CN-224210862-U - Thermal management control system

CN224210862UCN 224210862 UCN224210862 UCN 224210862UCN-224210862-U

Abstract

The utility model relates to the field of thermal management control, in particular to a thermal management control system. The utility model provides a thermal management control system with an integrated design, wherein the design of a distributed controller is abandoned in terms of cost, the use of a plurality of thermal management controller shells is reduced, the shell cost is reduced, meanwhile, the effective integration of chips is facilitated, and the waste caused by the configuration of a power chip, a main chip and a CAN/LIN chip by a plurality of controllers is avoided. In design and maintenance, the integrated design changes the complex state of a distributed architecture, and needs no independent function maintenance and update aiming at different controllers, so that the integration level and the resource utilization efficiency of the whole vehicle thermal management system are improved, and the design and the maintenance are simpler, more convenient and more efficient.

Inventors

LI ZHIFANG

Assignees

浙江吉利控股集团有限公司
吉利汽车研究院（宁波）有限公司

Dates

Publication Date: 20260508
Application Date: 20250512

Claims (10)

1. The thermal management control system is characterized by comprising a shell and a printed circuit board assembly, wherein the printed circuit board assembly is arranged in the shell, and the grounding end at the periphery of the printed circuit board assembly is connected with the shell; The printed circuit board assembly comprises a thermal management controller and a plurality of functional devices, wherein the thermal management controller and the functional devices are respectively arranged on different surfaces of the printed circuit board assembly, and the thermal management controller is connected with the functional devices.
2. The thermal management control system of claim 1, wherein the printed circuit board assembly is provided with a high and low voltage divider, and the high and low voltage divider is provided with an isolated communication device, wherein the high and low voltage divider is a tank body positioned on the laid copper foil layer, and the high and low voltage divider is used for dividing the printed circuit board assembly into a first area and a second area, and the isolated communication device is respectively connected with the device positioned in the first area and the device positioned in the second area.
3. The thermal management control system of claim 2, wherein the isolated communication device comprises a signal amplifier, a filter, and a signal shaper, wherein an input of the signal amplifier receives a transmission signal from the functional device, an output of the signal amplifier is coupled to the input of the filter, an output of the filter is coupled to the input of the signal shaper, and an output of the signal shaper is coupled to the thermal management controller.
4. The thermal management control system of claim 2, wherein the thermal management controller is disposed on the first surface of the first region, the thermal management controller being coupled to the detection device on the first surface of the second region via the isolated communication device.
5. The thermal management control system of claim 2, wherein the second surface of the first region of the printed circuit board assembly is configured with a low voltage power source, a load driving device, and a thermal environment control device, the low voltage power source being adjacent to pins disposed on the second surface of the first region, the low voltage power source being connected to the load driving device and the thermal environment control device, respectively, by conductive traces.
6. The thermal management control system of claim 2, wherein the second surface of the second area of the printed circuit board assembly is configured with a high voltage power source and a power driver device, the high voltage power source being adjacent to pins disposed on the second surface of the second area, the high voltage power source being coupled to the power driver module through a high voltage filter module.
7. The thermal management control system of claim 6, wherein the high voltage filter module comprises a high voltage common mode inductance and a high voltage filter capacitance; The high-voltage common-mode inductor is used for acquiring a high-voltage power supply signal input by a high-voltage power supply, and performing common-mode interference suppression processing on the input high-voltage power supply signal to obtain a processed high-voltage power supply signal; The high-voltage filter capacitor is used for acquiring a high-voltage power supply signal processed by the high-voltage common mode inductor and outputting a stable high-voltage power supply signal with high-frequency ripple waves and noise filtered according to the processed high-voltage power supply signal; The power driving module is used for acquiring a low-voltage signal input by the thermal management controller and a stable high-voltage power signal input by the high-voltage filter capacitor, and outputting a three-phase bridge driving signal according to the input control signal and the high-voltage power signal so as to drive the PTC and the compressor.
8. The thermal management control system of claim 1, wherein the printed circuit board assembly is further provided with a thermal environment control device comprising a cooling system control module and a heating system control module; The cooling system control module is respectively connected with the cooling liquid sensor, the electronic water pump and the electronic water valve; The cooling system control module is used for receiving the system demand transmitted by the thermal management controller through an electric power control circuit and controlling the opening of the electronic water valve according to the system demand so as to regulate the flow rate and the flow direction of the cooling liquid; The cooling system control module is used for acquiring cooling liquid data transmitted by the cooling liquid sensor, analyzing the cooling liquid data, and sending a control instruction to the electronic water pump if the cooling liquid data exceeds a preset range, and adjusting the rotating speed by the electronic water pump according to the control instruction so as to adjust the circulation speed of the cooling liquid.
9. The thermal management control system of claim 8, wherein the heating system control module is coupled to a heater, and wherein the heating system control module is configured to receive a start command transmitted by the thermal management controller via an electrical control line and transmit a start parameter indicated by the start command to the heater to cause the heater to operate in accordance with the start parameter.
10. The thermal management control system of claim 9, wherein the heating system control module comprises a monitoring unit and a conditioning unit connected to the heater; The monitoring unit is used for monitoring the operation parameters of the heater, and if the operation parameters are abnormal, a control instruction is sent to the adjusting unit; The adjusting unit is used for receiving the control instruction and adjusting the electric power data input to the heater according to the control instruction.

