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CN-224216914-U - Coupling structure of silicon optical chip and FAU

CN224216914UCN 224216914 UCN224216914 UCN 224216914UCN-224216914-U

Abstract

The utility model discloses a coupling structure of a silicon optical chip and an FAU, which comprises the silicon optical chip and the FAU, wherein an inserting assembly is arranged on the silicon optical chip and the FAU, the inserting assembly comprises a support sleeve and an interface, a sealing assembly is arranged on the support sleeve, the sealing assembly comprises a slot and a sealing ring, a locking assembly is arranged on the support sleeve, the locking assembly comprises a bayonet and a clamping groove, a limiting assembly is arranged on the interface, the limiting assembly comprises a bayonet and a spring II, a protection assembly is arranged on the interface, the coupling structure of the silicon optical chip and the FAU can enable the bottom end of the bayonet to move rightwards only at the top of a stop block under the cooperation of the wedge pattern and the spring II, so that the interface is ensured to be inserted into the inner side of the slot more and more tightly under the vibration effect, the situation that the silicon optical chip and the FAU are not firmly connected or are not tightly coupled is avoided, and the safe operation of the silicon optical chip and the FAU are effectively ensured, and the coupling structure is suitable for the rapid installation and the use of the silicon optical chip and the FAU.

Inventors

  • LI WEIJIE
  • LV NINA
  • HU HANJIE

Assignees

  • 腾景光通讯技术(武汉)有限公司

Dates

Publication Date
20260508
Application Date
20250718

Claims (8)

  1. 1. The coupling structure of the silicon optical chip and the FAU comprises the silicon optical chip (1) and the FAU (2), wherein plug-in components are arranged on the silicon optical chip (1) and the FAU (2), each plug-in component comprises a support sleeve (3) and an interface (5), and the coupling structure is characterized in that a sealing component is arranged on the support sleeve (3) and comprises a slot (4) and a sealing ring (6), a locking component is arranged on the support sleeve (3), the locking component comprises a bayonet (9) and a clamping groove (8), a limiting component is arranged on the interface (5), the limiting component comprises a bayonet (7) and a spring II (13), a blocking component is arranged on the bayonet (7), each blocking component comprises a stop block (12) and a wedge pattern (14), and an extrusion component is arranged on the interface (5) and comprises a sliding groove (15) and a pushing block (16).
  2. 2. The coupling structure of the silicon optical chip and the FAU according to claim 1, wherein the support sleeve (3) is sleeved on the outer side of the FAU (2), the interface (5) is welded on one side of the silicon optical chip (1), and the slot (4) is formed on the inner side of the support sleeve (3).
  3. 3. The coupling structure of a silicon optical chip and a FAU according to claim 2, wherein one end of the FAU (2) is inserted into the inner side of the interface (5), the interface (5) is clamped on the inner side of the slot (4), the sealing ring (6) is adhered to the inner wall of the slot (4), and the outer side of the interface (5) is clamped on the sealing ring (6).
  4. 4. The coupling structure of a silicon optical chip and a FAU according to claim 1, wherein the clamping groove (8) is formed in the inner side of the support sleeve (3), one end of the clamping pin (9) is connected with the inner wall of the clamping groove (8) through a first spring (11), one end of the clamping pin (9) is welded with a pull rod (10), and one end of the pull rod (10) penetrates through the clamping groove (8) and extends to the outer side of the support sleeve (3).
  5. 5. The coupling structure of a silicon optical chip and a FAU as set forth in claim 4, wherein the bayonet (7) is formed on the inner side of the interface (5), and the other end of the bayonet (9) passes through the slot (8) and extends to the inner side of the bayonet (7).
  6. 6. The coupling structure of a silicon optical chip and a FAU as set forth in claim 5, wherein two sides of the stopper (12) are clamped on the inner wall of the bayonet (7), one end of the stopper (12) is connected with the inner wall of the bayonet (7) through a second spring (13), the wedge pattern (14) is formed at the other end of the stopper (12), the wedge patterns (14) are uniformly distributed on the stopper (12), and the other end of the bayonet lock (9) is clamped on the wedge pattern (14).
  7. 7. The coupling structure of a silicon optical chip and a FAU as set forth in claim 6, wherein the chute (15) is formed on the inner side of the interface (5), the chute (15) is located on one side of the bayonet (7), and the outer side of the push block (16) is clamped on the inner wall of the chute (15).
  8. 8. The coupling structure of a silicon optical chip and a FAU as set forth in claim 7, wherein one end of the push block (16) is connected with the inner wall of the chute (15) through a spring III (17), and the other end of the push block (16) is clamped at the outer side of the bayonet lock (9) or the stopper (12).

