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CN-224210763-U - SMT solder paste printing device

CN224210763UCN 224210763 UCN224210763 UCN 224210763UCN-224210763-U

Abstract

The utility model discloses an SMT solder paste printing device, which belongs to the technical field of SMT and comprises a supporting seat, a reciprocating carrier, a carrier driving mechanism, a transverse driving mechanism, a vertical driving mechanism and a solder paste printing structure, wherein the reciprocating carrier is movably arranged on the supporting seat, the carrier driving mechanism is arranged below the supporting seat and is in driving connection with the reciprocating carrier, the transverse driving mechanism is adjacent to the reciprocating carrier and is arranged on the supporting seat, the vertical driving mechanism is movably arranged on the side face of the transverse driving mechanism and is in driving connection with the vertical driving mechanism, the solder paste printing structure is movably arranged above the reciprocating carrier, and the vertical driving mechanism is in driving connection with the solder paste printing structure. The utility model discloses an SMT solder paste printing device which solves the technical problem of how to improve solder paste printing efficiency.

Inventors

  • WU ZHIXIANG
  • SHU WEIBIN
  • WANG WENFEI

Assignees

  • 惠州西文思技术股份有限公司

Dates

Publication Date
20260508
Application Date
20250630

Claims (10)

  1. 1. A SMT solder paste printing device is characterized by comprising a supporting seat (1), a reciprocating carrier (2), a carrier driving mechanism (3), a transverse driving mechanism (4), a vertical driving mechanism (5) and a solder paste printing structure (6), wherein the reciprocating carrier (2) is movably arranged on the supporting seat (1), the carrier driving mechanism (3) is arranged below the supporting seat (1), the carrier driving mechanism (3) is in driving connection with the reciprocating carrier (2), the transverse driving mechanism (4) is adjacent to the reciprocating carrier (2) and is arranged on the supporting seat (1), the vertical driving mechanism (5) is movably arranged on the side face of the transverse driving mechanism (4), the transverse driving mechanism (4) is in driving connection with the vertical driving mechanism (5), and the solder paste printing structure (6) is movably arranged above the reciprocating carrier (2) and is in driving connection with the solder paste printing structure (6).
  2. 2. The SMT solder paste printing device according to claim 1 is characterized in that the reciprocating carrier (2) is provided with a carrier base (201) and a plurality of limiting jigs (202), and the limiting jigs (202) are uniformly arranged on the carrier base (201).
  3. 3. The SMT solder paste printing apparatus as set forth in claim 2, wherein the carrier driving mechanism (3) comprises a carrier driving cylinder (301), a carrier driving telescopic piston rod (302), a carrier connecting block (303), a carrier connecting seat (304), a carrier guide rail (305) and a plurality of carrier reciprocating sliding blocks (306).
  4. 4. The SMT solder paste printing device according to claim 3, wherein the carrier driving cylinder (301) is disposed at the bottom of the supporting seat (1), the carrier driving cylinder (301) is in driving connection with the carrier driving telescopic piston rod (302), one end of the carrier driving telescopic piston rod (302) is connected with the carrier connecting block (303), the carrier connecting block (303) is respectively connected with the carrier driving telescopic piston rod (302) and the carrier connecting seat (304), the carrier connecting seat (304) is connected below the carrier base (201), two carrier guide rails (305) are relatively parallel disposed on the supporting seat (1), a plurality of carrier reciprocating sliding blocks (306) are movably connected on each carrier guide rail (305), and each carrier reciprocating sliding block (306) is respectively connected with the bottom of the carrier connecting seat (304).
  5. 5. The SMT solder paste printing apparatus as set forth in claim 4, wherein the transverse driving mechanism (4) comprises a portal frame (401), a transverse driving bracket (402), a transverse driving motor (403), a transverse coupling (404), a transverse driving screw (405), a transverse screw bearing (406), a transverse screw moving block (407) and a transverse guide frame (408).
  6. 6. The SMT solder paste printing device according to claim 5, wherein the portal frame (401) is arranged on the supporting seat (1), the lateral surface of the lateral driving support (402) is provided with the lateral driving motor (403) arranged on one end side of the lateral driving support (402), the lateral coupling (404) is respectively connected with the lateral driving motor (403) and the lateral driving screw (405), the lateral driving screw (405) is movably arranged in two lateral screw bearings (406), the two lateral screw bearings (406) are oppositely arranged on two sides of the lateral driving support (402), the lateral screw moving block (407) is movably connected on the lateral driving screw (405), the lateral screw moving block (407) is movably connected on the lateral guiding frame (408), and the lateral guiding frame (408) is arranged on the lateral surface of the lateral driving support (402).
  7. 7. The SMT solder paste printing apparatus as set forth in claim 6, wherein the vertical driving mechanism (5) comprises a vertical connecting frame (501), a vertical driving cylinder (502), a vertical telescopic piston rod (503) and a vertical moving block (504).
  8. 8. The SMT solder paste printing device according to claim 7, wherein the vertical connecting frame (501) is connected to the side surface of the transverse screw moving block (407), the vertical driving cylinder (502) is arranged on the side surface of the vertical connecting frame (501), the vertical driving cylinder (502) is in driving connection with the vertical telescopic piston rod (503), and the vertical moving block (504) is arranged at one end part of the vertical telescopic piston rod (503).
  9. 9. An SMT solder paste printing apparatus as claimed in claim 8, wherein the solder paste printing structure (6) is provided with a solder paste connecting frame (601), a solder paste bin (602), a solder paste guide nozzle (603) and a solder paste scraper (604).
  10. 10. The SMT solder paste printing device of claim 9, wherein the solder paste connecting frame (601) is connected with the vertical moving block (504), the solder paste storage bin (602) is arranged on the side surface of the solder paste connecting frame (601), the solder paste guide nozzle (603) is arranged at the bottom of the solder paste storage bin (602), and the solder paste scraping plate (604) is connected below the solder paste guide nozzle (603).

