Search

CN-224216170-U - Pyroelectric infrared sensor with low heat loss

CN224216170UCN 224216170 UCN224216170 UCN 224216170UCN-224216170-U

Abstract

The utility model belongs to the technical field of sensors, in particular to a pyroelectric infrared sensor with low heat loss, which comprises a packaging base, wherein a circuit board is arranged on the top surface of the packaging base, an assembly structure is arranged on the top surface of the circuit board, the assembly structure comprises symmetrically arranged fixing rods which are fixedly connected to the top surface of the circuit board, the fixing rods and a support frame can be used in a matched mode, a certain distance exists between a thermosensitive unit and the circuit board after assembly is completed, the thermosensitive unit is not in direct contact with the circuit board, the thermosensitive unit is only in contact with a plurality of connecting columns for heat conduction, the physical contact area between the thermosensitive unit and the support structure is reduced, the heat conduction from the thermosensitive unit to the outside through a solid path is greatly reduced, the heat loss is reduced, and the assembly structure has a simple structure and is more convenient for assembling the thermosensitive unit compared with an MEMS microbridge technology.

Inventors

  • WANG ZISHUO
  • WANG HUAIYONG
  • Jing Haohao

Assignees

  • 王子硕

Dates

Publication Date
20260508
Application Date
20250609

Claims (9)

  1. 1. The pyroelectric infrared sensor with low heat loss comprises a packaging base (1) and is characterized in that a circuit board (3) is arranged on the top surface of the packaging base (1), and an assembly structure (4) is arranged on the top surface of the circuit board (3); The assembly structure (4) comprises fixing rods (41) which are symmetrically arranged, wherein the fixing rods (41) are fixedly connected to the top surface of the circuit board (3), each fixing rod (41) is fixedly connected with a supporting frame (43) at the top end, the supporting frames (43) at two sides are symmetrically arranged, each supporting frame (43) is fixedly connected with a supporting plate (47), each supporting plate (47) is fixedly connected with a connecting column (48) at two ends, each connecting column (48) is fixedly connected with a supporting ring (49) on the outer wall of the connecting column (48), a thermosensitive unit (5) is arranged at the top of the circuit board (3), each thermosensitive unit (5) is close to each connecting column (48) and is fixedly connected with a connecting plate (410), each connecting plate (410) is provided with a third connecting hole (411), and each connecting plate (410) is respectively arranged on the top surface of the adjacent supporting ring (49) and is fixedly connected with a third connecting hole (411).
  2. 2. The pyroelectric infrared sensor with low heat loss according to claim 1, wherein a connecting pin (51) is arranged at the bottom of the thermosensitive unit (5), the bottom end of the connecting pin (51) is welded on the top surface of the circuit board (3), each fixing rod (41) is made of an insulating material, and each supporting frame (43) is of a Z-shaped structure.
  3. 3. The pyroelectric infrared sensor with low heat loss according to claim 1, wherein threaded holes (42) are formed in the top end of each fixing rod (41), mounting holes (44) are formed in the top of each supporting frame (43), hidden grooves (45) are formed in positions, close to the mounting holes (44), of the top of each supporting frame (43), connecting bolts (46) are arranged in each mounting hole (44), the supporting frames (43) penetrate through the mounting holes (44) and the threaded holes (42) through the connecting bolts (46) to be fixedly connected with the fixing rods (41), and the tops of the connecting bolts (46) are respectively arranged in the close hidden grooves (45).
  4. 4. The pyroelectric infrared sensor with low heat loss according to claim 1, wherein an encapsulation case (6) is arranged on the outer side of the circuit board (3), and the encapsulation case (6) is fixedly connected to the top surface of the encapsulation base (1).
  5. 5. The pyroelectric infrared sensor with low heat loss as recited in claim 4 wherein said package cover (8) is fixedly connected to the top surface of said package case (6), and a filter (81) is provided at the center of said package cover (8).
  6. 6. The pyroelectric infrared sensor with low heat loss according to claim 4, wherein a plurality of first connecting holes (11) are formed in the packaging base (1), second connecting holes (31) are formed in positions, close to the first connecting holes (11), of the circuit board (3), main pins (2) are arranged in the first connecting holes (11), and the top ends of the main pins (2) penetrate through the second connecting holes (31) close to the top ends of the circuit board (3) and are welded on the top surface of the circuit board (3).
  7. 7. The pyroelectric infrared sensor with low heat loss according to claim 6, wherein a heat insulation board (9) is arranged between the circuit board (3) and the packaging base (1), a fourth connecting hole (91) is formed in the position, close to each first connecting hole (11), of the heat insulation board (9), and the main pins (2) respectively penetrate through the fourth connecting holes (91) close to each other.
  8. 8. The pyroelectric infrared sensor with low heat loss according to claim 7, wherein the inner wall of the packaging shell (6) is fixedly connected with a heat insulation layer (7).
  9. 9. The pyroelectric infrared sensor with low heat loss according to claim 8, wherein the heat insulation layer (7) and the heat insulation plate (9) are both provided with insulating materials.

