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CN-224215716-U - Full-automatic multistation drying device of semiconductor wafer

CN224215716UCN 224215716 UCN224215716 UCN 224215716UCN-224215716-U

Abstract

The utility model discloses a full-automatic multi-station drying device for a semiconductor wafer, and relates to the technical field of semiconductor manufacturing equipment. The device comprises base plates which are symmetrically arranged, a conveying platform between the base plates and a drying cabin body which is arranged in the middle of the base plates. The drying cabin is divided into a pretreatment area, a main drying area and a cooling area through four groups of lifting isolation doors, the bottoms of the isolation doors are provided with channels and driven by independent motors, an infrared radiation heating array is arranged on the inner wall of the main drying area, an air cooling duct communicated with a cooling fan is arranged on the inner wall of the cooling area, a material transfer trolley slides on a conveying platform through a guide rail, a bearing bracket of the material transfer trolley is provided with a wedge-shaped locking block driven by a double torsion spring and used for locking a wafer carrying disc with a conical positioning boss, and a pushing mechanism enables a push rod to be matched with a positioning bracket to realize automatic transfer of the transfer trolley. The utility model realizes the closed automatic operation of the whole process of wafer drying-cooling, solves the problem of temperature fluctuation, and improves the yield by more than 15%.

Inventors

  • LIANG XINGZHI
  • HU GUANGYUE

Assignees

  • 芜湖市深矽半导体有限公司

Dates

Publication Date
20260508
Application Date
20250612

Claims (6)

  1. 1. The full-automatic multi-station drying device for the semiconductor wafer comprises two base plates (1) which are symmetrically arranged, and is characterized in that, A conveying platform (2) is erected between the two base plates (1), and two guide rails (21) are arranged on the surface of the conveying platform (2) in parallel; The drying cabin body (3) is arranged in the middle of the base plate (1), and the interior of the drying cabin body is divided into a pretreatment area (31), a main drying area (32) and a cooling area (33) through four groups of lifting isolation doors (4); A channel (41) is arranged in the center of the bottom of each lifting isolation door (4), and each isolation door (4) is controlled by an independent driving motor at the top of the drying cabin body (3); the material transfer trolley is arranged on the guide rail (21) in a sliding mode, a pushing mechanism (6) is integrated in the conveying platform (2), and the driving end of the pushing mechanism extends to the outer side of the base plate (1).
  2. 2. The full-automatic multi-station drying device for semiconductor wafers according to claim 1, wherein an infrared radiation heating array is arranged on the inner wall of the main drying area (32), and an air cooling pore canal is arranged on the inner wall of the cooling area (33); The control cabinet (34) and the cooling fan (35) are arranged at the top of the drying cabin body (3), the control cabinet (34) is connected with the infrared radiation heating array, and an air outlet of the cooling fan (35) is communicated with an air cooling duct of the cooling area (33).
  3. 3. A fully automatic multi-station drying apparatus for semiconductor wafers according to claim 1, wherein the material transfer vehicle (5) comprises: A material carrying frame (51) with four groups of guide wheels (52) arranged at the bottom, wherein the guide wheels (52) are positioned between the guide rails (21); The positioning brackets (53) are symmetrically fixedly connected to the bottom of the material carrying frame (51); a plurality of layers of carrier brackets (54) assembled in the carrier frame (51); And a wafer carrier plate (55) detachably mounted on the carrier bracket (54).
  4. 4. A full-automatic multi-station drying apparatus for semiconductor wafers according to claim 1, wherein the pushing mechanism (6) comprises: A transmission groove (61) arranged in the middle of the conveying platform (2); a belt wheel set arranged in the transmission groove (61) in a rotating way; a closed loop drive belt (62) surrounding the pulley set; a plurality of push rods (63) fixedly connected on the transmission belt (62) at equal intervals; One end of a driving shaft penetrating through the conveying platform (2) is connected with the belt pulley group, and the other end of the driving shaft is connected with a servo motor (64) at the outer side of the base plate (1); The push rod (63) and the positioning support (53) of the material transfer trolley (5) form lateral driving fit.
  5. 5. A full-automatic multi-station drying device for semiconductor wafers according to claim 3, wherein the side wall of the bearing bracket (54) is provided with a spring cavity (541), a rotary sleeve (542) is hinged by a double torsion spring (543), and the rotary sleeve (542) is fixedly connected with a linkage rod (544) with a wedge-shaped locking block (545); When the wedge lock (545) is in the horizontal position, the wafer carrier (55) is locked.
  6. 6. A full-automatic multi-station drying apparatus for semiconductor wafers according to claim 3, wherein said wafer carrier (55) comprises: A disc body (551) with an annular positioning groove (552); conical positioning bosses (553) distributed annularly along the outer edge of the annular positioning groove (552); the micropore array (554) is arranged at the bottom of the annular positioning groove (552), and is positioned in the enclosing area of the conical positioning boss (553); The conical positioning boss (553) is used for supporting a semiconductor wafer (555).

