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CN-224212811-U - Circuit board electroless copper plating equipment with ultrasonic oscillation

CN224212811UCN 224212811 UCN224212811 UCN 224212811UCN-224212811-U

Abstract

The circuit board chemical copper plating equipment with ultrasonic oscillation comprises an electroplating bath, an ultrasonic oscillation device and a processing device, wherein the ultrasonic oscillation device and the processing device are arranged in the electroplating bath, mounting seats are arranged on two opposite side surfaces of the electroplating bath, a connecting rod is arranged between the two mounting seats, the ultrasonic oscillation device is arranged on the connecting rod and moves along the connecting rod, the ultrasonic oscillation device comprises an ultrasonic vibration rod, a convex ring and a groove are arranged on the outer surface of the ultrasonic vibration rod, an ultrasonic transducer is arranged on the bottom surface of the external device, a flow guide part is arranged at the top of the external device, the flow guide part is gradually reduced from bottom to top, an exhaust port is arranged at the top of the flow guide part, a vacuum pump is arranged at the outer side of the exhaust port, an air outlet is arranged above the outer side of the vacuum pump, and a backflow pipe is arranged on the side surface of the vacuum pump, and the bottom end of the backflow pipe is connected to the processing tank. The movable ultrasonic vibration device and the processing device are arranged, so that the electroplating quality is improved, the practicability is high, and the popularization significance is high.

Inventors

  • PAN JUNMIN
  • LIU XUAN
  • GUO DAWEN
  • WEN WEIFENG
  • LIU CHANGSONG

Assignees

  • 江西红板科技股份有限公司

Dates

Publication Date
20260508
Application Date
20250526

Claims (6)

  1. 1. The circuit board electroless copper plating equipment with ultrasonic oscillation is characterized by comprising an electroplating bath, an ultrasonic oscillation device and a treatment device, wherein the ultrasonic oscillation device and the treatment device are arranged in the electroplating bath, mounting seats are arranged on two opposite side surfaces of the electroplating bath, a connecting rod is arranged between the two mounting seats, the ultrasonic oscillation device is arranged on the connecting rod and moves along the connecting rod, the ultrasonic oscillation device comprises an ultrasonic vibration rod, a convex ring and a groove are arranged on the outer surface of the ultrasonic vibration rod, an ultrasonic transducer is arranged on the bottom surface of the treatment device, a flow guide part is arranged at the top of the treatment device, the flow guide part is gradually reduced from bottom to top, an exhaust port is arranged at the top of the flow guide part, a vacuum pump is arranged at the outer side of the exhaust port, an air outlet is arranged above the outer side of the vacuum pump, a backflow pipe is arranged on the side surface of the vacuum pump, the bottom end of the backflow pipe is connected to the treatment tank, a connecting pipe is arranged at the bottom of the side surface of the treatment tank, and the other end of the connecting pipe extends into the electroplating bath.
  2. 2. The electroless copper plating equipment for circuit boards with ultrasonic oscillation according to claim 1, wherein the ultrasonic oscillation device comprises two ultrasonic oscillation bars, and the two oscillation bars are arranged on the connecting rod side by side.
  3. 3. The circuit board electroless copper plating equipment with ultrasonic oscillation according to claim 1, wherein a filter tank is arranged outside the plating tank, and the plating tank, the filter tank and the treatment tank are connected in sequence.
  4. 4. The circuit board electroless copper plating equipment with ultrasonic oscillation according to claim 3, wherein the middle part of the filter tank is provided with a filter screen for separating an upper layer from a lower layer, a water inlet pipe is arranged above the filter tank, a water outlet pipe is arranged at the bottom of the filter tank, the water inlet pipe is connected with the electroplating tank and the filter tank, and the water outlet pipe is connected with the filter tank and the treatment tank.
  5. 5. The electroless copper plating equipment for circuit boards with ultrasonic oscillation according to claim 1, wherein an anode plate is arranged on the inner side of the plating tank, a plating area is arranged in the middle of the plating tank, a plating clamp is arranged above the plating area, a cathode is arranged on the plating clamp, and the ultrasonic oscillation device is arranged between the plating clamp and the anode plate.
  6. 6. The circuit board electroless copper plating equipment with ultrasonic oscillation as recited in claim 5, wherein the electroplating clamp is further provided with a driving device, and the driving device can drive the electroplating clamp to move along the direction perpendicular to the anode plate.

