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CN-224216815-U - BGA chip rapid detection equipment

CN224216815UCN 224216815 UCN224216815 UCN 224216815UCN-224216815-U

Abstract

The utility model provides a quick detection device for a Ball Grid Array (BGA) chip, which comprises a test block, a probe plate and a dismounting mechanism, wherein the top end surface of the test block is provided with a test groove, the probe plate is arranged on the bottom wall of the test groove, the top end surface of the probe plate is provided with a plurality of probes, the dismounting mechanism is arranged on the test block and is positioned in the test groove in a dismounting mode, the BGA chip is arranged in the test groove in a penetrating mode, the bottom end test hole is sleeved on the probes, the dismounting mechanism comprises a jacking frame and a pressing component, the jacking frame is arranged on the probe plate and is positioned between the probes, the pressing component is arranged above the jacking frame in parallel, when the BGA chip is placed on the top end surface of the jacking frame, the pressing component drives the jacking frame and the BGA chip to move into the test groove, the test hole is sleeved on the probes, when the pressing component drives the jacking frame to move upwards, and the telescopic length distance of the telescopic component is larger than the thickness of the BGA chip.

Inventors

  • NI HUASHENG
  • LI JING
  • HUANG XUAN
  • WEI HU
  • WANG SHAOPING

Assignees

  • 合肥中科星翰科技有限公司

Dates

Publication Date
20260508
Application Date
20241127

Claims (6)

  1. 1. A quick detection device for BGA chips comprises a test block (2) with a test groove (3) formed in the end face of the top end, a probe board (15) arranged on the bottom wall of the test groove (3) and provided with a plurality of probes (16) on the end face of the top end, and a detaching mechanism arranged on the test block (2) and used for detaching a BGA chip (14) in the test groove (3), wherein the BGA chip (14) is arranged in the test groove (3) in a penetrating manner and sleeved on the probes (16) at the bottom end, and the quick detection device is characterized by comprising a jacking frame (10) arranged on the probe board (15) and positioned among the probes (16) and a pressing component arranged above the jacking frame (10) in parallel through a telescopic component, when the BGA chip (14) is placed on the end face of the top end of the jacking frame (10), the pressing component drives the jacking frame (10) and the BGA chip (14) to move inwards in the test groove (3), the pressing component drives the jacking frame (10) and the BGA chip (14) to move upwards when the testing hole is sleeved on the probes (16), and the pressing component drives the jacking frame (10) and the BGA chip (14) to move upwards by a telescopic length larger than the telescopic length of the BGA chip (14).
  2. 2. The BGA chip rapid detection device according to claim 1, wherein the bottom end of the test block (2) is fixedly arranged on the top end face of the base (1), the pressing assembly comprises a lifting member arranged above the base (1) through a mounting member and arranged in the vertical direction, a connecting rod (6) arranged above the jacking frame (10) through a telescopic assembly and transversely arranged, and a fixing plate (5) fixedly arranged on the side face of the bottom side of the connecting rod (6) and parallel to the top end face of the jacking frame (10), and the lifting member drives the fixing plate (5) to perform lifting motion in the vertical direction.
  3. 3. The BGA chip rapid detection device according to claim 2, wherein the lifting piece comprises two vertical rods (7) fixedly arranged on the top end face of the base (1) along the vertical direction, a cross rod (8) transversely arranged on the top end parts of the two vertical rods (7) and positioned right above the test block (2), and a telescopic cylinder (9) fixedly arranged above the top side surface of the cross rod (8) along the vertical direction, wherein the output end of the telescopic cylinder penetrates through the cross rod (8) and is fixedly connected with the middle part of the top side of the connecting rod (6).
  4. 4. The rapid BGA chip detection device of claim 3, wherein the top end face of the test block (2) is symmetrically provided with two lifting grooves (17) communicated with the inside of the test groove (3) relative to the test groove (3), the telescopic assembly comprises two telescopic arms (12) which are respectively movably arranged in the two different lifting grooves (17) in a penetrating mode, the bottom side faces of the telescopic arms are fixedly connected with the two side faces of the jack-up frame (10), two telescopic columns (13) which are respectively movably communicated with the top ends of the telescopic arms (12) in the inside of the telescopic columns (13), and limiting blocks (19) which are arranged in the limiting grooves (18) in a sliding mode and are fixedly connected with the bottom end parts of the telescopic columns (13), the sliding distance of the limiting blocks (19) in the limiting grooves (18) is larger than the thickness of the BGA chip (14), and the top ends of the telescopic columns (13) are fixedly connected with the bottom sides of the connecting rods (6).
  5. 5. A rapid inspection apparatus for BGA chip according to any one of claims 1 to 4, wherein the wall of the test groove (3) is provided with a plurality of through holes (4) penetrating the test block (2), one end opening of the through holes (4) is located in the test groove (3), and the other end opening of the through holes (4) is located on the side face of the test block (2).
  6. 6. The rapid BGA chip detection device according to claim 5, wherein four clamping blocks (11) for limiting the position of the BGA chip (14) on the top end face of the jack-up frame (10) are fixedly arranged at four corner positions of the top end face of the jack-up frame (10), the four clamping blocks (11) are L-shaped, and the opening directions of the four clamping blocks are all directed to the middle position of the top end face of the jack-up frame (10).