Description

Full-automatic multistation drying device of semiconductor wafer Technical Field The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a full-automatic wafer drying device with multi-station integration and accurate temperature control. Background The semiconductor wafer is used as a core substrate for integrated circuit manufacture, and the surface of the semiconductor wafer is required to form a micro-scale circuit structure. The trace moisture or chemical reagent remained after the wet etching and cleaning process of the precision device can lead to the defects of oxidation of a metal circuit, cracking of a dielectric layer and the like if not completely removed, and directly influences the yield of chips. However, the following drawbacks exist in the current semiconductor drying operation: 1. Temperature control unbalance-traditional hot air drying is easy to form a temperature gradient, and structural stress deformation is caused by uneven local heating of a wafer; 2. risk of particle contamination-environmental particles adhering to the wafer surface during open transport, causing physical damage to the pattern area; 3. The degree of automation is low-manual transfer of the wafer carrier results in process cutting, the conversion efficiency of the drying-cooling link is low, and the probability of artificial pollution is increased by high-temperature exposure. Disclosure of utility model 1. The technical problems to be solved are as follows: Aiming at the problems of large temperature fluctuation, high risk of cross contamination, poor process continuity and the like in the prior art, the utility model aims to provide a full-automatic multi-station drying device for a semiconductor wafer, which can realize the core functions of precise temperature control in a partition, closed automatic transmission and zero contact drying of the wafer. 2. The technical scheme is as follows: In order to solve the problems, the utility model adopts the following technical scheme. The full-automatic multi-station drying device for the semiconductor wafer comprises two symmetrically arranged base plates, wherein a conveying platform is erected between the two base plates, and the surface of the conveying platform is provided with parallel guide rails; The drying cabin is arranged in the middle of the base plate, the interior of the drying cabin is divided into a pretreatment area, a main drying area and a cooling area through four groups of lifting type isolation doors, a channel is arranged in the center of the bottom of each lifting type isolation door, each isolation door is controlled by an independent driving motor at the top of the drying cabin, a material transfer trolley is arranged on the guide rail in a sliding mode, a pushing mechanism is integrated in the conveying platform, and the driving end of the mechanism extends to the outer side of the base plate. The drying cabin is further improved in that an infrared radiation heating array is arranged on the inner wall of the main drying area, an air cooling pore canal is formed in the inner wall of the cooling area, a control cabinet and a cooling fan are arranged on the top of the drying cabin body, the control cabinet is connected with the infrared radiation heating array, and an air outlet of the cooling fan is communicated with the air cooling pore canal of the cooling area. The material transfer trolley is further improved in that the material transfer trolley comprises a material carrying frame with four groups of guide wheels arranged at the bottom, the guide wheels are positioned between guide rails, positioning brackets symmetrically fixedly connected to the bottom of the material carrying frame, a plurality of layers of bearing brackets assembled in the material carrying frame, and wafer carrying discs detachably mounted on the bearing brackets. The pushing mechanism comprises a transmission groove arranged in the middle of the conveying platform, a belt pulley group arranged in the transmission groove in a rotating mode, a closed-loop transmission belt covering the belt pulley group, a plurality of push rods fixedly connected to the transmission belt at equal intervals, a driving shaft penetrating through the conveying platform, one end of the driving shaft is connected with the belt pulley group, the other end of the driving shaft is connected with a servo motor on the outer side of the base plate, and the push rods and a positioning bracket of the material transfer trolley form lateral driving fit. The wafer carrier is further improved in that a spring cavity is formed in the side wall of the bearing bracket, a rotary sleeve is hinged in the spring cavity through a double-torsion spring, the rotary sleeve is fixedly connected with a linkage rod with a wedge-shaped locking block, and when the wedge-shaped locking block is in a horizontal position, the wafer carrier is locked. The wafer carrying di