CN-224210533-U - Bending device and bending equipment

CN224210533UCN 224210533 UCN224210533 UCN 224210533UCN-224210533-U

Abstract

The application relates to the technical field of batteries, discloses a bending device and bending equipment, the bending device is suitable for bending the flexible circuit board to a preset angle and comprises a first die body and a second die body. The first die body is provided with a first face and a second face which are intersected, and the first face is suitable for propping against the main body section of the flexible circuit board. The second mold body is movable between a first position and a second position, the first mold body being provided with a third face. Under the condition that the flexible circuit board is propped against the first surface and the second die body is located at the first position, the second die body is located at one side of the flexible circuit board, which is away from the first die body, and under the condition that the second die body moves to the second position, the second die body pushes the bending section of the flexible circuit board to bend, two sides of the bending section are propped against the second surface and the third surface respectively, and the included angle between the first surface and the second surface is smaller than the preset angle. According to the application, the flexible circuit board is subjected to the folding treatment, so that the phenomenon that the actual forming angle deviates from a preset value after the flexible circuit board is folded is avoided.

Inventors

LI XIN
WANG CHANGKE
Chen Jinjue
XU YONGJUN
TAN XIANG
LIU KUAN

Assignees

欣旺达电子股份有限公司

Dates

Publication Date: 20260508
Application Date: 20250429

Claims (10)

1. A bending device adapted to bend a flexible circuit board to a predetermined angle, comprising: -a first mould body (1) provided with intersecting first (101) and second (102) faces, said first face (101) being adapted to abut against a main body section of said flexible circuit board; A second mould body (2) movable between a first position and a second position, the first mould body (1) being provided with a third face (201); Under the condition that the flexible circuit board is propped against the first surface (101) and the second die body (2) is located at a first position, the second die body (2) is located on one side, deviating from the first die body (1), of the flexible circuit board, under the condition that the second die body (2) moves to the second position, the second die body (2) pushes a bending section of the flexible circuit board to bend, and two sides of the bending section are propped against the second surface (102) and the third surface (201) respectively, and an included angle between the first surface (101) and the second surface (102) is smaller than the preset angle.
2. Bending device according to claim 1, wherein the second mould body (2) is further provided with a fourth face (202), the fourth face (202) intersecting the third face (201), and wherein the two sides of the body section abut the first face (101) and the fourth face (202) respectively, when the second mould body (2) is moved to the second position.
3. The bending device of claim 1, further comprising: The abutting piece (3) can move between a third position and a fourth position, the abutting piece (3) is located on one side, away from the first die body (1), of the first face (101) when the abutting piece (3) is located at the third position, the abutting piece (3) is located on one side, away from the first die body (1), of the second face (102) when the abutting piece (3) is located at the fourth position, and the bending section is located between the third position and the fourth position when the first face (101) is suitable for being abutted with the main body section.
4. A bending device according to claim 3, wherein the abutment member (3) is provided in a cylindrical configuration, the abutment member (3) being rotatable in its circumferential direction, the circumferential surface of the abutment member (3) being adapted to abut the bending section in the case of the abutment member (3) being in the fourth position.
5. The bending device of claim 4, further comprising: the connecting piece (4) is rotationally connected with one end of the abutting piece (3) along the axial direction; the sliding block (5) is connected with the connecting piece (4); The sliding rail (6) is in sliding fit with the sliding block (5), the sliding block (5) slides along the extending direction of the sliding rail (6), and the directions from the third position to the fourth position are parallel to the extending direction of the sliding rail (6); The limiting block (7) is arranged on one side of the sliding rail (6) away from the sliding block (5) along the extending direction of the sliding rail (6); And one end of the elastic component is connected with the connecting piece (4), and the other end of the elastic component is connected with the limiting block (7), so that the connecting piece (4) has a tendency to move from the third position to the fourth position.
6. The bending device of claim 5, wherein the resilient assembly comprises: The rod body (8) is connected with the limiting block (7) along one axial end of the rod body, the connecting piece (4) is provided with a through hole, and the other axial end of the rod body (8) penetrates through the through hole and is in sliding contact with the inner wall of the through hole; The elastic piece (9) is sleeved on the rod body (8), the first end of the elastic piece (9) abuts against the connecting piece (4), and the second end of the elastic piece (9) abuts against the limiting block (7).
7. The bending device of claim 5, further comprising: The driving end of the first driving assembly (10) is connected with the sliding rail (6), and the first driving assembly (10) drives the abutting piece (3) to move along the direction from the third position to the fourth position.
8. Bending device according to claim 7, wherein the second mould body (2) is connected to the connecting piece (4) and the first drive assembly (10) drives the second mould body (2) in the direction from the first position to the second position.
9. The bending device of claim 1, further comprising: The fixing piece (11) is suitable for propping against the main body section, the fixing piece (11) and the first die body (1) are respectively positioned at two opposite sides of the main body section, and the fixing piece (11) and the first die body (1) can move relatively or reversely.
10. A bending apparatus, comprising: a turntable (12) rotating along its circumference, said turntable (12) being adapted to secure a flexible circuit board; Bending device according to any one of claims 1 to 9, provided with a plurality of said bending devices being arranged at intervals in the rotational path of the turntable (12).

