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CN-224210235-U - High-precision wafer cutting device with iron ring

CN224210235UCN 224210235 UCN224210235 UCN 224210235UCN-224210235-U

Abstract

The utility model relates to the technical field of wafer processing, in particular to a high-precision wafer cutting device for a wafer with an iron ring. Its technical scheme includes the hoop dish and sets up the mechanism of placing on the hoop dish top, the mechanism of placing is including being fixed in the hoop on hoop dish top, the inner wall of hoop is provided with the brilliant disc, the top of brilliant disc is provided with the wafer, outer wall one side of hoop dish is provided with cutting mechanism, cutting mechanism is including setting up in unable adjustment base on hoop dish one side. The high-precision wafer cutting device with the iron ring can enable the size deviation of wafer cutting to be smaller, effectively reduce the defects of burrs, broken edges and the like at the edge of the wafer, ensure the stability and reliability of the cutting process, adapt to wafers with different shapes, sizes and cutting requirements, improve the universality and applicability of the device and meet diversified production requirements.

Inventors

  • GUO YI
  • ZHOU PENGCHENG

Assignees

  • 争丰半导体科技(苏州)有限公司

Dates

Publication Date
20260508
Application Date
20250520

Claims (7)

  1. 1. The high-precision wafer cutting device with the iron ring comprises an iron ring disc (1) and a placing mechanism arranged at the top end of the iron ring disc (1), and is characterized in that the placing mechanism comprises an iron ring (21) fixed at the top end of the iron ring disc (1), a wafer disc (22) is arranged on the inner wall of the iron ring (21), and a wafer (2) is arranged at the top end of the wafer disc (22); and a cutting mechanism is arranged on one side of the outer wall of the iron ring disc (1).
  2. 2. The high-precision circular cutting device for the wafer with the iron ring according to claim 1, wherein the cutting mechanism comprises a fixed base (3) arranged on one side of the iron ring disc (1), outer wall fixing seats I (4) are fixedly connected to two sides of the top end of the fixed base (3), and a rotating shaft (5) penetrates through the central positions of the two outer wall fixing seats I (4).
  3. 3. The high-precision circular cutting device for the wafer with the iron ring according to claim 2, wherein the outer wall of the rotating shaft (5) is rotationally connected with a rotating arm (6) through a first bearing port (12), the rotating arm (6) is positioned between two first outer wall fixing seats (4), two outer fixing seats (7) are rotationally connected to two sides of the top end of the rotating arm (6), and connecting arms (8) are rotationally connected to the inner walls of the two outer fixing seats (7) through second bearing ports (13).
  4. 4. The high-precision circular cutting device for the wafer with the iron ring according to claim 3, wherein one end of the connecting arm (8) is fixedly connected with a connecting frame rod (9), and one end, far away from the connecting arm (8), of the connecting frame rod (9) is fixedly connected with a cutter connecting arm (10).
  5. 5. The high-precision circular cutting device for the wafer with the iron ring according to claim 4, wherein a rotating shaft seat (11) is rotatably connected to the inner wall of one end of the cutter connecting arm (10) far away from the connecting frame rod (9), and a cutter seat (14) is fixedly connected to the bottom end of the rotating shaft seat (11).
  6. 6. The high-precision circular cutting device for the wafer with the iron ring according to claim 5, wherein a bottom connecting block (15) is fixedly connected to the bottom end of the cutter seat (14), and a rotating seat (17) is rotatably connected to the bottom end of the bottom connecting block (15) through a rotating joint (16).
  7. 7. The high-precision circular cutting device for the wafer with the iron ring according to claim 6, wherein one end of the bottom end of the rotating seat (17) is fixedly connected with a cutter connecting rod (18), the bottom end of the cutter connecting rod (18) is rotatably connected with an adjusting knob (19), and the bottom end of the adjusting knob (19) is fixedly connected with a cutter (20).