Description

Circuit board electroless copper plating equipment with ultrasonic oscillation Technical Field The utility model relates to the technical field of electroplating, in particular to circuit board electroless copper plating equipment with ultrasonic oscillation. Background In the electroplating process of the PCB, copper is usually subjected to electroless plating, a conductive layer is formed on the surface of the PCB, and then the electroplating process is performed, but various process defects often occur in the electroplating process, such as poor circulation of plating solution in holes, air bubbles in the holes in the electroplating process and incapability of being discharged, and the like, so that the problems of holes, irregular plating layers, no copper in the holes and the like are caused. For this reason, there are various stirring devices for accelerating the flow of the plating liquid in the holes, ultrasonic waves for breaking bubbles, and the like. However, after long-term use, metal ions, undegraded additive components, oil stains and residual organics from the pretreatment in the plating solution gradually accumulate. These impurities can damage bath stability, leading to increased hydrogen evolution reactions, which can exacerbate bubble formation. At this time, it is difficult to achieve an effective effect by conventional stirring and ultrasonic waves. Disclosure of utility model Based on this, it is necessary to provide a circuit board electroless copper plating apparatus with ultrasonic oscillation in view of the deficiencies in the prior art. The circuit board chemical copper plating equipment with ultrasonic oscillation comprises an electroplating bath, an ultrasonic oscillation device and a processing device, wherein the ultrasonic oscillation device and the processing device are arranged in the electroplating bath, mounting seats are arranged on two opposite side surfaces of the electroplating bath, a connecting rod is arranged between the two mounting seats, the ultrasonic oscillation device is arranged on the connecting rod and moves along the connecting rod, the ultrasonic oscillation device comprises an ultrasonic vibration rod, a convex ring and a groove are arranged on the outer surface of the ultrasonic vibration rod, an ultrasonic transducer is arranged on the bottom surface of the external device, a flow guide part is arranged at the top of the external device, the flow guide part is gradually reduced from bottom to top, an exhaust port is arranged at the top of the flow guide part, a vacuum pump is arranged at the outer side of the exhaust port, an air outlet is arranged above the outer side of the vacuum pump, and a backflow pipe is arranged on the side surface of the vacuum pump, and the bottom end of the backflow pipe is connected to the processing tank. The bottom of the side face of the treatment tank is provided with a connecting pipe, and the other end of the connecting pipe extends into the electroplating tank. Further, the ultrasonic vibration device comprises two ultrasonic vibration rods which are arranged on the connecting rod side by side. Further, a filter tank is arranged outside the electroplating tank, and the electroplating tank, the filter tank and the treatment tank are sequentially connected. Further, the middle part of the filter tank is provided with a filter screen for separating an upper layer from a lower layer, a water inlet pipe is arranged above the filter tank, a water outlet pipe is arranged at the bottom of the filter tank, the water inlet pipe is connected with the electroplating tank and the filter tank, and the water outlet pipe is connected with the filter tank and the treatment tank. Further, an anode plate is arranged on the inner side of the electroplating bath, an electroplating area is arranged in the middle of the electroplating bath, an electroplating clamp is arranged above the electroplating area, a cathode is arranged on the electroplating clamp, and the ultrasonic vibration device is arranged between the electroplating clamp and the anode plate. Further, a driving device is further arranged on the electroplating clamp, and the driving device can drive the electroplating clamp to move along the direction perpendicular to the anode plate. In summary, the movable ultrasonic vibration device is arranged to perform more comprehensive uniform vibration on the circuit board, so that the flow speed of the electroplating liquid in the holes is accelerated, the electroplating liquid flows more smoothly in the holes, bubbles can be crushed, and the problems of hollowness in the holes, no copper in the holes and the like are reduced. The design of the convex ring and the groove structure on the outer surface of the ultrasonic vibration rod increases the acting area and improves the efficiency. The filter tank filters the impurity in the plating solution, and bubble formation is more and more in electroplating work, and ultrasonic device is