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CN-224215740-U - Wafer box heating air-jet drying device

CN224215740UCN 224215740 UCN224215740 UCN 224215740UCN-224215740-U

Abstract

The utility model provides a wafer box heating air-jet drying device, which relates to the technical field of wafer box heating and drying and comprises an air-jet drying machine body, wherein a spray head is obliquely arranged on the inner wall of the left side of the air-jet drying machine body, the left side of the spray head is connected with an air-jet atomizer through an atomization pipe, the air-jet atomizer is connected with an IPA mixed solution cylinder through a perfusion pipe, the inner wall of the lower end of the air-jet drying machine body is connected with a rotating column through a bearing seat, the outer side of the rotating column is welded with a storage frame plate, an L-shaped pressing plate is limited and connected in a groove at the upper end of the storage frame plate, a wafer box body is pressed between the storage frame plate and the L-shaped pressing plate, clamping plates are symmetrically clamped on two side surfaces of the L-shaped pressing plate, external thread blocks are welded through fixing columns, and the external thread blocks are screwed with adjusting groove blocks through internal thread grooves. The utility model solves the problems that the residual moisture in the grooves of the wafer box placed on the grid plate is difficult to discharge, so that the drying efficiency is affected due to the prolonged heating and drying time in the prior art.

Inventors

  • Wu Muyan
  • CHEN JUAN
  • ZHANG JIAHUI
  • Guan Ranran
  • XIA YUTING
  • ZHANG NA

Assignees

  • 欣福半导体科技(合肥)有限公司

Dates

Publication Date
20260508
Application Date
20250414

Claims (7)

  1. 1. The wafer box heating air-jet drying device comprises an air-jet drying machine body (1), wherein an electric heater (14) is arranged on the inner wall of the upper end of the air-jet drying machine body (1), and the wafer box heating air-jet drying device is characterized in that: Jet-propelled desiccator (1) left side inner wall department slope installs shower nozzle (24), shower nozzle (24) left side is connected with through atomizing pipe (21) and sprays atomizer (2), spray atomizer (2) are connected with IPA mixed solution section of thick bamboo (22) through transfer line (23), jet-propelled desiccator (1) lower extreme inner wall is connected with column spinner (32) through bearing frame (33), the welding of column spinner (32) outside has puts thing frame (3), it is connected with L type clamp plate (31) to put thing frame (3) upper end inslot spacing, it holds wafer box body (4) to press between thing frame (3) and the L type clamp plate (31), clamping plate (5) are held to L type clamp plate (31) both sides face symmetry, clamp plate (5) have external screw thread piece (54) through fixed column (56) welding, external screw thread piece (54) have regulating groove piece (51) through internal thread groove (53) spiro union.
  2. 2. The wafer box heating and air-jetting drying device according to claim 1, wherein a cabinet door (11) is mounted on the front surface of the air-jetting dryer body (1), a receiver (12) is fixed on the inner wall of the left side of the air-jetting dryer body (1), and the receiver (12) is located at the position right above the spray head (24).
  3. 3. The wafer box heating and air-jet drying device according to claim 1, wherein a rubber plug (13) is plugged at a groove on the left side of the air-jet drying machine body (1), a motor (34) is fixed on the upper surface of the air-jet drying machine body (1), and the lower end of the motor (34) is connected with a rotating column (32) through a coupler (35).
  4. 4. A wafer box heating air-jet drying device according to claim 3, wherein an air-jet atomizer (2) is arranged on the left side of the motor (34), an IPA mixed solution cylinder (22) is arranged on the right side of the motor, and a laser positioner (36) is embedded in the cylindrical surface of the rotary column (32).
  5. 5. The wafer box heating air-jet drying device according to claim 1, wherein an elastic pad (37) is adhered to the lower end face of the L-shaped pressing plate (31), the elastic pad (37) is tightly attached to the upper surface of the wafer box body (4), and an adjusting groove block (51) is fixedly connected to the upper surface of the object placing frame plate (3) in a threaded mode.
  6. 6. The wafer cassette heating and air-jet drying device according to claim 1, wherein an inner thread groove (53) is formed in the inner side of the adjusting groove block (51), and a column head (52) is welded on the other end face of the outer thread block (54).
  7. 7. The wafer box heating and air-jet drying device according to claim 1, wherein the side surface of the clamping plate (5) is attached to the L-shaped clamping plate (31) through an anti-slip pad (55), a sealing ring (57) is arranged on the notch surface of the adjusting groove block (51), and a column head (52) and a fixing column (56) penetrate through the sealing ring (57) respectively.