Description

Coupling structure of silicon optical chip and FAU Technical Field The utility model relates to the technical field of silicon optical chip coupling structures, in particular to a coupling structure of a silicon optical chip and an FAU. Background When the silicon optical chip is used, the silicon optical chip is often required to be installed and coupled by using a silicon optical chip coupling structure, and the utility model patent with the patent application number of CN202020701519.3 discloses a coupling structure of the silicon optical chip and an active chip, which comprises a silicon optical chip, a ceramic substrate, a ceramic ferrule, a capillary tube, an active chip component, a metal pin and a single-mode fiber, wherein the silicon optical chip is arranged on one side of the ceramic substrate, the ceramic ferrule, the silicon optical chip and the opposite and same side of the ceramic ferrule are arranged on one side of the ceramic substrate, a base station is arranged in the ceramic ferrule, the active chip component is arranged on the base station of the ceramic ferrule, the single-mode fiber is respectively connected with the active chip component and the silicon optical chip for transmitting light, the capillary tube is used for hermetically sealing the active chip component, and the metal pin is electrically connected with the active chip in the active chip component for providing driving energy. The coupling structure can reduce the size and the packaging cost of coupling packaging, solves the problem of the reliability of airtight packaging of an active chip, and can not be used for quickly fixing and coupling the silicon optical chip and reducing the mounting and coupling working efficiency when being used according to the technical scheme disclosed by the coupling structure. Therefore, how to design the coupling structure of the silicon optical chip and the FAU becomes a problem to be solved currently. Disclosure of utility model Aiming at the defects in the prior art, the utility model aims to provide a coupling structure of a silicon optical chip and an FAU, so as to solve the problems in the prior art. In order to achieve the aim, the technical scheme is that the coupling structure of the silicon optical chip and the FAU comprises the silicon optical chip and the FAU, wherein plug-in components are arranged on the silicon optical chip and the FAU, the plug-in components comprise a support sleeve and an interface, a sealing component is arranged on the support sleeve, the sealing component comprises a slot and a sealing ring, a locking component is arranged on the support sleeve, the locking component comprises a bayonet and a clamping groove, a limiting component is arranged on the interface, the limiting component comprises a bayonet and a spring II, a blocking component is arranged on the bayonet, the blocking component comprises a stop block and a wedge pattern, an extrusion component is arranged on the interface, and the extrusion component comprises a sliding groove and a pushing block. Further, the support sleeve is sleeved on the outer side of the FAU, the interface is welded on one side of the silicon optical chip, and the slot is formed in the inner side of the support sleeve. Further, one end of the FAU is inserted into the inner side of the interface, the interface is clamped on the inner side of the slot, the sealing ring is adhered to the inner wall of the slot, and the outer side of the interface is clamped on the sealing ring. Further, the clamping groove is formed in the inner side of the support sleeve, one end of the clamping pin is connected with the inner wall of the clamping groove through a first spring, one end of the clamping pin is welded with a pull rod, and one end of the pull rod penetrates through the clamping groove and extends to the outer side of the support sleeve. Further, the bayonet is arranged on the inner side of the connector, and the other end of the bayonet penetrates through the clamping groove and extends to the inner side of the bayonet. Further, both sides of dog are all blocked on the inner wall of bayonet socket, the one end of dog is connected with the inner wall of bayonet socket through spring two, the wedge line is seted up at the other end of dog, wedge line evenly distributed is on the dog, the other end card of bayonet lock is on the wedge line. Further, the sliding groove is formed in the inner side of the connector, the sliding groove is located on one side of the bayonet, and the outer side of the pushing block is clamped on the inner wall of the sliding groove. Further, one end of the pushing block is connected with the inner wall of the chute through a spring III, and the other end of the pushing block is clamped at the outer side of the bayonet lock or the stop block. The coupling structure of the silicon optical chip and the FAU has the beneficial effects that 1, when the coupling structure is used, the interface on the sili