CN-224212750-U - Wafer carrier device and electron beam evaporation table

CN224212750UCN 224212750 UCN224212750 UCN 224212750UCN-224212750-U

Abstract

The utility model provides a wafer carrier device and an electron beam evaporation table, which comprise a bearing seat and a cover plate assembly, wherein the bearing seat is used for bearing a wafer, the cover plate assembly is used for covering the bearing seat, the wafer is clamped between the cover plate assembly and the bearing seat, a flange matched with the edge of the top end of the bearing seat is formed on the cover plate assembly along the edge of the cover plate assembly, and when the cover plate assembly is covered, the flange is attached to the edge of the top end of the bearing seat, so that impurities are prevented from entering the edge of the wafer. According to the utility model, the flange matched with the edge of the top end of the bearing seat is arranged on the cover plate assembly, and after the cover plate assembly is covered, even if the wafer carrier device is obliquely placed, the flange can be attached to the edge of the top end of the bearing seat, so that impurities can be prevented from entering a gap between the cover plate assembly and the bearing seat, and the problem that the edge of the wafer generates notch cracks after the operation of the electron beam evaporation table is avoided because the impurities fall into the edge of the wafer.

Inventors

WANG HUAAN
LU GUANG
ZHANG JINGWEN

Assignees

芯恩（青岛）集成电路有限公司

Dates

Publication Date: 20260508
Application Date: 20250422

Claims (10)

1. A wafer carrier apparatus, comprising: The bearing seat is used for bearing the wafer; The cover plate assembly is used for covering the bearing seat, so that the wafer is clamped between the cover plate assembly and the bearing seat, a flange matched with the edge of the top end of the bearing seat is formed on the edge of the cover plate assembly on the cover plate assembly, and when the cover plate assembly is covered, the flange is attached to the edge of the top end of the bearing seat, so that impurities are prevented from entering the edge of the wafer.
2. The wafer carrier apparatus of claim 1, wherein the carrier comprises a cylindrical carrier body for carrying the wafer and an annular outer edge portion provided at a top end of the carrier body.
3. The wafer carrier apparatus of claim 2, wherein the cover plate assembly comprises a cover body adapted to the carrier body and the flange, the flange having an edge of the cover body disposed on top of the cover body; When the cover plate component is covered, the cover body is positioned in the bearing body, and the flange is attached to the outer edge part.
4. The wafer carrier apparatus of claim 3, wherein the flange comprises a cylindrical first connecting section and a ring-shaped second connecting section, the first connecting section is disposed on the top surface of the cover along the edge of the cover, and the second connecting section is vertically disposed on the top end of the first connecting section along the circumferential direction of the first connecting section; when the cover plate assembly is covered, the first connecting section is positioned in the bearing main body, and the second connecting section is attached to the outer edge part.
5. The wafer carrier apparatus of claim 3, wherein the flange is annular and vertically disposed on an outer wall of the lid, and a top surface of the flange is flush with a top surface of the lid assembly.
6. The wafer carrier apparatus of claim 3, wherein the cover plate assembly further comprises an abutment portion disposed along a circumferential direction of the cover body at an edge of the bottom surface of the cover body, the abutment portion being configured to abut against a wafer sandwiched between the cover plate assembly and the carrier.
7. The wafer carrier apparatus of claim 1, wherein the cover plate assembly further comprises a shielding rim disposed on an edge of the flange, the shielding rim being blocked outside of an edge of the carrier top end when the cover plate assembly is closed.
8. The wafer carrier apparatus of claim 7, wherein the shielding edge is one and disposed along a circumferential direction of the flange, or The shielding edges are arranged in a plurality of ways and are arranged at intervals along the circumferential direction of the flange.
9. The wafer carrier apparatus according to any one of claims 2 to 6, wherein a bottom end of the carrier body is provided with a carrier portion for carrying the wafer, the carrier portion being annular and being disposed along a circumferential direction of the carrier body.
10. An electron beam deposition station comprising the wafer carrier apparatus according to any one of claims 1 to 9.

