CN-224216822-U - High-low temperature aging testing device for EC fan main board
Abstract
The utility model discloses a high-low temperature aging test device for an EC fan main board, which comprises a test host, an air conditioning host and an ultrasonic host. The vibration chamber, the heating chamber and the freezing chamber are arranged in the test host from top to bottom, so that three-mode tests of a low-temperature state, a high-temperature state and a vibration state are respectively realized, stability of extreme temperature conditions is ensured, and the simulation of real working conditions is more accurate. The test fixture adopts the multilayer clamping column assembly to carry out vertical suspension clamping on the PCB main board, supports the dense clamping of the PCB main board in the vertical direction, and greatly improves the single test capacity.
Inventors
- HE HAILI
- WU WENJIAN
- CHEN BAOGANG
- HE JINHONG
Assignees
- 东莞市肯和电子有限公司
Dates
- Publication Date
- 20260508
- Application Date
- 20250430
Claims (10)
- 1. The high-low temperature aging test device for the EC fan main board is characterized by comprising a test host machine (1), wherein a vibration chamber (13), a heating chamber (12) and a freezing chamber (11) are sequentially arranged in the test host machine (1) from top to bottom, test clamps (4) are interactively assembled in the vibration chamber (13), the heating chamber (12) and the freezing chamber (11), the test clamps (4) are sequentially matched with the freezing chamber (11), the heating chamber (12) and the vibration chamber (13) in a test mode, An ultrasonic base (131) is arranged at the bottom of the vibration chamber (13), a plurality of suspension struts (1310) are connected between the ultrasonic base (131) and the bottom surface of the vibration chamber (13), a suspension space is formed between the ultrasonic base (131) and the bottom surface of the vibration chamber (13), and at least one ultrasonic transducer (1312) is arranged at the bottom of the ultrasonic base (131); An air inlet is arranged at the side part of the heating chamber (12), a fan device is arranged at the air inlet, and a condenser (22) is arranged at the outer side of the air inlet so as to heat the interior of the heating chamber (12) by hot air; the side part of the freezing chamber (11) is provided with another air inlet, the air inlet is provided with another fan device, and the outer side of the air inlet is provided with an evaporator (21) for cooling the inside of the freezing chamber (11) by cold air; The side part of the test host machine (1) is provided with an air conditioning host machine (2), a compressor (23) and an expansion valve (24) are arranged in the air conditioning host machine (2), and the condenser (22), the expansion valve (24), the evaporator (21) and the compressor (23) are connected in turn through copper pipes in a circulating way; An ultrasonic host machine (3) is arranged at the top of the air conditioning host machine (2), an ultrasonic generator (31) is arranged in the ultrasonic host machine (3), and the ultrasonic generator (31) is connected to each ultrasonic transducer (1312).
- 2. The high-low temperature aging testing device for the main board of the EC fan according to claim 1, wherein a metal heat conducting partition board (130) is arranged between the vibration chamber (13) and the heating chamber (12) and is separated from each other by the heat conducting partition board (130), a plurality of heat conducting holes (1301) penetrating up and down are formed in the heat conducting partition board (130), a heat insulating board (110) is arranged between the heating chamber (12) and the freezing chamber (11) and is separated from each other by the heat insulating board (110), and the heat insulating board (110) is made of hard polyurethane or rock wool heat insulating board.
- 3. The high-low temperature aging testing device of the main board of the EC fan according to claim 2, wherein guide rails (10) are respectively arranged on two sides of the bottoms of the heating chamber (12) and the freezing chamber (11) and are used for sliding and inserting the testing fixture (4).
- 4. The device for testing the high and low temperature aging of the main board of the EC fan according to claim 3, wherein a plurality of positioning plugs (1311) are arranged at the top of the ultrasonic base (131), a plurality of positioning holes (40) are formed in the bottom of the test fixture (4), the test fixture (4) is placed on the top surface of the ultrasonic base (131), and each positioning hole (40) is sleeved on the corresponding positioning plug (1311).
