CN-224214524-U - IC card carrier tape splicing structure

CN224214524UCN 224214524 UCN224214524 UCN 224214524UCN-224214524-U

Abstract

The utility model is suitable for the technical field of IC card carrier tape processing, and provides an IC card carrier tape splicing structure which comprises a reinforcing plate, an adhesive layer and a plurality of exposed holes, wherein the reinforcing plate is arranged between two IC card carrier tapes and used for splicing the two IC card carrier tapes, the adhesive layer is adhered to the reinforcing plate and used for adhering and fixing the reinforcing plate and the two IC card carrier tapes, and the adhesive layer is arranged on the reinforcing plate and corresponds to the positions of the IC cards on the IC card carrier tapes, so that the exposed holes of an IC card functional area are prevented from being blocked. The IC card carrier tape splicing structure provided by the scheme has high strength, smooth operation, no clamping tape and strong bending adaptability.

Inventors

MA XINGGUANG
LIU MINGJIAN
ZHU XIAOBIN
WU HAO

Assignees

黄石市星光电子有限公司

Dates

Publication Date: 20260508
Application Date: 20250626

Claims (3)

1. An IC card carrier tape splicing structure for splicing two IC card carrier tapes, comprising: the reinforcing plate (2) is arranged between the two IC card carrier tapes (1) and is used for splicing the two IC card carrier tapes (1); An adhesive layer (3) adhered to the reinforcing plate (2) for adhering and fixing the reinforcing plate (2) and the two IC card carrier tapes (1); The plurality of exposed holes (4) are arranged on the reinforcing plate (2) and correspond to the positions of the IC cards on the IC card carrier tape (1) so as to avoid shielding the functional areas of the IC cards.
2. The IC card carrier tape splicing structure according to claim 1, wherein the thickness of the reinforcing plate (2) is 0.13mm or more.
3. The splicing structure of the IC card carrier tape according to claim 1, wherein the adhesive layer (3) is made of acrylic adhesive, and the thickness after curing is less than or equal to 0.5mm.

Description

IC card carrier tape splicing structure Technical Field The utility model belongs to the technical field of IC card carrier tape processing, and particularly relates to an IC card carrier tape splicing structure. Background The IC card carrier tape is always spliced in the packaging process, but most of the traditional splicing modes adopt rivet mechanical fixation, but the problem that even if ultra-thin rivets are used, the superposition thickness of the ultra-thin rivets still can influence the smooth operation of the carrier tape in high-speed packaging equipment, so that the carrier tape is easy to cause clamping, the rigidity of the rivet area is too high, and the carrier tape is easy to locally deform or even break when the rivet is curled or bent. Disclosure of utility model The utility model provides an IC card carrier tape splicing structure, which aims to solve the problems of exceeding thickness, poor mechanical property and process defects in the rivet splicing scheme provided by the background art. The utility model solves the problems, and the splicing structure of the IC card carrier tape comprises a reinforcing plate arranged between two IC card carrier tapes and used for splicing the two IC card carrier tapes, an adhesive layer adhered to the reinforcing plate and used for adhering and fixing the reinforcing plate and the two IC card carrier tapes, and a plurality of exposed holes which are arranged on the reinforcing plate and correspond to the positions of the IC cards on the IC card carrier tapes and avoid shielding the functional areas of the IC cards. Preferably, the material of the reinforcing plate is glass fiber reinforced epoxy resin composite material (FR-4), and the thickness of the reinforcing plate is more than or equal to 0.13mm. Preferably, the adhesive layer is made of acrylic rubber, and the thickness of the adhesive layer after solidification is less than or equal to 0.5mm. Compared with the related art, the splicing structure of the IC card carrier tape has the following beneficial effects: Compared with the prior art, the IC card carrier tape splicing structure provided by the scheme is firmly bonded with the carrier tape through the reinforcing plate and the adhesive layer, so that a stable splicing structure is formed, splicing strength is guaranteed, meanwhile, the exposed holes formed in the reinforcing plate ensure that the functional area of the IC card is not shielded during splicing, reliable splicing of the carrier tape is realized, normal use of the IC card function is guaranteed, dual consideration of splicing strength and functional integrity is realized, compared with a traditional splicing mode adopting rivet mechanical fixation, the splicing structure realizes carrier tape splicing through the adhesive layer, the situation that the thickness of overlapped rivets influences smooth operation of the carrier tape in high-speed packaging equipment is avoided, and high-efficiency and stable operation of the carrier tape in the high-speed packaging equipment is guaranteed. In summary, the splicing structure of the IC card carrier tape has high strength, smooth operation, no clamping tape, strong bending adaptability, and can ensure the comprehensive purpose of the functional integrity of the IC card, thereby remarkably improving the packaging quality and the product reliability of the IC card carrier tape. Drawings FIG. 1 is a schematic diagram of a front view of an IC card carrier tape splicing structure according to the present utility model; FIG. 2 is a schematic side view of an IC card carrier tape splicing structure according to the present utility model; Fig. 3 is a schematic front view of a stiffening plate according to the present utility model; fig. 4 is a diagram of a second embodiment of a solder joint method of a stiffener according to the present utility model. The reference sign is 1, IC card carrier tape, 2, stiffening plate, 3, adhesive layer, 4, bare hole, 5, soldering tin groove. Detailed Description Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs, the terms used in the description of this application are for the purpose of describing particular embodiments only and are not intended to be limiting of the utility model, and the terms "comprising" and "having" and any variations thereof in the description of this utility model and the claims and the above description of the drawings are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and in the claims or drawings, are used for distinguishing between different objects and not for describing a particular sequential order, and the terms "inner," "outer," "left," "right," and the like are used for convenience in describing the present utility model and simplifying the description, and do not denote or imp