Description

Wafer box heating air-jet drying device Technical Field The utility model relates to the technical field of wafer box heating and drying, in particular to a wafer box heating and air-jet drying device. Background In order to simplify transportation and reduce the risk of pollution as much as possible, chip manufacturers carry and store wafers by using the wafer cassettes, and in order to ensure the cleanliness of the wafer cassettes, the wafer cassettes are required to be heated, blown and dried, and the prior art (bulletin number: CN 202421111228.3) is a drying device for semiconductor wafer cassettes, which describes that 'the movable gear is driven to rotate by starting a driving motor to drive a bracket to rotate, and simultaneously, the movable gear rotates along a fixed gear, the semiconductor wafer cassettes above the movable gear are rotated, and are dried by nitrogen and a heating pipe heated in a drying box, so that drying is facilitated, the support is inserted on the movable gear, then the semiconductor wafer cassettes are placed on a grid plate, rubber rods are moved according to the size of the semiconductor wafer cassettes, the rubber rings in a sleeve are driven to rotate along a ring, and the semiconductor wafer cassettes are pressed, so that the drying device is suitable for the semiconductor wafer cassettes with different sizes', but the drying efficiency is difficult to be influenced by the fact that the residual water in the wafer cassettes placed on the grid plate is discharged, so that the drying efficiency is difficult to be influenced. Disclosure of utility model In order to overcome the defects in the prior art, a wafer box heating air-jet drying device is provided, so that the problem that the drying efficiency is affected due to the fact that the residual moisture in the wafer box grooves placed on the grid plate is difficult to discharge in the prior art is solved. In order to achieve the aim, the wafer box heating air-jet drying device comprises an air-jet drying machine body, wherein the inner wall of the upper end of the air-jet drying machine body is provided with an electric heater, The spray head is obliquely arranged at the left inner wall of the jet dryer body, the spray head is connected with a spray atomizer at the left side through an atomization pipe, the spray atomizer is connected with an IPA mixed solution cylinder through a perfusion pipe, the inner wall at the lower end of the jet dryer body is connected with a rotating column through a bearing seat, an object placing frame plate is welded at the outer side of the rotating column, an L-shaped pressing plate is limited and connected in a groove at the upper end of the object placing frame plate, a wafer box body is pressed between the object placing frame plate and the L-shaped pressing plate, clamping plates are symmetrically clamped on two side surfaces of the L-shaped pressing plate, an external thread block is welded on the clamping plates through fixing columns, and an adjusting groove block is connected with the external thread block through an internal thread groove in a threaded manner. Furthermore, a cabinet door is arranged on the front surface of the jet dryer body, a receiver is fixed on the inner wall of the left side of the jet dryer body, and the receiver is positioned at the position right above the spray head. Further, a rubber plug is plugged at the left slot of the jet dryer body, a motor is fixed on the upper surface of the jet dryer body, and the lower end of the motor is connected with the rotary column through a coupler. Furthermore, the left side of the motor is provided with a jet atomizer, the right side of the motor is provided with an IPA mixed solution cylinder, and the cylindrical surface of the rotary column is embedded with a laser positioner. Furthermore, the lower end surface of the L-shaped pressing plate is adhered with an elastic pad, the elastic pad is tightly attached to the upper surface of the wafer box body, and the upper surface of the object placing frame plate is fixedly connected with an adjusting groove block in a threaded manner. Furthermore, an internal thread groove is formed in the inner side of the adjusting groove block, and a column head is welded on the other end face of the external thread block. Furthermore, the side surface of the clamping plate is attached to the L-shaped pressing plate through an anti-slip pad, a sealing ring is arranged on the surface of the notch of the adjusting groove block, and a column head and a fixing column respectively penetrate through the sealing ring. The wafer box heating air-jet drying device has the beneficial effects that the wafer box body is obliquely pressed by utilizing the object placing frame plate and the L-shaped pressing plate, the pressing position of the L-shaped pressing plate is clamped and fixed by rotating and adjusting the clamping plates at the two sides of the L-shaped pressing plate, so that the groove