- 5. The device for testing the high and low temperature aging of the main board of the EC fan according to claim 4, wherein the working frequency of the ultrasonic transducer (1312) is 100 kHz-500 kHz.
- 6. The high-low temperature aging testing device for the EC fan main board according to claim 1, wherein the testing fixture (4) comprises a fixture bottom plate and a plurality of clamping column assemblies (41), the fixture bottom plate is rectangular, the clamping column assemblies (41) are respectively distributed on the upper surface of the fixture bottom plate in an array mode, a plurality of separation supports with telescopic performance are arranged on the surface of each clamping column assembly (41) at intervals along the vertical direction and are used for bearing a target PCB main board, and each PCB main board tool is respectively arranged on the corresponding separation support at intervals along the vertical direction.
- 7. The device for testing the high and low temperature aging of the main board of the EC fan according to claim 6, wherein the clamping column assembly (41) comprises a clamping sleeve (411) and a delay linkage joint group, a plurality of jack groups are arranged at intervals along the vertical direction on the pipe wall of the clamping sleeve (411), each jack group comprises three telescopic jacks (410) which are distributed at intervals along the circumferential direction and penetrate through the inside and the outside, the telescopic jacks (410) extend along the radial direction of the clamping sleeve (411), the separation bracket comprises three telescopic support rods (412) which are distributed at intervals along the circumferential direction, the telescopic support rods (412) are respectively and slidably inserted into the corresponding telescopic jacks (410), the inner ends of the telescopic support rods (412) are provided with linkage round rods (4121), the linkage round rods (4121) are vertically arranged, the delay linkage joint group comprises a plurality of linkage joint pieces (43) which are connected up and down, the inner parts of the three telescopic support rods (412) of the same separation bracket are respectively connected with the corresponding linkage joint pieces (43), the telescopic joint pieces (43) are rotatably arranged in the inner cavity of the sleeve (411), the three telescopic support rods (412) are arranged at intervals along the radial direction, the telescopic support rods (412) are respectively arranged at intervals, the bottoms of the three telescopic support rods (412) are provided with three telescopic support rods (412) which are distributed along the circumferential direction, the corresponding arc-shaped linkage round grooves (430) and are gradually distributed towards the center of the corresponding arc-shaped linkage round rods (430) respectively, when the linkage joint (43) rotates around the axis, the telescopic support rod (412) is driven to extend or retract in the radial direction.
- 8. The high-low temperature aging test device of the EC fan main board according to claim 7, wherein a linkage rod (44) is connected between two adjacent linkage joint pieces (43) in the upper and lower directions, an upper interface (433) is arranged at the center position of the top surface of the linkage joint piece (43), two baffle plates (434) are respectively arranged at the two sides of the inner wall of the upper interface (433), a lower interface (432) and a lower cover plate (4321) are arranged at the center position of the bottom surface of the linkage joint piece (43), a special-shaped jack is arranged at the center position of the lower cover plate (4321), a linkage slot (4320) is respectively arranged at the two sides of the special-shaped jack, and the lower cover plate (4321) is fixed at the bottom of the linkage joint piece (43) and covers the arc-shaped linkage slot (430); The upper parts of the linkage rods (44) are respectively provided with upper protrusions (441), the two sides of the lower parts of the linkage rods (44) are respectively provided with lower protrusions (442), the upper parts of the linkage rods (44) are inserted into special-shaped insertion holes and lower interfaces (432) of the linkage joint pieces (43) located above, the upper protrusions (441) on the two sides are fixed to the lower interfaces (432) through locking screws (440) and are respectively clamped to corresponding linkage slots (4320), the lower parts of the linkage rods (44) are inserted into upper interfaces (433) of the linkage joint pieces (43) located below, and the lower protrusions (442) on the two sides are respectively in blocking connection with corresponding baffle pieces (434) to realize delayed rotation linkage of the upper and lower linkage joint pieces (43).
- 9. The device for testing the high and low temperature aging of the main board of the EC fan according to claim 8, wherein a limiting ring (431) is fixed to the top of said link member (43), and said limiting ring (431) is sleeved on the corresponding link lever (44) and is in limiting fit with the upper protrusion (441).
