CN-224216760-U - High-frequency probe for wafer test

Abstract

The utility model provides a high-frequency probe for wafer testing, and belongs to the technical field of high-frequency probes. The high-frequency probe for wafer test comprises an outer cylinder, wherein a transmission rotary blade is movably sleeved in the outer cylinder, six groups of slots are formed in the transmission rotary blade, detection probes are movably sleeved on the inner walls of the slots, and the six groups of detection probes are in a circumferential array with a connecting rod as a circle center. The utility model has the advantages that the knob is rotated, the transmission shaft drives the gear to be meshed with the tooth block, the tooth block drives the transmission rotary blade to synchronously rotate by taking the connecting rod as the circle center, so that the synchronous rotation of a plurality of groups of detection probes is realized, when one group of detection probes moves to a proper position, the detection probes are automatically pushed out, after the current group of probes are worn, the knob is rotated again to be quickly replaced, the complex operation of the test flow is not required to be interrupted, the replacement time is reduced in a high-flux test environment, the uninterrupted test process can be ensured, the test efficiency is effectively improved, and the idle time of equipment is reduced.

Inventors

• Wen Kuohua
• LU BINGKUN

Assignees

• 先得利精密测试探针(深圳)有限公司

Dates

Publication Date

20260508

Application Date

20250515

Claims (6)

1. 1. The utility model provides a high-frequency probe for wafer test, its characterized in that, includes urceolus (1), the inside activity of urceolus (1) has cup jointed transmission rotary vane (11), six groups have been seted up to the inside of transmission rotary vane (11) six groups the inner wall of slotted hole all activity has cup jointed detection probe (5), six groups detection probe (5) use connecting rod (15) as the centre of a circle to be the circumference array, the equal fixedly connected with spacing separation blade one (8) of top outer wall of detection probe (5), the one end of spacing separation blade one (8) side fixedly connected with spring two (12), the other end and the transmission rotary vane (11) fixed connection of spring two (12), the outer wall fixedly connected with a plurality of tooth piece (17) of transmission rotary vane (11), tooth piece (17) are circumference array, the outer wall and gear (13) of tooth piece (17) mesh, the inside fixedly cup joint transmission shaft (14) of gear (13), the outer wall fixedly connected with knob (4) of transmission shaft (14).
2. 2. The high-frequency probe for wafer testing according to claim 1, wherein a chute is formed in the outer barrel (1), the chute is in a circular ring shape, one side of the circular ring is provided with a V shape, two extending ends of the V shape are connected with the circular ring, six groups of limiting sliding blocks I (7) are sleeved on the inner wall of the chute in a sliding manner, and a connecting pile casing (2) is fixedly connected to the outer wall of the chute.
3. 3. The high-frequency probe for wafer testing according to claim 1, wherein a connecting rod (15) is movably sleeved in the transmission rotary blade (11), one end of the connecting rod (15) is fixedly connected with a limiting baffle plate II (16), the outer wall of the limiting baffle plate II (16) is attached to the outer wall of the transmission rotary blade (11), and the other end of the connecting rod (15) is fixedly connected with the top end of the inner wall of the outer cylinder (1).
4. 4. The high-frequency probe for wafer testing according to claim 1, wherein the outer wall of the transmission shaft (14) is movably sleeved with a connection limiting cylinder (3), the connection limiting cylinder (3) is in a shape of two circles in a size of connection, one end inner wall of the connection limiting cylinder (3) is fixedly connected with the outer cylinder (1), and the other end inner wall of the connection limiting cylinder (3) is movably sleeved with a gear (13).
5. 5. The high-frequency probe for wafer testing according to claim 1, wherein two groups of limit grooves are formed in the outer wall of the outer cylinder (1), two groups of limit sliding blocks (10) are sleeved on the inner wall of each limit groove in a sliding mode, a telescopic sleeve (6) is fixedly connected to the outer wall of each limit sliding block (10), one end of a first spring (9) is fixedly connected to the inner wall of each telescopic sleeve (6), and the other end of the first spring (9) is fixedly connected with the outer cylinder (1).
6. 6. The high-frequency probe for wafer testing according to claim 1, wherein a round hole is formed in the side face of the outer cylinder (1), one group of detection probes (5) are movably sleeved on the inner wall of the round hole, and the position of the round hole is aligned with the V-shaped tip of the chute.