Description

Pyroelectric infrared sensor with low heat loss Technical Field The utility model belongs to the technical field of sensors, and particularly relates to a pyroelectric infrared sensor with low heat loss. Background The pyroelectric infrared sensor is a sensor for detecting a change in infrared radiation using a pyroelectric effect. The infrared sensor can sense the infrared radiation change caused by the object temperature change, and is widely applied to the fields of human body induction, intrusion alarm, automatic illumination control and the like, and the core principle of the pyroelectric infrared sensor is the pyroelectric effect. When a temperature change of the infrared radiation emitted by the object affects the sensor surface, the charge of the sensor material changes. Pyroelectric materials have the property of generating charges when temperature changes, sensors detect temperature fluctuations by measuring these changes, heat loss of pyroelectric infrared sensors is one of the main limiting factors of pyroelectric detector performance, including heat conduction and thermal radiation induced effects, MEMS microbridge technology is commonly used in the prior art to reduce contact of thermosensitive elements with circuit boards, but complex MEMS processing technology is involved, resulting in greater difficulty and higher cost of sensor assembly; in order to solve the above problems, the present application provides a pyroelectric infrared sensor with low heat loss. Disclosure of utility model To solve the problems set forth in the background art. The utility model provides a pyroelectric infrared sensor with low heat loss, which has the characteristic of reducing the heat loss. In order to achieve the aim, the utility model provides the technical scheme that the pyroelectric infrared sensor with low heat loss comprises a packaging base, wherein a circuit board is arranged on the top surface of the packaging base, and an assembly structure is arranged on the top surface of the circuit board; The assembly structure comprises fixing rods which are symmetrically arranged, wherein the fixing rods are fixedly connected to the top surface of the circuit board, each fixing rod is fixedly connected with a supporting frame at the top end of the fixing rod, the supporting frames at the two sides are symmetrically arranged, each supporting frame is fixedly connected with a supporting plate, each supporting plate is fixedly connected with a connecting column at the two ends, each supporting ring is fixedly connected to the outer wall of each connecting column, a thermosensitive unit is arranged at the top of the circuit board, each thermosensitive unit is close to each connecting column, a connecting plate is fixedly connected to the position of each connecting column, each connecting plate is provided with a third connecting hole, each connecting plate is respectively arranged on the top surface of each supporting ring, and each connecting column is fixedly connected to the corresponding third connecting hole. As the pyroelectric infrared sensor with low heat loss, the bottom of the thermosensitive unit is preferably provided with the connecting pin, the bottom end of the connecting pin is welded on the top surface of the circuit board, each fixing rod is made of an insulating material, and each supporting frame is of a Z-shaped structure. As the pyroelectric infrared sensor with low heat loss, preferably, the top end of each fixing rod is provided with a threaded hole, the top of each supporting frame is provided with a mounting hole, the top of each supporting frame is provided with a hidden groove close to the mounting hole, each mounting hole is internally provided with a connecting bolt, the supporting frame is fixedly connected with the fixing rod by penetrating through the mounting hole and the threaded hole through the connecting bolts, and the tops of the connecting bolts are respectively arranged in the hidden grooves close to each other. Preferably, the pyroelectric infrared sensor with low heat loss is characterized in that an encapsulation shell is arranged on the outer side of the circuit board and fixedly connected to the top surface of the encapsulation base. As the pyroelectric infrared sensor with low heat loss, the utility model is preferable, the top surface of the packaging shell is fixedly connected with a packaging cover, and the center of the packaging cover is provided with a filter lens. As the pyroelectric infrared sensor with low heat loss, the packaging base is preferably provided with a plurality of first connecting holes, the position, close to each first connecting hole, of the circuit board is provided with a second connecting hole, each first connecting hole is internally provided with a main pin, and the top ends of the main pins penetrate through the second connecting holes close to each other and are welded on the top surface of the circuit board. As the pyroelectric infra