Search

CN-224216053-U - Wafer levelness detection device for horizontal electroplating cavity

CN224216053UCN 224216053 UCN224216053 UCN 224216053UCN-224216053-U

Abstract

The utility model discloses a wafer levelness detection device for a horizontal electroplating cavity, which is characterized in that detection assemblies are symmetrically arranged on two sides of a wafer rotating platform, a photoelectric sensor is used for replacing a traditional mechanical probe to detect wafer warpage, the warpage detection of the whole peripheral edge of a wafer can be completed in a single rotation period, the problem of dead zones in traditional single-point detection is avoided, the surface of the wafer can be prevented from being scratched or polluted, the device is particularly suitable for a semiconductor electroplating process with extremely high cleanliness requirements, the height of the detection assembly of a fixed sensor can be adjusted, different wafer sizes or process parameters can be quickly adapted, the height of the detection assembly can be adjusted according to the height of the wafer on the wafer rotating platform, the position of a sensor optical path can be accurately calibrated, the optical path and the wafer edge are ensured to be at ideal values, and the detection sensitivity and the false triggering prevention are considered.

Inventors

  • TAO MINGSHENG

Assignees

  • 苏州盈泷泽半导体设备有限公司

Dates

Publication Date
20260508
Application Date
20250529

Claims (8)

  1. 1. A wafer levelness detection device used in a horizontal electroplating cavity is characterized by comprising detection assemblies symmetrically arranged at two sides of a wafer rotating platform in the radial direction of a wafer, wherein a transmitter of a photoelectric sensor is fixed on the detection assembly positioned at one side of the wafer rotating platform, a receiver of the photoelectric sensor is fixed on the detection assembly positioned at the other opposite side of the wafer rotating platform, The detection assembly comprises a supporting seat (4) with adjustable height, a sensor support (2) fixed on the supporting seat (4) and a sensor mounting box (1) covering the sensor support (2), wherein a transmitter or a receiver (3) of the photoelectric sensor vertically penetrates through the sensor support (2) and enables the lower part of the transmitter or the receiver to be placed in the supporting seat (4), an upper probe is placed in the sensor mounting box (1), and a straight slot hole (11) for enabling a horizontal light beam of the photoelectric sensor to penetrate is formed in the side face, facing the wafer rotating platform, of the sensor mounting box (1).
  2. 2. The wafer levelness detection apparatus for use in a horizontal plating chamber of claim 1 wherein the outer surfaces of the probes of the transmitter and receiver of the photosensor are each wrapped with a protective film.
  3. 3. The wafer levelness detection apparatus for use in a horizontal plating chamber of claim 2, wherein the protective film is PFA material.
  4. 4. The wafer levelness detection device for the horizontal electroplating cavity according to claim 1, wherein the sensor support (2) comprises a support substrate (21) and a sensor fixing block (22) fixed on the surface of the support substrate (21), a groove is formed in the lower surface of the support substrate (21), a through hole (23) for enabling a transmitter or a receiver (3) of the photoelectric sensor to pass through is longitudinally formed in the center of the sensor fixing block (22), a first fixing hole (24) is transversely formed in the sensor fixing block (22), and the transmitter or the receiver (3) of the photoelectric sensor is tightly fixed through jackscrews penetrating through the first fixing hole (24).
  5. 5. The wafer levelness detection device for the horizontal electroplating cavity according to claim 1, wherein the supporting seat (4) comprises a fixed base (41) and a supporting rod (42) sleeved on the fixed base (41), a plurality of clamping grooves (43) are symmetrically arranged on the circumference direction of the upper portion of the fixed base (41), a plurality of protrusions clamped in the clamping grooves (43) extend out of corresponding positions of the inner wall of the supporting rod (42), a plurality of second fixing holes (44) are formed in the circumference direction of the lower portion of the supporting rod (42), and the supporting rod (42) is fixed with the fixed base (41) through jackscrews penetrating through the second fixing holes (44).
  6. 6. The wafer levelness detection device for the horizontal electroplating cavity according to claim 1, wherein the supporting seat (4), the sensor bracket (2) and the sensor mounting box (1) are made of any one of PVC, PTFE, PEEK, PP, aluminum alloy, glass fiber reinforced plastic and aluminum alloy.
  7. 7. Wafer levelness detection apparatus for use in a horizontal plating chamber according to claim 1, wherein the straight slot hole (11) is in a kidney-shape.
  8. 8. The wafer levelness detection apparatus for use in a horizontal plating chamber of claim 1, wherein a plurality of sets of detection assemblies are provided in a circumferential direction of the wafer rotation stage.