Description

High-precision wafer cutting device with iron ring Technical Field The utility model relates to the technical field of wafer processing, in particular to a high-precision wafer cutting device for a wafer with an iron ring. Background At the moment of rapid development of the semiconductor industry, wafers are used as core raw materials for manufacturing integrated circuits, and the processing precision of the wafers directly influences the performance and the yield of chips. Along with the continuous improvement of the chip integration level, the precision requirement on wafer cutting is higher and higher, after the existing wafer film pasting is finished, the cutter handle is manually operated to perform the wafer cutting action, the blade is always tightly abutted against the edge of the wafer in the process, the wafer is easy to damage, the strength is difficult to adjust, the wafer cannot be corresponding to a very thin wafer, the adjustment of the cutter position is required to be manually completed during the size switching, the operation is complex, the efficiency is low, the bad products are easy to be caused, and the wafer cannot be corresponding to the thin wafer, so the high-precision wafer cutting device with the iron ring is provided. Disclosure of utility model The utility model aims to solve the problems that in the background technology, the operation is complex, the efficiency is low, the product is poor, and the thin wafer cannot be corresponded, and provides a high-precision wafer cutting device for a wafer with an iron ring. The high-precision wafer cutting device comprises an iron ring disc and a placing mechanism arranged at the top end of the iron ring disc, wherein the placing mechanism comprises an iron ring fixed at the top end of the iron ring disc, a wafer disc is arranged on the inner wall of the iron ring, and a wafer is arranged at the top end of the wafer disc; and a cutting mechanism is arranged on one side of the outer wall of the iron ring disc. Optionally, the cutting mechanism is including setting up in unable adjustment base of hoop dish one side, unable adjustment base's top both sides fixedly connected with outer wall fixing base one, two outer wall fixing base one central point puts and runs through there is the axis of rotation. Optionally, the outer wall of axis of rotation is connected with the rotor arm through bearing mouth one rotation, the rotor arm is located two between the outer wall fixing base one, the top both sides of rotor arm all rotate and are connected with two outside fixing bases two, two the inner wall of outside fixing base two is connected with the linking arm through bearing mouth two rotations. Optionally, one end fixedly connected with link of link, the one end fixedly connected with cutter link that the link kept away from the link. Optionally, the cutter linking arm is kept away from the one end inner wall rotation of connecting rod and is connected with the pivot seat, the bottom fixedly connected with cutter holder of pivot seat. Optionally, the bottom fixedly connected with bottom connecting block of cutter seat, the bottom of bottom connecting block is connected with the rotation seat through rotating the festival rotation. Optionally, the bottom one end fixedly connected with cutter connecting rod of seat rotates, the bottom rotation of cutter connecting rod is connected with adjust knob, adjust knob's bottom fixedly connected with cutter. Compared with the prior art, the device has the beneficial effects that through the accurate positioning of the placement mechanism on the wafer with the iron ring and the accurate adjustment of each part in the cutting mechanism, the size deviation of the wafer cutting is smaller, the defects of burrs, broken edges and the like at the edge of the wafer are effectively reduced, the iron ring and the wafer disc can be stably clamped and positioned by virtue of the design, the stability and the reliability of the cutting process are ensured, the rotating arm, the connecting arm, the rotating joint, the adjusting knob and other parts in the cutting mechanism are arranged, the cutting tool can be flexibly adjusted in position and angle in a three-dimensional space, the device can adapt to wafers with different shapes, sizes and cutting requirements, the universality and the applicability of the device are improved, and the diversified production requirements are met. Drawings FIG. 1 is a schematic perspective view of a high-precision circular cutting device for wafers with iron rings; FIG. 2 is a schematic diagram of a multi-angle structure of a high-precision circular cutting device for wafers with iron rings; FIG. 3 is a schematic diagram of a connection structure of a cutting mechanism of a high-precision wafer cutting device with a ring iron; fig. 4 is an enlarged schematic view of the structure at a in fig. 3. Reference numeral 1, an iron ring disc; 2, a wafer, 3, a fixed base, 4, a first outer wal