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CN-224216992-U - Wafer centering CCD dynamic compensation mechanism for double-sided exposure machine

CN224216992UCN 224216992 UCN224216992 UCN 224216992UCN-224216992-U

Abstract

The utility model belongs to the field of exposure machines, in particular to a wafer centering CCD dynamic compensation mechanism for a double-sided exposure machine, which comprises a bottom plate, wherein a vertical plate is fixedly connected to the edge of the top of the bottom plate, one side of the vertical plate is rotationally connected with a horizontal adjustment assembly, the surface of the horizontal adjustment assembly is fixedly connected with a moving platform, the top of the moving platform is fixedly connected with an angle adjustment assembly, a customized A voice coil motor is electrified through the structural design of the horizontal adjustment assembly, an A transmission rod directly rotates in a permanent magnetic field through an electrified coil without intermediate transmission parts such as gears and screws, mechanical gaps and inertial delay are avoided, the A transmission rod rotates and drives a threaded rod to rotate, and a threaded cylinder is pushed to move through rotating threads, so that the position of the moving platform, the upper structure of the moving platform and the position of the wafer are changed, the CCD dynamic compensation mechanism can rapidly respond and adjust the position of the wafer, and the exposure efficiency of the wafer is improved.

Inventors

  • Yin Dachen
  • LU PING
  • WANG HUANZHI

Assignees

  • 江苏鸣志微电子科技有限公司

Dates

Publication Date
20260508
Application Date
20250716

Claims (6)

  1. 1. A wafer centering CCD dynamic compensation mechanism for a double-sided exposure machine is characterized by comprising a bottom plate (1), wherein a vertical plate (2) is fixedly connected to the edge of the top of the bottom plate (1), one side of the vertical plate (2) is rotatably connected with a horizontal adjustment assembly (3), the surface of the horizontal adjustment assembly (3) is fixedly connected with a movable platform (4), and the top of the movable platform (4) is fixedly connected with an angle adjustment assembly (5); The horizontal adjusting assembly (3) comprises a threaded rod (301) rotatably connected to one side of the vertical plate (2), a threaded cylinder (302) is connected to the surface of the threaded rod (301) in a threaded mode, a movable platform (4) is fixedly connected to the surface of the threaded cylinder (302), an A transmission rod (303) is fixedly connected to one end of the threaded rod (301), the vertical plate (2) is connected to the surface of the A transmission rod (303) in a penetrating mode, and one end of the A transmission rod (303) is connected to the output end of an A voice coil motor (304) in a spline mode; The angle adjusting assembly (5) comprises a bottom block (501) fixedly connected to the top of the moving platform (4), a rack plate (502) is slidably connected to the top of the bottom block (501), a gear shaft (503) is connected to the surface of the rack plate (502) in a meshed mode, a rotating plate (506) is fixedly connected to the top of the gear shaft (503), a B transmission rod (504) is fixedly connected to one end of the rack plate (502), and one end of the B transmission rod (504) is connected to the output end of the B voice coil motor (505) through a spline.
  2. 2. The wafer centering CCD dynamic compensation mechanism for the double-sided exposure machine of claim 1, wherein the bottom of the A voice coil motor (304) is fixedly connected with a supporting plate (6), and one end of the supporting plate (6) is fixedly connected with a bottom plate (1).
  3. 3. The wafer centering CCD dynamic compensation mechanism for the double-sided exposure machine of claim 1, wherein one end of the B voice coil motor (505) is fixedly connected with a bump (7), and the bottom of the B voice coil motor (505) is fixedly connected with a bottom block (501).
  4. 4. The wafer centering CCD dynamic compensation mechanism for the double-sided exposure machine, as claimed in claim 1, is characterized in that connecting pieces (8) are fixedly connected to two sides of the bottom block (501), connecting bolts (9) are fixedly connected to the surfaces of the connecting pieces (8) in a linear array, and moving platforms (4) are connected to the surfaces of the connecting bolts (9) in a threaded mode.
  5. 5. The wafer centering CCD dynamic compensation mechanism for the double-sided exposure machine, which is disclosed in claim 4, is characterized in that one side of the moving platform (4) is connected with a limiting rod (10) in a penetrating way, and two ends of the limiting rod (10) are fixedly connected with vertical plates (2).
  6. 6. The wafer centering CCD dynamic compensation mechanism for the double-sided exposure machine of claim 5, wherein the top of the rotating plate (506) is fixedly connected with a chuck (11), and the top of the chuck (11) is provided with clamping claws (12) for centering and clamping in an annular array.

