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CN-224216754-U - Semiconductor chip high temperature test fixture with heat radiation structure

CN224216754UCN 224216754 UCN224216754 UCN 224216754UCN-224216754-U

Abstract

The utility model discloses a semiconductor chip high-temperature test fixture with a heat radiation structure, which belongs to the field of semiconductor chips, and comprises a base, wherein the middle part above the base is rotationally connected with a turntable, the surface of the turntable is provided with four arc grooves at equal intervals, the interiors of the four arc grooves are all connected with fixed blocks in a sliding way, in the scheme, when two mounting plates slide under the cooperation of the arc grooves and a sliding block, the middle part of a bilateral telescopic rod can extrude a moving block, the movable block is driven to slide above the base, the linkage mechanism realizes synchronous displacement of the air outlet cover and the mounting plate, so that cold air transmitted by the two air coolers inside the base through the telescopic pipe and the connecting pipe can be always aligned to a chip area, an additional control device is not needed, and the heat dissipation position can be automatically adjusted according to the size of the chip while the chip in a high-temperature state after the test is cooled only by the linkage between mechanical structures, so that the heat dissipation efficiency is improved.

Inventors

  • ZHANG SHUPING

Assignees

  • 盐城芯辉电子科技有限公司

Dates

Publication Date
20260508
Application Date
20250522

Claims (7)

  1. 1. A semiconductor chip high-temperature test fixture with a heat radiation structure comprises a base (1) and is characterized in that a turntable (11) is rotationally connected to the middle of the upper side of the base (1), four arc grooves (12) are formed in the surface of the turntable (11) at equal intervals, fixing blocks (13) are slidably connected to the inner parts of the arc grooves (12), mounting plates (14) are fixedly connected to the upper sides of the fixing blocks (13), sliding blocks (15) are fixedly connected to the lower sides of the mounting plates (14), sliding blocks (23) are slidably connected to the upper sides of the base (1), air outlet covers (22) are fixedly connected to the upper sides of the two moving blocks (23), and the two moving blocks (23) are respectively located in the middle of the two mounting plates (14).
  2. 2. The high-temperature test fixture for semiconductor chips with heat dissipation structures as defined in claim 1, wherein two bilateral telescopic rods (24) are arranged in the middle of the two mounting plates (14), and two output ends of the bilateral telescopic rods (24) are respectively connected with one sides of the two mounting plates (14) in a rotating mode.
  3. 3. The high-temperature test fixture for the semiconductor chip with the heat radiation structure according to claim 2, wherein the middle parts of the two bilateral telescopic rods (24) are respectively connected with the inner parts of the moving blocks (23) in a sliding mode, two air coolers (19) are arranged in the base (1), and the output ends of the two air coolers (19) are fixedly connected with telescopic tubes (2).
  4. 4. The high-temperature test fixture for the semiconductor chip with the heat radiation structure according to claim 3, wherein one ends of the two telescopic pipes (2) far away from the air cooler (19) are fixedly connected with connecting pipes (21), and one ends of the two connecting pipes (21) far away from the telescopic pipes (2) are respectively and fixedly connected with the lower parts of the two air outlet covers (22).
  5. 5. The semiconductor chip high-temperature test fixture with the heat dissipation structure as set forth in claim 1, wherein the top ends of the four mounting plates (14) are respectively and rotatably connected with bolts (16), the outer walls of the bolts (16) are in threaded connection with clamping blocks (17), and the clamping blocks (17) are in sliding connection with the mounting plates (14).
  6. 6. The semiconductor chip high temperature test fixture with heat dissipation structure as set forth in claim 5, wherein the end of the bolt (16) above the mounting plate (14) is fixedly connected with a knob (18).
  7. 7. The semiconductor chip high-temperature test fixture with the heat radiation structure of claim 6, wherein a motor (25) is fixedly connected below the base (1), a bevel gear (26) is fixedly connected at the output end of the motor (25) and a rotating shaft below the turntable (11), and the two bevel gears (26) are meshed.

Description

Semiconductor chip high temperature test fixture with heat radiation structure Technical Field The utility model relates to the field of semiconductor chips, in particular to a semiconductor chip high-temperature test fixture with a heat dissipation structure. Background In the research and development and production process of semiconductor chips, high-temperature test is a key link for ensuring the performance reliability of the chips, along with the rapid development of semiconductor technology, the integration level of the chips is continuously improved, the size is increasingly small, the high-temperature test fixture is more severely required, a large amount of heat can be generated by the chips in the high-temperature test, if the chips are not timely radiated, the internal structures of the chips can be possibly changed due to the fact that the chips are in a high-temperature state for a long time, such as the performance of transistors is changed, the metal interconnection layer is migrated, and the like, so that the electrical performance and the stability of the chips are affected, and the service life of the chips is shortened. Disclosure of utility model 1. Technical problem to be solved Aiming at the problems existing in the prior art, the utility model aims to provide a semiconductor chip high-temperature test fixture with a heat dissipation structure, which can realize the function of dissipating heat of a semiconductor chip in a high-temperature state after test. 2. Technical proposal In order to solve the problems, the utility model adopts the following technical scheme. The utility model provides a semiconductor chip high temperature test fixture with heat radiation structure, includes the base, the middle part of the top of base is rotated and is connected with the carousel, four arc grooves have been seted up to the surface equidistance of carousel, four the equal sliding connection in inside of arc groove has the fixed block, four the equal fixedly connected with mounting panel in top of fixed block, four the equal fixedly connected with slider in below of mounting panel, four the equal sliding connection of slider is in the top of base, the equal sliding connection in both sides of base top has the movable block, two the equal fixedly connected with air-out cover in top of movable block, two the movable block is located the middle part of two mounting panels respectively. Further, two the middle parts of mounting panel are provided with bilateral telescopic link, two output of bilateral telescopic link rotate with one side of two mounting panels respectively and are connected. Further, two bilateral telescopic link's middle part with respectively with the inside sliding connection of movable block, the internally mounted of base has two air-cooler, two the equal fixedly connected with flexible pipe of output of air-cooler. Further, two the telescopic pipe is kept away from the equal fixedly connected with connecting pipe of one end of air-cooler, two the connecting pipe is kept away from the telescopic pipe one end respectively with the below fixed connection of two air-out covers. Further, the top of four mounting panels all rotates and is connected with the bolt, the outer wall threaded connection of bolt has the grip block, grip block and mounting panel sliding connection. Further, one end of the bolt above the mounting plate is fixedly connected with a knob. Further, the motor is fixedly connected to the lower side of the base, bevel gears are fixedly connected to the output end of the motor and the rotating shaft below the rotating disc, and the two bevel gears are meshed. 3. Advantageous effects Compared with the prior art, the utility model has the advantages that: (1) In this scheme, the carousel of connection is rotated in base top middle part, four arc wall and fixed block sliding connection that its surface equidistance was seted up for the mounting panel can nimble adjustment position, and the semiconductor chip installation demand of different sizes and specification can be adapted to in this kind of design, and slider and base sliding fit of four mounting panel below have further strengthened the stability and the adjustability of mounting panel, can fix a position the chip more accurately, have improved the precision and the reliability of test. (2) In this scheme, when two mounting panels take place to slide under the cooperation of arc wall and slider, the middle part of bilateral telescopic link can extrude the movable block, makes the movable block slide in the top of base, and this linkage mechanism has realized the synchronous displacement of air-out cover and mounting panel for the inside two air-cooler of base can aim at the chip region all the time through flexible pipe, the cold wind of connecting pipe transmission, only rely on the linkage between the mechanical structure, when can dispel the heat to the chip that is in the high temperature state after the te