- 10. The device for testing the high and low temperature aging of an EC fan motherboard according to claim 9, wherein a twist hexagonal nut (42) is provided on top of said link member (43) at the top.
Description
High-low temperature aging testing device for EC fan main board Technical Field The utility model relates to the technical field of quality inspection equipment, in particular to a high-low temperature aging test device for an EC fan main board. Background The aging test item refers to the process of carrying out corresponding condition reinforcing experiments on the aging condition of the product by simulating various factors involved in the practical use condition of the product. The conventional EC fan main board quality inspection device generally includes a freezing chamber, a heating chamber and a vibration chamber, which are respectively used for respectively performing freezing treatment, heating treatment and vibration treatment of a fixed period on an EC fan main board of a target so as to simulate the actual application environment of a carried product, and performing functional inspection on the EC fan main board after the several reinforcing experiments are respectively performed so as to ensure that the anti-aging performance of the EC fan main board meets the quality requirement. The EC fan main board is circular, the existing EC fan main board quality inspection equipment adopts a planar laying type fixture clamp for carrying out anti-aging test clamping on the EC fan main board, and the EC fan main board quality inspection equipment has the following defects that 1, the EC fan main board tiling fixture is only subjected to cold and heat alternate treatment, and is different from a real working environment, experiments are not strict enough, 2, the number of period tests of the tiling fixture clamp is small, the aging test requirements of a large number of EC fan main boards are difficult to meet, and 3, the tiling fixture clamp is required to separate the EC fan main boards one by means of hands when separating from the fixture, so that time and labor are wasted. Disclosure of utility model Aiming at the defects existing in the prior art, the utility model aims to provide the high-low temperature aging test device for the EC fan main board, so that the simulation degree of the EC fan main board in high-low temperature aging test is improved, the test result is more accurate and reliable, the tooling speed and the tooling quantity of the test fixture are improved, and the test efficiency is greatly improved. In order to achieve the aim, the technical scheme includes that the high-low temperature aging testing device of the EC fan main board comprises a testing host, wherein a vibrating chamber, a heating chamber and a freezing chamber are sequentially arranged in the testing host from top to bottom, testing fixtures are interactively assembled in the vibrating chamber, the heating chamber and the freezing chamber, the testing fixtures are sequentially matched with the freezing chamber, the heating chamber and the vibrating chamber in a testing mode, an ultrasonic base is arranged at the bottom of the vibrating chamber, a plurality of suspension struts are connected between the ultrasonic base and the bottom of the vibrating chamber, a suspension space is formed between the ultrasonic base and the bottom of the vibrating chamber, at least one ultrasonic transducer is arranged at the bottom of the ultrasonic base, an air inlet is arranged at the side part of the heating chamber, a fan device is arranged at the outer side of the air inlet, a condenser is arranged at the inner side part of the heating chamber, another air inlet is arranged at the outer side of the air inlet, so as to cool the inner part of the heating chamber, an air regulating host is arranged at the side part of the testing host, a compressor and an expansion valve are arranged in the air regulating host, the condenser, the expansion valve, the evaporator and a copper pipe are sequentially connected with the bottom of the vibrating chamber, the ultrasonic base is sequentially arranged at the top of the air regulating host, and the ultrasonic transducer is connected with the ultrasonic transducer. In a further technical scheme, a metal heat conducting partition plate is arranged between the vibration chamber and the heating chamber and is mutually separated by the heat conducting partition plate, a plurality of heat conducting holes penetrating up and down are formed in the heat conducting partition plate, a heat insulating plate is arranged between the heating chamber and the freezing chamber and is mutually separated by the heat insulating plate, and the heat insulating plate is made of hard polyurethane or rock wool heat insulating plates. In a further technical scheme, guide rails are respectively arranged at two sides of the bottoms of the heating chamber and the freezing chamber and are used for sliding insertion of the test fixture. In a further technical scheme, a plurality of positioning inserting posts are arranged at the top of the ultrasonic base, a plurality of positioning holes are formed in the bottom of the test