CN-224212669-U - Array chip integrating impedance measurement and microscopic observation

CN224212669UCN 224212669 UCN224212669 UCN 224212669UCN-224212669-U

Abstract

The utility model relates to the technical field of bioengineering and provides an array chip integrating impedance measurement and microscopic observation, which comprises a transparent substrate, a circuit board, a 3D printing plate and an electrode unit, wherein a conductive film is arranged on one side of the transparent substrate, the circuit board is arranged on the conductive film, a plurality of micro-channels are arranged on the circuit board in an array mode, the 3D printing plate is arranged on one side, away from the conductive film, of the circuit board, a plurality of micro-cavities are arranged on the 3D printing plate in an array mode, the positions of the micro-cavities correspond to the positions of the micro-channels one by one, the electrode unit comprises a first electrode plate and a second electrode plate, the first electrode plate is arranged on the 3D printing plate in a covering mode, the second electrode plate is arranged around the circuit board in a surrounding mode, and a closed loop is formed between the conductive film and the first electrode plate. The utility model realizes the synchronization of electrophysiology (impedance) and morphology (microscopy) through the innovative fusion of micromachining and bioelectrochemistry, and is convenient for continuously monitoring the dynamic growth process of organisms.

Inventors

ZHANG YAOWEI
GUO XIAOLIANG
WU DI
YIN BOHUI
CHEN RENYU
WU WENMING

Assignees

北京化工大学
北京理工大学

Dates

Publication Date: 20260508
Application Date: 20250522

Claims (10)

1. An array chip for integrating impedance measurement and microscopic observation, comprising: a transparent substrate, one side of which is provided with a conductive film; the circuit board is arranged on the conductive film, and a plurality of micro-channels are arranged on the circuit board in an array manner; the 3D printing plate is arranged on one side, away from the conductive film, of the circuit board, a plurality of microcavities are arranged on the 3D printing plate in an array mode, and the positions of the microcavities correspond to the positions of the microchannels one by one; an electrode unit comprising: the first electrode plate is covered on the 3D printing plate, is contacted with the sample of the micro-channel and is suitable for being connected with an impedance measuring instrument and used for applying an excitation signal to carry out impedance detection; And the second electrode plate is arranged around the circuit board, and forms a closed loop with the first electrode plate through the conductive film.
2. The integrated impedance measurement and microscopic observation array chip according to claim 1, wherein the transparent substrate and the circuit board are adhered and fixed by a first UV adhesive layer; And/or the circuit board and the 3D printing plate are adhered and fixed through a second UV adhesive layer.
3. The integrated impedance measurement and microscopy array chip of claim 1, wherein the transparent substrate comprises any one of a soda lime based glass and a borosilicate based glass.
4. The integrated impedance measurement and microscopy array chip of claim 1, wherein the conductive film comprises an indium tin oxide film.
5. The integrated impedance measurement and microscopic observation array chip according to claim 1, wherein said circuit board comprises a flame retardant epoxy fiberglass laminate.
6. The integrated impedance measurement and microscopy array chip of claim 1, wherein the 3D printed board comprises a resin board with bio-compatibility.
7. The integrated impedance measurement and microscopic observation array chip according to claim 1, wherein the first electrode plate is provided with an in-hole pin and a first pin, the positions of the in-hole pins are in one-to-one correspondence with the positions of the microcavities, the first pins are symmetrically arranged on two sides of the first electrode plate, the first pins are respectively connected with the in-hole pins in one-to-one correspondence, and the first pins are suitable for being connected with an impedance measurement instrument; The second electrode is fixedly connected to the conductive film of the transparent substrate through UV glue, and a second pin of the conductive film is led out of the second electrode.
8. The integrated impedance measurement and microscopic observation array chip according to claim 7, wherein the first electrode is fixedly connected with at least two limiting pieces through UV glue, and each two limiting pieces are arranged at two opposite vertex angles of the first electrode; and under the condition that the first electrode plate is covered on the 3D printing plate, the limiting piece is abutted against two opposite side walls of the 3D printing plate.
9. The integrated impedance measurement and microscopy array chip of any of claims 1 to 8, wherein the aperture of the micro-channel is 0.4-1.0mm and the center-to-center spacing of two adjacent micro-channels is 9mm.
10. The integrated impedance measurement and microscopy array chip of any of claims 1 to 8, wherein the microcavity has a diameter of 4-6mm, the microcavity has a height of 5.4mm, and the center-to-center spacing of two adjacent microcavities is 9mm.

