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CN-224210376-U - Semiconductor carrier plate injection molding woolen trimming device

CN224210376UCN 224210376 UCN224210376 UCN 224210376UCN-224210376-U

Abstract

The utility model discloses an injection molding woolen trimming device for a semiconductor carrier plate, which belongs to the technical field of semiconductor support production and particularly comprises a base, wherein a carrier plate supporting table is arranged on the base, a pressing component is arranged at the position, close to the back surface, of the top of the base, and a carrier plate pressing positioning cutting component which is linked with the pressing component is arranged in the middle of the pressing component. The utility model adopts the supporting and pressing positioning structure which is completely matched with the semiconductor carrier plate structure as the basis, and applies omnibearing positioning and fixing to the semiconductor carrier plate blank main body to be processed, and by means of the lever type labor-saving pressing mechanism and the cutter and the tension spring resetting design, the utility model can rapidly remove the residual waste material at the edge of the semiconductor carrier plate blank main body, has the precision far higher than that of manual cutting, can effectively improve the yield of product processing and can effectively improve the product processing efficiency.

Inventors

  • KE CHANGXING
  • GUO ZIHONG

Assignees

  • 武汉晟烽塑模有限公司

Dates

Publication Date
20260508
Application Date
20250609

Claims (8)

  1. 1. The injection molding woolen trimming device for the semiconductor carrier plate is characterized by comprising a base (1), wherein a carrier plate supporting table (2) for bearing a semiconductor carrier plate woolen main body (3) is arranged on the base (1), a pressing component is arranged at the position, close to the back, of the top of the base (1), a carrier plate pressing positioning cutting component which is linked with the pressing component is arranged in the middle of the pressing component, and the carrier plate pressing positioning cutting component is positioned at the top of the carrier plate supporting table (2) and aligned with the upper position and the lower position of the carrier plate supporting table (2); The carrier plate downward pressing positioning cutting assembly comprises a downward pressing support (9), a connecting frame (11), a carrier plate positioning pressing plate (13) and a cutter (12), wherein the connecting frame (11) is assembled and connected with the downward pressing support (9) through a limiting support (10) and a cutting buffer assembly (14), the cutter (12) is fixedly connected with the downward pressing support (9) through bolts, and the carrier plate positioning pressing plate (13) is fixed at the bottom of the connecting frame (11) through bolts; the top of the carrier plate supporting table (2) is provided with a carrier plate positioning adapting groove (201) corresponding to the protruding part of the bottom of the semiconductor carrier plate blank main body (3), and the bottom of the carrier plate positioning pressing plate (13) is provided with a carrier plate positioning pressing block (131) adapting to the recessed part of the top of the semiconductor carrier plate blank main body (3) in an integrated manner.
  2. 2. The semiconductor carrier injection molding woolen trimming device according to claim 1, wherein the carrier support table (2) and the carrier positioning pressing plate (13) are two groups, the two groups of carrier support tables (2) and the carrier positioning pressing plate (13) are oppositely arranged, each group of carrier support table (2) and the carrier positioning pressing plate (13) are used for fixing a semiconductor carrier woolen main body (3), and a 1:1 matching degree design is adopted between the top of the carrier support table (2) and the bottom structure of the carrier positioning pressing plate (13) and the top and bottom structural design of the semiconductor carrier woolen main body (3).
  3. 3. The semiconductor carrier plate injection molding woolen trimming device according to claim 1 is characterized in that the pressing component comprises a supporting arm (4) vertically fixed on a base (1), a guide sliding rail (5) vertically designed is fixed on the supporting arm (4), a pressing lever (6) is hinged to the top end of the supporting arm (4), a tension spring (7) is connected between the tail end of the pressing lever (6) and a hoop on the back of the guide sliding rail (5), and a pressing arm (8) movably connected with the top of a pressing bracket (9) is hinged to the bottom of the pressing lever (6) at a position close to the supporting arm (4).
  4. 4. The semiconductor carrier plate injection molding woolen trimming device according to claim 1, wherein a guide arm (901) which is in sliding fit with the guide sliding rail (5) is fixed at the middle position of one side of the pressing support (9) close to the supporting arm (4), a connecting seat (902) which is used for being movably hinged with the bottom end of the pressing arm (8) is also fixed at the middle position of the top of the pressing support (9), a slotted hole design which is arranged in a long-strip-shaped inclined manner is adopted for a mounting hole which is used for being movably hinged with the bottom end of the pressing arm (8) in the middle of the connecting seat (902), and a material returning assembly (15) is also installed at the bottom of the pressing support (9) corresponding to the positions of the two groups of carrier plate supporting tables (2).
  5. 5. The trimming device for injection molding burrs of the semiconductor carrier plate according to claim 1, wherein the connecting frames (11) are provided with two groups, the top of each group of connecting frames (11) is vertically fixed with a plurality of limiting brackets (10), the top of each limiting bracket (10) is vertically and angularly slidably penetrated through a positioning hole reserved on the pressing bracket (9), each group of connecting frames (11) is provided with three groups of cutting buffer assemblies (14) which are distributed in a triangular shape, each group of cutting buffer assemblies (14) comprises a guide post (141) vertically fixed with the bottom of each connecting frame (11), and a buffer spring (142) sleeved outside each guide post (141), and the top of each guide post (141) is slidably penetrated through the pressing bracket (9) and then is provided with a nut for preventing falling.
  6. 6. The trimming device for injection molding burrs of semiconductor carrier plate according to claim 1, wherein the cutter (12) is positioned between two groups of carrier plate supporting tables (2), and the blade edge of the cutter (12) is aligned with one side to be trimmed on two semiconductor carrier plate burrs main bodies (3).
  7. 7. The trimming device for the injection molding burrs of the semiconductor carrier plate according to claim 1, wherein a material returning avoidance hole (132) for a material returning assembly (15) to pass through is formed in the middle of the carrier plate positioning pressing plate (13) corresponding to the flat part of the semiconductor carrier plate burr main body (3), and carrier plate positioning piles (133) are integrally formed at the bottom side edge of the carrier plate positioning pressing plate (13) corresponding to the edge position of the semiconductor carrier plate burr main body (3).
  8. 8. The semiconductor carrier plate injection molding woolen trimming device according to claim 4, wherein the material returning assembly (15) comprises a material ejecting rod (151), an adjusting nut is screwed after the top of the material ejecting rod (151) penetrates through the pressing support (9) in a sliding mode, a material pressing disc is fixed at the bottom end of the material ejecting rod (151), and a material ejecting spring (152) sleeved outside the material ejecting rod (151) is arranged at the top of the material pressing disc and the pressing support (9) in a supporting mode.