Description

Thermal management control system Technical Field The utility model relates to the field of thermal management control, in particular to a thermal management control system. Background In new energy electric vehicles, especially hybrid electric vehicles, the cost of the 3 thermal management controller housings is increased by such a decentralized controller design due to the complex system and hardware and software design. Meanwhile, the 3 controllers respectively need a power chip, a main chip and a CAN/LIN chip, so that the chips cannot be integrated effectively. Moreover, such a decentralized architecture is relatively complex in design and maintenance, requiring independent functional maintenance and updating for different controllers (as shown in fig. 1, the thermal management controller a is to control and monitor various cooling related components, the thermal management controller B is to be directed to the PTC heater, and the thermal management controller C is to be directed to the air conditioning compressor), which is not as efficient as the integrated design in terms of integrated thermal management system integration and resource utilization of the whole vehicle. Disclosure of utility model In view of the above, the embodiments of the present utility model provide a thermal management control system to solve the problems of the conventional distributed thermal management controller, such as high cost of the housing, ineffective integration of the chip, and relatively complex design and maintenance. In a first aspect, an embodiment of the present utility model provides a thermal management control system, including a housing and a printed circuit board assembly, where the printed circuit board assembly is disposed in the housing, and a ground terminal at a periphery of the printed circuit board assembly is connected to the housing; The printed circuit board assembly comprises a thermal management controller and a plurality of functional devices, wherein the thermal management controller and the functional devices are respectively arranged on different surfaces of the printed circuit board assembly, and the thermal management controller is connected with the functional devices. Further, the printed circuit board assembly is provided with a high-low voltage separation belt, the high-low voltage separation belt is provided with an isolation communication device, the high-low voltage separation belt is a groove body positioned on the laid copper foil layer, the high-low voltage separation belt is used for separating the printed circuit board assembly into a first area and a second area, and the isolation communication device is respectively connected with the device deployed in the first area and the device deployed in the second area. Further, the isolation communication device comprises a signal amplifier, a filter and a signal shaper, wherein the input end of the signal amplifier receives a transmission signal of the functional device, the output end of the signal amplifier is connected with the input end of the filter, the output end of the filter is connected with the input end of the signal shaper, and the output end of the signal shaper is connected with the thermal management controller. Further, the thermal management controller is disposed on the first surface of the first area, and the thermal management controller is connected with the detection device located on the first surface of the second area through the isolation communication device. Further, a low-voltage power supply, a load driving device and a thermal environment control device are arranged on the second surface of the first area of the printed circuit board assembly, the low-voltage power supply is adjacent to pins arranged on the second surface of the first area, and the low-voltage power supply is respectively connected with the load driving device and the thermal environment control device through conductive circuits. Further, a high-voltage power supply and a power driving device are arranged on the second surface of the second area of the printed circuit board assembly, the high-voltage power supply is adjacent to pins arranged on the second surface of the second area, and the high-voltage power supply is connected with the power driving module through a high-voltage filtering module. Further, the high-voltage filtering module comprises a high-voltage common mode inductor and a high-voltage filtering capacitor; The high-voltage common-mode inductor is used for acquiring a high-voltage power supply signal input by a high-voltage power supply, and performing common-mode interference suppression processing on the input high-voltage power supply signal to obtain a processed high-voltage power supply signal; The high-voltage filter capacitor is used for acquiring a high-voltage power supply signal processed by the high-voltage common mode inductor and outputting a stable high-voltage power supply signal with high-frequency