Description

BGA chip rapid detection equipment Technical Field The utility model relates to the technical field of BGA chip test equipment, in particular to BGA chip rapid detection equipment. Background With the increasing refinement of chip technology, the requirements on chip size, integration level and frequency are higher and higher, and meanwhile, the semiconductor production and testing processes are also changed day by day, but the highly complex chip design is facing various challenges of reliability, high quality and the like. In the prior art, the jig for testing the BGA chip tests the chip through the probe in the needle cavity, and in order to ensure that the probe can accurately correspond to the position of the chip, the needle cavity or a positioning groove for limiting the position of the chip is basically consistent with the size of the chip, so that each chip can correspond to the position of the probe during detection, the detection accuracy is improved, but the chip card is difficult to directly take out by hands due to tight matching when the chip card is in the positioning groove or the needle cavity, the chip is difficult to detach, and the detection efficiency of the BGA chip is reduced. Disclosure of utility model Aiming at the technical problems, the utility model provides the rapid detection equipment for the BGA chip, which can detect the BGA chip conveniently and improves the detection efficiency. The quick detection device for the BGA chip comprises a test block, a probe plate and a dismounting mechanism, wherein the top end face of the test block is provided with a test groove, the probe plate is arranged on the bottom wall of the test groove, the top end face of the probe plate is provided with a plurality of probes, the dismounting mechanism is arranged on the test block and used for dismounting the BGA chip in the test groove, the BGA chip is arranged in the test groove in a penetrating mode, the bottom end test hole is sleeved on the probes, the dismounting mechanism comprises a jack-up frame and a pressing assembly, the jack-up frame is arranged on the probe plate and positioned among the probes, the pressing assembly is arranged above the jack-up frame in parallel, when the BGA chip is placed on the top end face of the jack-up frame, the pressing assembly drives the jack-up frame and the BGA chip to move towards the inside of the test groove, the pressing assembly drives the jack-up frame and the BGA chip to move upwards when the pressing assembly drives the jack-up frame to move upwards, and the telescopic length distance of the telescopic assembly is larger than the thickness of the BGA chip. Preferably, the bottom end fixing of the test block is arranged on the top end face of the base, the pressing assembly comprises a lifting piece arranged above the base along the vertical direction through a mounting piece, a connecting rod arranged above the jacking frame through a telescopic assembly and transversely arranged, and a fixing plate fixedly arranged on the side face of the bottom side of the connecting rod and parallel to the top end face of the jacking frame, and the lifting piece drives the fixing plate to lift in the vertical direction. Preferably, the lifting piece comprises two vertical rods fixedly arranged on the end face of the top end of the base along the vertical direction, a cross rod transversely arranged on the end parts of the top ends of the two vertical rods and positioned right above the test block, and a telescopic cylinder fixedly arranged above the side face of the top side of the cross rod along the vertical direction, the output end of which penetrates through the cross rod and is fixedly connected with the middle part of the top side of the connecting rod. Preferably, two lifting grooves which are communicated with the inside of the test groove are symmetrically formed in the end face of the top end of the test block relative to the test groove, the telescopic assembly comprises two telescopic arms which are respectively movably arranged in two different lifting grooves in a penetrating mode, the side faces of the bottom end of the telescopic arms are fixedly connected with the side faces of the two sides of the jack-up frame, two bottom ends of the telescopic arms are respectively movably communicated with telescopic columns which are arranged in the limiting grooves in a penetrating mode, limiting blocks which are arranged in the limiting grooves in a sliding mode and are fixedly connected with the bottom end parts of the telescopic columns are arranged on the top ends of the limiting grooves in a sliding mode, sliding distances of the limiting blocks in the limiting grooves are larger than the thickness of the BGA chip, and the top ends of the telescopic columns are fixedly connected with the bottom sides of the connecting rods. Preferably, the wall of the test groove is provided with a plurality of through holes which are communicated with the test