Description

Semiconductor carrier plate injection molding woolen trimming device Technical Field The utility model belongs to the technical field of semiconductor support production, and particularly relates to an injection molding woolen trimming device for a semiconductor carrier plate. Background In the structural design of electronic products, the semiconductor support mainly fixes semiconductor devices (such as transistors, diodes, integrated circuits and the like) on a shell or a circuit board, and provides physical support for each electronic element so as to ensure the stability and reliability of the electrical connection of the electronic element. At present, a dual-cavity injection molding process (namely, one-time injection molding can form two products in a mold) is mostly adopted in the production process of the semiconductor support, and in the process design of the mold for completing injection molding, although the edge of the products can be relatively smooth, residual waste materials formed by a shared injection molding channel between the two products are manually removed, so that the two products are separated. Therefore, we propose a semiconductor carrier injection molding burr trimming device. Disclosure of utility model The utility model aims to provide an injection molding woolen trimming device for a semiconductor carrier plate, which is used for solving the problems in the prior art. In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a semiconductor carrier plate burr trimming device that moulds plastics, includes the base, be equipped with the carrier plate brace table that is used for bearing semiconductor carrier plate burr main part on the base, the position that the base top is close to the back is equipped with pushes down the subassembly, and push down the mid-mounting of subassembly have one with push down the carrier plate of subassembly linkage push down location cut the subassembly, wherein, whole push down the subassembly adopt have resilience reset function laborsaving lever mechanism, utilize push down the subassembly and drive the carrier plate and push down location cut the subassembly and move down, carry out the trimming operation that advances the location back cut to the semiconductor carrier plate of treating processing. Further, in order to improve cutting precision and product processing yield, the carrier plate pressing, positioning and cutting assembly is positioned at the top of the carrier plate supporting table and is aligned with the upper position and the lower position of the carrier plate supporting table, meanwhile, the carrier plate pressing, positioning and cutting assembly specifically comprises a pressing support, a connecting frame, a carrier plate positioning pressing plate and a cutting knife, the connecting frame and the pressing support are assembled and connected through a limiting support and a cutting buffer assembly, the carrier plate positioning pressing plate is fixed at the bottom of the connecting frame through bolts, the cutting knife is fixedly connected with the pressing support through bolts, the cutting knife is positioned between two groups of carrier plate supporting tables, and the knife edge of the cutting knife is aligned with one side to be trimmed on two semiconductor carrier plate blank main bodies. The connecting frame has two sets of, and the top of every group connecting frame is all perpendicular to be fixed with a plurality of spacing supports, the top of spacing support is perpendicular angle slip and runs through the locating hole of reserving on the support that pushes down, every group all be equipped with three sets of cutting buffer components that are triangle-shaped and distribute on the connecting frame, every group cuts buffer components and all includes a guide post that is perpendicular fixed with the connecting frame bottom to and the buffer spring of cover outside the guide post, install the nut that anticreep was used after the top slip of guide post runs through the support that pushes down. The connecting frame is connected with the pressing support through the cutting buffer assembly, and the upper elastic displacement effect and the lower elastic displacement effect are achieved on the premise that the connecting frame is not separated from the pressing support by utilizing the structural design of the cutting buffer assembly and the limit support. It should be noted that, in order to realize the processing sequence of pressing before cutting of the semiconductor carrier plate blank main body, improve the stability of cutting the deburring, its carrier plate location clamp plate highly is lower than the blade position of cut-off knife bottom for the support that pushes down in-process carrier plate location clamp plate contacts semiconductor carrier plate blank main body upper portion surface first, and cooperate the carrier pla