm of the polishing device for wafer processing. Fig. 3 is a schematic view of a sliding cavity of a polishing device for wafer proc