Description

Wafer centering CCD dynamic compensation mechanism for double-sided exposure machine Technical Field The utility model relates to the field of exposure machines, in particular to a wafer centering CCD dynamic compensation mechanism for a double-sided exposure machine. Background The exposure machine is a key device for photoetching technology and is widely applied to the fields of semiconductor manufacture, printed circuit board production, flat panel display manufacture, micro-electromechanical systems, 3D printing, biological chips and the like. The wafer alignment CCD dynamic compensation mechanism of the double-sided exposure machine is a key technical component for high-precision alignment in semiconductor manufacture and is mainly used for solving the problem of wafer position deviation in the double-sided photoetching process. In the prior art, the angle and the position of a wafer can be adjusted by the existing CCD dynamic compensation mechanism, so that a CCD camera can be aligned with a mark on the wafer, and whether the position of the wafer is accurate or not is judged before exposure, but the existing CCD dynamic compensation mechanism is inconvenient to adjust the position of the wafer according to the relative position of the mark of the wafer and the camera, the exposure efficiency of the wafer is reduced, and meanwhile, after the position of the wafer is adjusted, the adjusted wafer angle is possibly changed again due to shaking of equipment or vibration generated by the equipment, and the existing CCD dynamic compensation mechanism is inconvenient to fix the angle after the adjustment of the wafer angle is finished, so that the accuracy of the CCD dynamic compensation mechanism is reduced. Disclosure of utility model In order to overcome the defects of the prior art and solve the problems that the existing CCD dynamic compensation mechanism is inconvenient to quickly respond to and adjust the position of a wafer and inconvenient to fix the angle after the wafer angle is adjusted, the utility model provides a wafer centering CCD dynamic compensation mechanism for a double-sided exposure machine. The wafer centering CCD dynamic compensation mechanism for the double-sided exposure machine comprises a bottom plate, wherein a vertical plate is fixedly connected to the edge of the top of the bottom plate, one side of the vertical plate is rotatably connected with a horizontal adjusting component, the surface of the horizontal adjusting component is fixedly connected with a moving platform, and the top of the moving platform is fixedly connected with an angle adjusting component; The horizontal adjusting assembly comprises a threaded rod which is rotatably connected to one side of the vertical plate, a threaded cylinder is connected to the surface of the threaded rod in a threaded manner, a moving platform is fixedly connected to the surface of the threaded cylinder, an A transmission rod is fixedly connected to one end of the threaded rod, the vertical plate is connected to the surface of the A transmission rod in a penetrating manner, and one end of the A transmission rod is connected to the output end of the A voice coil motor in a spline manner; The angle adjusting assembly comprises a bottom block fixedly connected to the top of the mobile platform, the top of the bottom block is slidably connected with a rack plate, a gear shaft is connected to the surface of the rack plate in a meshed mode, a rotating plate is fixedly connected to the top of the gear shaft, a B transmission rod is fixedly connected to one end of the rack plate, and one end of the B transmission rod is in spline connection with the output end of the B voice coil motor. Preferably, the bottom of A voice coil motor is fixedly connected with backup pad, the one end fixedly connected with bottom plate of backup pad. Preferably, one end of the B voice coil motor is fixedly connected with a lug, and the bottom of the B voice coil motor is fixedly connected with a bottom block. Preferably, the two sides of the bottom block are fixedly connected with connecting pieces, the surfaces of the connecting pieces are fixedly connected with connecting bolts in a linear array, and the surfaces of the connecting bolts are in threaded connection with a movable platform. Preferably, one side of the mobile platform is connected with a limiting rod in a penetrating way, and two ends of the limiting rod are fixedly connected with vertical plates. Preferably, the top of the rotating plate is fixedly connected with a chuck, and the top of the chuck is provided with clamping claws for centering and clamping in an annular array. The utility model has the advantages that: 1. According to the utility model, through the structural design of the horizontal adjusting component, the coil or the magnetic circuit of the voice coil motor is arranged around the axis, and the multi-coil subsection electrifying is performed to generate the rotating torque, so t