Description

High-frequency probe for wafer test Technical Field The utility model relates to the technical field of high-frequency probes, in particular to a high-frequency probe for wafer testing. Background The high frequency probe in wafer test is a tool for testing high frequency chips and wafers, and is mainly used for extracting and analyzing high frequency signals from chips or wafers. In the wafer test process, the probe of the high-frequency probe is gradually worn due to long-term friction, after the probe is worn, the shape of the probe tip can be changed, so that the contact area is increased or poor contact is caused, the contact resistance is increased, the accuracy of a measurement signal is affected, the probe needs to be replaced in time when the probe is worn, the test cost is increased, and the production detection efficiency is reduced due to frequent replacement. Accordingly, the present utility model provides a high frequency probe for wafer testing. Disclosure of utility model The present utility model is directed to a high frequency probe for wafer testing to solve the above-mentioned problems. In order to achieve the above purpose, the present utility model provides the following technical solutions: The utility model provides a high-frequency probe for wafer test, includes the urceolus, the transmission rotary vane has been cup jointed to the inside activity of urceolus, six groups of slotted holes have been seted up to the inside of transmission rotary vane, six groups the inner wall of slotted hole has all been movably cup jointed the detection probe, six groups the detection probe uses the connecting rod as the centre of a circle to be the circumference array, the top outer wall of detection probe all fixedly connected with spacing separation blade one, the one end of the side fixedly connected with spring two of spacing separation blade one, the other end and the transmission rotary vane fixedly connected with of spring two, the outer wall fixedly connected with of transmission rotary vane a plurality of tooth pieces, the tooth piece is the circumference array, the outer wall and the gear meshing of tooth piece, the inside fixed transmission shaft that has cup jointed of gear, the outer wall fixedly connected with knob of transmission shaft. Further, the inside of urceolus has been seted up the spout, the spout is the ring form, just one side of ring sets up to be the V font, two extension ends of V font are connected with the ring, six group limit slider I has been cup jointed in the inner wall slip of spout, the outer wall fixedly connected with of spout is connected with the protective casing. Further, the inside activity of transmission rotary vane has cup jointed the connecting rod, the one end fixedly connected with spacing separation blade two of connecting rod, the outer wall of spacing separation blade two is laminated with the outer wall of transmission rotary vane mutually, the other end of connecting rod and the inner wall top fixed connection of urceolus. Further, the outer wall activity of transmission shaft has cup jointed and has been connected spacing section of thick bamboo, connect spacing section of thick bamboo and be two circular of size that connect, connect spacing section of thick bamboo's one end inner wall and urceolus fixed connection, connect spacing section of thick bamboo's the other end inner wall and gear activity cup joint. Further, two groups of limiting grooves are formed in the outer wall of the outer barrel, two groups of limiting sliding blocks II are sleeved on the inner wall of the limiting groove in a sliding mode, a telescopic sleeve is fixedly connected to the outer wall of the limiting sliding blocks II, one end of a first spring is fixedly connected to the inner wall of the telescopic sleeve, and the other end of the first spring is fixedly connected with the outer barrel. Further, a round hole is arranged on the side surface of the outer cylinder, one group of detection probes are movably sleeved on the inner wall of the round hole, the position of the round hole is aligned with the V-shaped tip of the chute, The utility model has the technical effects and advantages that: 1. Through rotatory knob, the transmission shaft drives gear and tooth piece meshing, tooth piece and then drive the transmission rotary vane and use the connecting rod to use the centre of a circle synchronous revolution, realize the synchronous rotation of multiunit detection probe, when a set of detection probe moved to suitable position, automatic release, after the current group probe wearing and tearing, rotatory knob again can quick replacement, need not to interrupt the test flow and carry out complicated operation, reduce the change time in high flux test environment, can ensure that the test process is uninterrupted, effectively improve efficiency of software testing, reduce equipment idle time. Drawings FIG. 1 is an external view of a high frequency probe for wafe