Description

Bending device and bending equipment Technical Field The application relates to the technical field of batteries, in particular to a bending device and bending equipment. Background The flexible circuit board (Flexible Printed Circuit, FPC) is used as a core component for realizing high-density interconnection in modern electronic equipment, and is widely applied to the fields of smart phones, wearable equipment, precise electronic modules and the like. The bending process in the traditional battery industry is mainly used for two-dimensional plane layout of the FPC, and the flexible board is adapted to a specific space structure through mechanical bending. Along with the development of miniaturization and multifunction of electronic products, the demands on three-dimensional layout of FPC are increasingly increased, and the precision and reliability of the bending process become key technical links for guaranteeing the circuit performance and the equipment stability. In the prior art, bending processing of a flexible circuit board mainly depends on single bending process equipment. Such devices typically employ mechanical drive structures (e.g., cylinders or servo motor drives) that cooperate with a basic control system to achieve unidirectional, single-angle planar bending operations. The bending angle and the positioning precision are controlled through a preset program, so that the bent FPC is ensured to meet basic requirements on conductivity and mechanical strength. The equipment successfully realizes the requirement of simple two-dimensional layout in early electronic products, improves the processing consistency through the optimization of technological parameters, and lays a foundation for industry development. However, due to the elastic characteristics of the FPC material, an angle rebound phenomenon is generally present after bending, resulting in an actual molding angle deviating from a preset value. For example, when bending by 90 ° is required, the angle after rebound may be reduced to 85 ° or less, which affects the assembly accuracy and circuit contact reliability. The traditional process depends on empirical compensation or secondary correction, so that the efficiency is low, high-precision control is difficult to realize, and the yield is easy to be reduced particularly in a miniaturized and high-complexity three-dimensional structure. Disclosure of utility model The application provides a bending device and bending equipment, which are used for solving the problem that an actual forming angle deviates from a preset value due to the phenomenon of angle rebound after a flexible circuit board is bent. In a first aspect, the present application provides a bending device adapted to bend a flexible circuit board to a predetermined angle, including a first die body and a second die body. The first die body is provided with a first face and a second face which are intersected, and the first face is suitable for propping against the main body section of the flexible circuit board. The second mold body is movable between a first position and a second position, the first mold body being provided with a third face. The flexible circuit board is propped against the first surface and the second die body is located at a first position, the second die body is located at one side of the flexible circuit board, which is away from the first die body, the second die body pushes the bending section of the flexible circuit board to bend under the condition that the second die body moves to the second position, two sides of the bending section are propped against the second surface and the third surface respectively, and an included angle between the first surface and the second surface is smaller than the preset angle. The flexible circuit board has the beneficial effects that the included angle between the first surface and the second surface of the first die body is smaller than the preset angle, and the elastic rebound compensation quantity is actively reserved in the bending process by utilizing the elastic rebound characteristic of the flexible circuit board. When the second die body pushes the bending section to the second position, the bending section is constrained by the die surfaces at two sides, the actual angle can accurately reach a preset value after rebound, the forming precision is obviously improved, and the complicated process of secondary correction in the traditional process is avoided. In an alternative embodiment, the second mould body is further provided with a fourth face intersecting the third face, and when the second mould body is moved to the second position, both sides of the body section are respectively abutted against the first face and the fourth face. The flexible circuit board has the beneficial effects that the fourth surface of the second die body and the first surface of the first die body form double-side clamping on the main body section, so that the displacement of the