Description

SMT solder paste printing device Technical Field The utility model relates to the technical field of SMT, in particular to an SMT solder paste printing device. Background The SMT, surface mounting technology, is an automatic assembly technology for directly mounting electronic components on a printed circuit board, namely the surface of a PCB, and the core of the SMT comprises three process links of solder paste printing, component mounting and reflow soldering. The technology realizes high-speed accurate positioning of the miniature components through the high-precision chip mounter, utilizes reflow soldering to melt solder paste to form reliable electrical connection, has the advantages of high assembly density, high production efficiency, low cost and the like, becomes a mainstream technology for manufacturing modern electronic products, and is widely applied to the fields of consumer electronics, communication equipment, automobile electronics and the like. The solder paste printing is the first key process of SMT, and is characterized in that a precise amount of solder paste is deposited on a bonding pad of a PCB through a steel mesh, and the specific process is that the fixed PCB is precisely aligned with the steel mesh with holes corresponding to the bonding pad, so that a scraper moves on the surface of the steel mesh to force the solder paste to be uniformly coated on the bonding pad of the PCB through the mesh, and then the steel mesh is separated from the PCB to finish demoulding. The key control elements of the process are printing precision and solder paste thickness, which are generally controlled to be 100-150 mu m and consistent, and the quality and reliability of subsequent element mounting and reflow soldering are directly affected. Based on the above, the Chinese patent document with the publication number of CN107351523A discloses a circuit board solder paste printer, which comprises a printer body, the printer body comprises a bottom plate and a printing mechanism, a bearing plate is fixedly arranged on the top surface of the bottom plate, a workbench is arranged on the top surface of the bearing plate, fixing plates are arranged on two sides of the top surface of the workbench, the workbench is fixedly connected with the bearing plate through the fixing plates, a plurality of through holes are formed in the top surface of the workbench, ejector pins are arranged in the through holes, and the ejector pins and limiting seats are arranged in the through holes in the workbench through the arrangement of the ejector pins and the limiting bolts on the limiting seats, so that the circuit board to be printed is convenient and accurate to position, and the accuracy of repeated operation is ensured. However, the circuit board solder paste printer disclosed in the prior art has the technical problems of high operation difficulty and low operation efficiency. Specifically, the solder paste printing machine disclosed in the prior art mainly adopts a mode of manually operating a scraping plate to brush solder paste, the mode is difficult to accurately control the tin scraping amount, repeated operation is required to be performed on each circuit board manually, and the method is difficult to be suitable for a batched solder paste printing procedure. Disclosure of utility model Accordingly, it is necessary to provide an SMT solder paste printing apparatus for solving the technical problem of improving the solder paste printing efficiency. The SMT solder paste printing device comprises a supporting seat, a reciprocating carrier, a carrier driving mechanism, a transverse driving mechanism, a vertical driving mechanism and a solder paste printing structure, wherein the reciprocating carrier is movably arranged on the supporting seat, the carrier driving mechanism is arranged below the supporting seat and is in driving connection with the reciprocating carrier, the transverse driving mechanism is arranged on the supporting seat adjacent to the reciprocating carrier, the vertical driving mechanism is movably arranged on the side face of the transverse driving mechanism and is in driving connection with the vertical driving mechanism, the solder paste printing structure is movably arranged above the reciprocating carrier, and the vertical driving mechanism is in driving connection with the solder paste printing structure. Further, the reciprocating carrier is provided with a carrier base and a plurality of limiting jigs, and the limiting jigs are uniformly arranged on the carrier base. Further, the carrier driving mechanism is provided with a carrier driving cylinder, a carrier driving telescopic piston rod, a carrier connecting block, a carrier connecting seat, a carrier guide rail and a plurality of carrier reciprocating sliding blocks. The vehicle driving cylinder is arranged at the bottom of the supporting seat and is in driving connection with the vehicle driving telescopic piston rod, one end of the