Description

Wafer carrier device and electron beam evaporation table Technical Field The present utility model relates to the field of semiconductor manufacturing technology, and in particular, to a wafer carrier device and an electron beam evaporation table. Background Electron beam evaporation is a technique for forming a thin film by bombarding a target material in a crucible with a high-energy electron beam, melting and evaporating the target material, and then depositing the target material on a substrate. As a common physical vapor deposition (Physical Vapor Deposition, PVD) film forming technology, the electron beam evaporation has the advantages of high evaporation efficiency, high film forming quality, wide application range, convenience in preparation of a multilayer film and the like. The electron beam evaporation machine chamber structure mainly comprises an evaporation source, a planet carrier and a wafer carrier, wherein the wafer carrier comprises an annular bearing seat and a circular cover plate component. In the prior art, the assembly is convenient, and the diameter of the cover plate component is the same as the diameter of the wafer and is slightly smaller than the diameter of the bearing seat. The wafer is placed in the bearing seat, and the top of the wafer is covered with the cover plate component. After the assembly is completed, the whole structure of the wafer carrier is obliquely placed, the cover plate component cannot be completely attached to the inner wall of the bearing seat under the action of gravity, and particularly, a large gap can be formed between the upper side of the cover plate component and the upper side of the bearing seat, and the gap gradually decreases from top to bottom along the edge of the cover plate component. In the operation process of the electron beam evaporation machine, all parts in the chamber are deposited with metal layers, and metal scraps cannot be avoided. The chip can generate vibration when the planet carrier rotates on one hand, and when the chip falls into the gap, the metal chip can be transferred to the minimum position of the gap due to the vibration, so that the edge of the wafer is extruded to generate notch cracks. Because of the handling of the wafer, the relative position of the wafer in the wafer carrier is fixed, and notch cracks are typically concentrated at the nine o' clock position of the wafer. The prior wafer carrier structure cannot avoid the intervention of metal scraps or other impurities in the chamber environment, so that the wafer edge notch crack rejection rate is about 90% of the total rejection rate of the current station. In view of the foregoing, there is a need for a wafer carrier apparatus and an electron beam evaporation table to solve the above-mentioned problems. Disclosure of utility model The utility model aims to provide a wafer carrier device and an electron beam evaporation table, which are used for solving the problem that the conventional wafer carrier is easy to cause notch cracks on the edge of a wafer after the operation of the electron beam evaporation table. The utility model provides a wafer carrier device, comprising: The bearing seat is used for bearing the wafer; The cover plate assembly is used for covering the bearing seat, so that the wafer is clamped between the cover plate assembly and the bearing seat, a flange matched with the edge of the top end of the bearing seat is formed on the edge of the cover plate assembly on the cover plate assembly, and when the cover plate assembly is covered, the flange is attached to the edge of the top end of the bearing seat, so that impurities are prevented from entering the edge of the wafer. In one possible embodiment, the carrying seat comprises a carrying body which is used for carrying the wafer and is cylindrical, and an annular outer edge part which is arranged at the top end of the carrying body. In one possible embodiment, the cover plate assembly comprises a cover body matched with the bearing main body and a flange, wherein the flange is arranged on the top of the cover body at the edge of the cover body; When the cover plate component is covered, the cover body is positioned in the bearing body, and the flange is attached to the outer edge part. In one possible embodiment, the flange includes a first cylindrical connecting section and a second annular connecting section, the first connecting section is disposed on the top surface of the cover along the edge of the cover, and the second connecting section is vertically disposed on the top end of the first connecting section along the circumferential direction of the first connecting section; when the cover plate assembly is covered, the first connecting section is positioned in the bearing main body, and the second connecting section is attached to the outer edge part. In one possible embodiment, the flange is annular and vertically disposed on the outer wall of the cover body, and the top surface of t