Description

Array chip integrating impedance measurement and microscopic observation Technical Field The utility model relates to the technical field of bioengineering, in particular to an array chip integrating impedance measurement and microscopic observation. Background The organoids, which are three-dimensional cell structures cultured in vitro, are of great importance in biomedical research, especially in the field of tumor research, where they can mimic the physiological and pathological characteristics of tumors in vivo. After modulation of gene expression or administration of chemotherapeutic agents, organoids need to be obtained at different time points for detection. Conventional methods for monitoring organoid growth suffer from a number of disadvantages, such as using an optical microscope to view organoid growth, or using immunofluorescent staining and chemical reagents to detect organoid growth. The observation of the growth condition of the organoid by using an optical microscope is visual, but only the morphological information of the organoid can be obtained, and the organoid is processed after the detection is finished and cannot be used for culture. When immunofluorescent staining and chemical detection are used, the organoid properties are altered. Therefore, no matter the detection means based on imaging or the fluorescence labeling method in the conventional means, continuous real-time monitoring of the tumor organoids in the single culture well cannot be realized. This means that there is a lack of information in the course of studying the dynamic growth of organoids, which does not fully reflect the changes of organoids throughout the growth cycle, thus limiting the in-depth understanding of organoid growth mechanisms and applications in drug development, disease diagnosis, etc. Disclosure of utility model The utility model provides an array chip integrating impedance measurement and microscopic observation, which is used for solving the technical defects in the prior art, realizes the synchronization of electrophysiology (impedance) and morphology (microscopy) through the innovative integration of micromachining and bioelectrochemistry, and is convenient for continuously monitoring the dynamic growth process of organisms. The utility model provides an array chip integrating impedance measurement and microscopic observation, comprising: a transparent substrate, one side of which is provided with a conductive film; the circuit board is arranged on the conductive film, and a plurality of micro-channels are arranged on the circuit board in an array manner; the 3D printing plate is arranged on one side, away from the conductive film, of the circuit board, a plurality of microcavities are arranged on the 3D printing plate in an array mode, and the positions of the microcavities correspond to the positions of the microchannels one by one; an electrode unit comprising: the first electrode plate is covered on the 3D printing plate, is contacted with the sample of the micro-channel and is suitable for being connected with an impedance measuring instrument and used for applying an excitation signal to carry out impedance detection; And the second electrode plate is arranged around the circuit board, and forms a closed loop with the first electrode plate through the conductive film. According to the array chip integrating impedance measurement and microscopic observation, the transparent substrate and the circuit board are adhered and fixed through the first UV adhesive layer; And/or the circuit board and the 3D printing plate are adhered and fixed through a second UV adhesive layer. According to the array chip for integrating impedance measurement and microscopic observation, the transparent substrate comprises any one of sodium-calcium-based glass and silicon-boron-based glass. According to the array chip integrating impedance measurement and microscopic observation provided by the utility model, the conductive film comprises an indium tin oxide film. According to the array chip for integrating impedance measurement and microscopic observation provided by the utility model, the circuit board comprises a flame-retardant epoxy resin glass fiber laminate. According to the integrated impedance measurement and microscopic observation array chip provided by the utility model, the 3D printing plate comprises a resin plate with biological compatibility. According to the array chip for integrating impedance measurement and microscopic observation, which is provided by the utility model, the first electrode plate is provided with the in-hole pins and the first pins, the positions of the in-hole pins are in one-to-one correspondence with the positions of the microcavities, the first pins are symmetrically arranged on two sides of the first electrode plate, the first pins are respectively connected with the in-hole pins in one-to-one correspondence, and the first pins are suitable for being connected with an impedan