Description

Wafer levelness detection device for horizontal electroplating cavity Technical Field The utility model relates to the technical field of semiconductor electroplating, in particular to a wafer levelness detection device for a horizontal electroplating cavity. Background In a horizontal plating process, a wafer is placed on a rotating platen for surface metallization. Due to factors such as high-speed rotation and electroplating solution impact, micron-sized warpage of the wafer is easy to occur, and the uniformity of the plating layer is reduced. The traditional detection method is usually used for off-line measurement or mechanical probe contact detection, and has the problems of poor real-time performance, possibility of scratching or polluting the surface of the wafer and the like. Disclosure of Invention In view of the above, the present utility model provides a wafer levelness detecting device for a horizontal electroplating chamber, which is used for solving the above-mentioned problems in the prior art. A wafer levelness detection device for a horizontal electroplating cavity comprises detection components symmetrically arranged at two sides of a wafer rotating platform in the radial direction of a wafer, wherein a transmitter of a photoelectric sensor is fixed on the detection component positioned at one side of the wafer rotating platform, a receiver of the photoelectric sensor is fixed on the detection component positioned at the other opposite side of the wafer rotating platform, The detection assembly comprises a supporting seat with adjustable height, a sensor bracket fixed on the supporting seat and a sensor mounting box covering the sensor bracket, wherein a transmitter or a receiver of the photoelectric sensor vertically penetrates through the sensor bracket, the lower part of the transmitter or the receiver of the photoelectric sensor is arranged in the supporting seat, an upper probe is arranged in the sensor mounting box, and a straight slot hole for allowing a horizontal light beam of the photoelectric sensor to penetrate through is formed in the side face, facing the wafer rotating platform, of the sensor mounting box. Preferably, the outer surfaces of the probes of the transmitter and the receiver of the photoelectric sensor are wrapped with a layer of protective film. Preferably, the protective film is made of PFA material. Preferably, the sensor support comprises a support substrate and a sensor fixing block fixed on the surface of the support substrate, a groove is formed in the lower surface of the support substrate, a through hole for enabling a transmitter or a receiver of the photoelectric sensor to pass through is longitudinally formed in the center of the sensor fixing block in a penetrating mode, a first fixing hole is transversely formed in the sensor fixing block, and the transmitter or the receiver of the photoelectric sensor is tightly fixed through jackscrews penetrating through the first fixing hole. Preferably, the supporting seat comprises a fixed base and a supporting rod sleeved on the fixed base, a plurality of clamping grooves are symmetrically formed in the circumferential direction of the upper portion of the fixed base, a plurality of protrusions clamped in the clamping grooves extend out of corresponding positions of the inner wall of the supporting rod, a plurality of second fixing holes are formed in the circumferential direction of the lower portion of the supporting rod, and the supporting rod is fixed with the fixed base through jackscrews penetrating through the second fixing holes. Preferably, the supporting seat, the sensor bracket and the sensor mounting box are made of any one of PVC, PTFE, PEEK, PP, aluminum alloy, glass fiber reinforced plastic and aluminum alloy. Preferably, the straight slot hole is in a waist shape. Preferably, a plurality of groups of detection assemblies are arranged in the circumferential direction of the wafer rotating platform. The beneficial effects of the utility model are as follows: 1. according to the application, the detection assemblies are symmetrically arranged on both sides of the wafer rotating platform, and the photoelectric sensor is used for replacing the traditional mechanical probe to detect the wafer warpage, so that the warpage detection of the whole peripheral edge of the wafer can be completed in a single rotation period, the blind area problem of the traditional single-point detection is avoided, the surface of the wafer can be prevented from being scratched or polluted, and the wafer rotating platform is particularly suitable for a semiconductor electroplating process with extremely high requirements on cleanliness; and the height of the detection component of the fixed sensor is adjustable, different wafer sizes or process parameters can be quickly adapted, and the height of the detection component can be adjusted according to the wafer height on the wafer rotating platform, so that the position of a