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CN-224212829-U - Supporting device for bearing wafer and epitaxial growth equipment

CN224212829UCN 224212829 UCN224212829 UCN 224212829UCN-224212829-U

Abstract

The application provides a supporting device for bearing a wafer and epitaxial growth equipment, and relates to the technical field of semiconductor manufacturing. The wafer supporting device comprises a base, a connecting shaft, a plurality of ejector pins and a supporting assembly, wherein the base is used for supporting a wafer in a reaction chamber, at least three through holes are formed in the base, the connecting shaft is used for supporting the base in the reaction chamber, the ejector pins are arranged in one-to-one correspondence with the through holes, the ejector pins comprise connecting rods and bases which are sequentially connected, the connecting rods penetrate through the through holes, the tops of the connecting rods are used for supporting the wafer, the diameter of the bases is larger than that of the connecting rods, the gap between the connecting rods and the through holes is 1 mm-3 mm, the supporting assembly is movably arranged in the reaction chamber, and when acting force is applied to the bases by the supporting assembly, the connecting rods can be driven to extend out of the through holes. The problems of collision or adhesion between the thimble and the hole wall and wafer position deviation can be solved.

Inventors

  • WANG YALIN

Assignees

  • 芯恩（青岛）集成电路有限公司

Dates

Publication Date
20260508
Application Date
20250418

Claims (10)

  1. 1. A support device for carrying a wafer, comprising: A base for supporting a wafer in a reaction chamber, wherein at least three through holes are formed in the base; A connection shaft for supporting the susceptor within the reaction chamber; The plurality of ejector pins are arranged in one-to-one correspondence with the through holes, each ejector pin comprises a connecting rod and a base which are sequentially connected, each connecting rod penetrates through each through hole, the top of each connecting rod is used for bearing the wafer, the diameter of each base is larger than that of each connecting rod, and the gap range between each connecting rod and each through hole is 1 mm-3 mm; The bearing component is movably arranged in the reaction chamber, and can drive the connecting rod to extend out of the through hole when the bearing component applies acting force to the base.
  2. 2. The support device for carrying a wafer of claim 1, wherein the bottom end surface of the base is provided with an abutment slot into which the receiving assembly moves to apply a force to the base when the robot transfers the wafer over the base.
  3. 3. The support device for carrying a wafer of claim 2, wherein the thimble further comprises: the contact is connected to the top of connecting rod, the diameter of contact is greater than the diameter of connecting rod.
  4. 4. The supporting device for carrying a wafer according to claim 3, wherein the through hole is a stepped hole, a gap between a lower step hole of the stepped hole and the connecting rod ranges from 1mm to 3mm, a diameter of an upper step hole of the stepped hole is larger than a diameter of the lower step hole, a diameter of the contact head is larger than a diameter of the lower step hole and smaller than a diameter of the upper step hole, and a thickness of the contact head is smaller than a depth of the upper step hole.
  5. 5. The support device for carrying a wafer of claim 2, wherein the receiving assembly comprises: the lifting piece is connected with the connecting shaft in a sliding manner; The supporting arms are arranged in one-to-one correspondence with the thimbles, one ends of the supporting arms are connected with the lifting pieces, and the other ends of the supporting arms extend towards the lower parts of the corresponding bases; The bearing plates are arranged in one-to-one correspondence with the supporting arms and connected with one ends of the corresponding supporting arms far away from the lifting piece, and the bearing plates are positioned below the corresponding bases and used for bearing the corresponding bases; The support plate is provided with at least three limit posts, and when the support plate supports the base, the limit posts are accommodated in the abutting grooves.
  6. 6. The supporting device for carrying a wafer as claimed in claim 5, wherein a plurality of stabilizing columns are further provided on the carrier plate, and the stabilizing columns are disposed in one-to-one correspondence with the limiting columns; One end of the stabilizing column is provided with a connecting buckle, the top end of the limiting column is provided with a connecting hole, the connecting buckle is clamped in the connecting hole so that the stabilizing column is connected with the limiting column, and the stabilizing column can incline outwards to prop against the side wall of the abutting groove.
  7. 7. The support device for carrying a wafer of claim 6 wherein the top of the stabilizing post is hemispherical.
  8. 8. The support device for carrying a wafer of claim 7, wherein the susceptor assembly further comprises: The plurality of restraint plates are arranged in one-to-one correspondence with the bearing plates, the restraint plates are connected with the corresponding support arms and are positioned above the corresponding bearing plates, restraint holes are formed in the restraint plates so that the stabilizing columns can be folded, and when the bearing assemblies bear the ejector pins, the restraint plates deform and bend towards the bearing plates so that the stabilizing columns incline outwards.
  9. 9. The support device for carrying a wafer of claim 8, wherein a limiting groove is formed in the periphery of the restraining hole to limit the base.
  10. 10. Epitaxial growth apparatus comprising a support device for carrying wafers according to any one of claims 1 to 9.

