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CN-224216113-U - Quality detection device for wafer film with iron ring

CN224216113UCN 224216113 UCN224216113 UCN 224216113UCN-224216113-U

Abstract

The utility model relates to the technical field of detection devices, in particular to a quality detection device for a wafer with an iron ring after film pasting. Its technical scheme includes that the pad pasting dish still includes the pad pasting dish, pad pasting dish fixed mounting is on the pad pasting dish, one side of pad pasting dish is provided with the line and sweeps the light source, the top of pad pasting dish is provided with CCD, be provided with the Y axle on the pad pasting dish for drive wafer and pad pasting and remove when detecting, cooperation CCD accomplishes the detection area and covers, be provided with the iron ring on the pad pasting dish, the iron ring is located the outside of pad pasting dish. The utility model realizes photographing detection of the wafer and the iron ring after film pasting, avoids additional device requirements caused by follow-up defects, and improves the processing efficiency.

Inventors

  • LIU CHUANDONG
  • ZHOU PENGCHENG

Assignees

  • 争丰半导体科技(苏州)有限公司

Dates

Publication Date
20260508
Application Date
20250512

Claims (6)

  1. 1. The utility model provides a take quality detection device behind ring wafer pad pasting, includes ring dish (1), its characterized in that still includes: The film pasting disc (4), film pasting disc (4) fixed mounting is on hoop dish (1), one side of hoop dish (1) is provided with the line and sweeps light source (5), the top of hoop dish (1) is provided with CCD (7), be provided with the Y axle on film pasting disc (4) for drive wafer and film pasting and remove when detecting, cooperate CCD (7) to accomplish the regional cover of detection.
  2. 2. The post-film quality detection device for the wafer with the iron ring according to claim 1, wherein the iron ring (2) is arranged on the iron ring disc (1), and the iron ring (2) is positioned on the outer side of the film disc (4).
  3. 3. The device for detecting the quality of the wafer with the iron ring after film sticking according to claim 1, wherein a lens (6) is fixedly arranged on the CCD (7).
  4. 4. The post-lamination quality inspection device for wafer with iron ring according to claim 1, wherein the CCD (7) is a high-pixel line scanning camera.
  5. 5. The device for detecting the quality of the wafer with the iron ring after film pasting according to claim 1, wherein the scanning frequency of the line scanning light source (5) is not lower than 100Hz.
  6. 6. The post-lamination quality inspection device for wafers with iron rings according to claim 1, wherein the iron ring disc (1) is provided with a wafer (3), and the wafer (3) is located inside the lamination disc (4).

Description

Quality detection device for wafer film with iron ring Technical Field The utility model relates to the technical field of detection devices, in particular to a quality detection device for a wafer with an iron ring after film pasting. Background In the semiconductor manufacturing process, the wafer film with the iron ring is one of key working procedures, and the film quality directly influences the subsequent production and the product performance. At present, after the wafer with the iron ring is pasted with the film, either a special detection device is lacked, or the film pasting effect is judged manually, such as checking the film pasting precision, whether bubbles and wrinkles exist, whether dirt exists or not, and the like. The manual detection has a plurality of defects, on one hand, human eyes judge the defects easily influenced by subjective factors and fatigue, and the consistency of judging standards is difficult to ensure, so that the misjudgment rate is high, on the other hand, the manual detection is low in efficiency, the problem of omission is easy to occur, defective products flow into subsequent procedures, the quality of products is unstable, and the production cost and the production period are increased. Disclosure of utility model The utility model aims to solve the problem in the background technology that the film pasting effect needs to be judged manually after film pasting is completed, and provides a quality detection device for a wafer with an iron ring after film pasting. The technical scheme of the utility model is that the quality detection device after film pasting of the wafer with the iron ring comprises an iron ring disc and further comprises: The film pasting disc is fixedly arranged on the iron ring disc, a linear scanning light source is arranged on one side of the iron ring disc, a CCD (charge coupled device) is arranged at the top of the iron ring disc, and a Y-axis is arranged on the film pasting disc and used for driving a wafer and a film to move during detection and matching with the CCD to complete coverage of a detection area. Optionally, an iron ring is arranged on the iron ring disc, and the iron ring is positioned on the outer side of the film pasting disc. Optionally, a lens is fixedly installed on the CCD. Optionally, the CCD is a high pixel line scan camera. Optionally, the scanning frequency of the line scanning light source is not lower than 100Hz. Optionally, a wafer is arranged on the iron ring disc, and the wafer is located at the inner side of the film pasting disc. Compared with the prior art, the utility model has the following beneficial technical effects: According to the utility model, the film pasting disc is moved to the CCD photographing position, the CCD performs photographing detection on the film (the film pasting disc Y-axis movement is matched with the CCD to photograph the whole film area), the film pasting OK product can continue to be put down to the device, the NG product is reported to the police and is manually processed, and a high-pixel line scanning camera and a high-precision line scanning light source are adopted to judge whether the film has offset, obvious bubbles, wrinkles, dirt and the like, so that the additional device requirements caused by defects in the follow-up process are avoided. Drawings FIG. 1 is a schematic diagram of a device for detecting quality of a wafer with an iron ring after film lamination; fig. 2 is a schematic view of a lens and a CCD structure. The reference numerals are 1, an iron ring disc, 2, an iron ring, 3, a wafer, 4, a film pasting disc, 5, a line scanning light source, 6, a lens, 7 and a CCD. Detailed Description The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not i