Description

Supporting device for bearing wafer and epitaxial growth equipment Technical Field The present application relates to the field of semiconductor manufacturing technology, and in particular, to a supporting device for carrying a wafer and an epitaxial growth apparatus. Background In the semiconductor manufacturing process, epitaxial growth (Epitaxial Deposition, abbreviated as EPI) is a critical thin film growth process, and is widely used for manufacturing high-quality semiconductor devices. The EPI process forms the desired semiconductor structure by depositing one or more crystalline films on the wafer surface. In EPI facilities, a single wafer is typically processed one at a time in a single wafer growth regime to ensure precise control of growth conditions and high quality thin film deposition. In order to realize automatic transmission and processing of wafers, an EPI machine is generally equipped with a manipulator for taking and transferring wafers. In the process of taking out a wafer, a thimble is generally used to lift the wafer from below in order to separate the wafer from the susceptor. The thimble carries out lifting movement through a thimble hole on the base, and stably jacks up the wafer, so that the manipulator can transfer the wafer from the lower Fang Tuoqu to the next working procedure position. In the prior art, in order to ensure that the thimble can stably stand upright and accurately support the wafer, the size of the thimble hole is usually small, however, during the EPI deposition process, deposition material may accumulate in the thimble hole, resulting in a smaller pore. The resistance in the lifting process of the thimble can be increased, the phenomenon of collision or sticking between the thimble and the hole wall can be possibly caused, and the risk of the position deviation of the wafer is increased. Disclosure of utility model The application mainly provides a supporting device for bearing a wafer and epitaxial growth equipment, which are used for solving the problems of collision or adhesion between a thimble and a hole wall and wafer position deviation. The technical scheme adopted for solving the technical problems is as follows: The application provides a supporting device for bearing wafers, which comprises a base, a connecting shaft, a plurality of ejector pins and a supporting assembly, wherein the base is used for supporting the wafers in a reaction chamber, at least three through holes are formed in the base, the connecting shaft is used for supporting the base in the reaction chamber, the ejector pins are arranged in one-to-one correspondence with the through holes and comprise connecting rods and bases which are sequentially connected, the connecting rods penetrate through the through holes, the tops of the connecting rods are used for bearing the wafers, the diameter of the bases is larger than that of the connecting rods, the gap between the connecting rods and the through holes is 1 mm-3 mm, and the bearing assembly is movably arranged in the reaction chamber and can drive the connecting rods to extend out of the through holes when acting force is applied to the bases by the bearing assembly. Optionally, the bottom end face of the base is provided with an abutment groove, and when the manipulator transfers the wafer to above the base, the receiving assembly moves into the abutment groove to apply an acting force to the base. Optionally, the thimble further comprises a contact head connected to the top of the connecting rod, and the diameter of the contact head is larger than that of the connecting rod. Optionally, the through hole is the shoulder hole, the lower order hole of shoulder hole with the clearance scope of connecting rod is 1mm ~3mm, the diameter of the upper order hole of shoulder hole is greater than the diameter of lower order hole, the diameter of contact head is greater than the diameter of lower order hole and be less than the diameter of upper order hole, the thickness of contact head is less than the degree of depth of upper order hole. The supporting assembly comprises a lifting piece, a plurality of supporting arms, a plurality of supporting plates and at least three limiting columns, wherein the lifting piece is connected with the connecting shaft in a sliding mode, one ends of the supporting arms are in one-to-one correspondence with the ejector pins, the other ends of the supporting arms extend towards the lower portion of the corresponding base, the supporting plates are in one-to-one correspondence with the supporting arms and are connected with one ends, away from the lifting piece, of the corresponding supporting arms, the supporting plates are located below the corresponding base and are used for supporting the corresponding base, and at least three limiting columns are arranged on the supporting plates and are contained in the abutting grooves when the supporting plates support the base. Optionally, the bearing plate is further p