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CN-224217069-U - Heat dissipation device

CN224217069UCN 224217069 UCN224217069 UCN 224217069UCN-224217069-U

Abstract

The utility model discloses a heat dissipating device which comprises a heat dissipating fin unit, a heat dissipating substrate and a plurality of heat pipe groups, wherein the heat dissipating fin unit comprises an upper heat dissipating fin group and a lower heat dissipating fin group which are arranged in a laminated mode, the heat dissipating substrate is arranged on the lower heat dissipating fin group and covers at least part of the lower heat dissipating fin group, the upper heat dissipating fin group is arranged on the heat dissipating substrate, the plurality of heat pipe groups are arranged along the long side direction of the heat dissipating fin unit, each heat pipe group is provided with a heat dissipating part and a heat absorbing part, the heat absorbing part is used for being attached with a heat source, the heat dissipating part is clamped between the heat dissipating substrate and the upper heat dissipating fin group, at least part of the heat dissipating part is arranged on the heat dissipating substrate, each heat dissipating part extends into the heat dissipating fin unit from one side of the long side of the heat dissipating fin unit and extends towards one side of two short sides of the heat dissipating fin unit, and at least part of two adjacent heat dissipating parts 131 are staggered on the heat dissipating substrate, so that heat is uniformly gathered on the heat dissipating fin unit.

Inventors

  • CHEN ZHIAN

Assignees

  • 讯强电子(惠州)有限公司

Dates

Publication Date
20260508
Application Date
20250516

Claims (12)

  1. 1. A heat sink, comprising: the radiating fin unit comprises an upper radiating fin group and a lower radiating fin group which are arranged in a laminated manner; A heat dissipation substrate arranged on the lower heat dissipation fin group and covering at least part of the lower heat dissipation fin group, wherein the upper heat dissipation fin group is arranged on the heat dissipation substrate; the heat pipe groups are arranged along the long side direction of the radiating fin units, each heat pipe group is provided with a radiating part and a heat absorbing part, the heat absorbing parts are used for being attached with a heat source, the radiating parts are clamped between the radiating substrate and the upper radiating fin groups, and at least part of the radiating parts are positioned on the radiating substrate; Each radiating part extends into the radiating fin unit from one side of the long side of the radiating fin unit and extends to one side of the two short sides of the radiating fin unit, and at least part of the two adjacent radiating parts are arranged on the radiating substrate in a staggered mode so that heat is uniformly collected in the radiating fin unit.
  2. 2. The heat dissipating device of claim 1, wherein a plurality of said pairs of heat pipes are located on the same side or on different sides of said fin unit.
  3. 3. The heat dissipating device of claim 1, wherein each of the heat pipe groups further comprises a heat conducting portion, and both ends of the heat conducting portion are respectively connected to the heat dissipating portion and the heat absorbing portion, and heat received by the heat absorbing portion is conducted to the heat dissipating portion through the heat conducting portion.
  4. 4. The heat dissipating device of claim 3, wherein each of the heat pipe sets comprises at least one heat pipe, each of the heat pipes has a heat absorbing section, a heat conducting section and a heat dissipating section, at least one of the heat absorbing sections is attached to each other to form the heat absorbing portion, at least one of the heat dissipating sections extends into the heat dissipating fin unit from one side of the long side of the heat dissipating fin unit and extends to one side of the two short sides of the heat dissipating fin unit to form the heat dissipating portion, and two ends of the heat conducting section are respectively connected to the heat absorbing section and the heat dissipating section to form the heat conducting portion.
  5. 5. The heat dissipating device of claim 4, wherein each of said heat dissipating sections comprises a curved structure and a straight structure, both ends of said curved structure are connected to said heat conducting section and said straight structure respectively, and said curved structure is disposed on said heat dissipating substrate, and said straight structure extends along a long side direction of said heat dissipating fin unit toward a short side of said heat dissipating fin unit.
  6. 6. The heat dissipating device of claim 5, wherein said linear structures extending in opposite directions are disposed alternately on said heat dissipating substrate, and said linear structures extending in opposite directions are disposed on said lower set of heat dissipating fins.
  7. 7. The heat sink of claim 1, further comprising a plurality of heat dissipating bases and a plurality of end caps, wherein the heat dissipating bases are correspondingly mounted on the heat sink, and the end caps are correspondingly mounted on the heat dissipating bases.
  8. 8. The heat dissipating device of claim 7, further comprising a plurality of gripping units, each gripping unit comprising: The first fixing piece is arranged on the heat dissipation base; the second fixing piece is arranged on the upper radiating fin group; And the two ends of the handle piece are respectively connected with the first fixing piece and the second fixing piece.
  9. 9. The heat dissipating device of claim 1, wherein the upper set of heat dissipating fins comprises at least one heat dissipating sub-set, a portion of the heat dissipating sub-set being disposed on the heat dissipating substrate, another portion of the heat dissipating sub-set being disposed on the lower set of heat dissipating fins, each of the heat dissipating sub-sets being formed by horizontally fastening a plurality of fins to each other.
  10. 10. The heat dissipating device of claim 1, wherein the lower set of heat dissipating fins comprises at least one heat dissipating sub-set, the heat dissipating substrate being disposed on a portion of the heat dissipating sub-sets, each of the heat dissipating sub-sets being formed by horizontally fastening a plurality of fins to each other.
  11. 11. The heat sink of claim 9 or 10, wherein the fins are angled fins.
  12. 12. The heat dissipating device of claim 9 or 10, wherein each of said heat dissipating sub-groups has an inclined surface, and the inclination of the inclined surface of a different one of said heat dissipating sub-groups is the same or different.

Description

Heat dissipation device Technical Field The utility model relates to the technical field of heat dissipation, in particular to a passive heat dissipation device for a server. Background The world is being changed by the development of global technology, AI technology and high performance operations, and is leading to future directions. The enormous operational requirements imposed by these innovative technologies are also accompanied by a significant challenge, heat dissipation. With the rapid increase of data volume and operation requirements, the operation capability requirements of servers are also increasing. The continued evolution of high performance chips and servers has increased thermal power consumption, which places greater demands on how to efficiently dissipate heat to ensure operation and long life of the hardware. At present, artificial intelligence is mostly applied to data collection, processing and operation, and the processing of a large amount of data has higher requirements on chip efficiency, so that the problems of energy consumption and heating value are gradually revealed at the same time of improving the efficiency. This will lead to a need for more efficient heat dissipation solutions to ensure that the server can operate stably under high loads for long periods of time. The heat dissipation space of the current server device is increasingly narrow, the heat flux density of the CPU is rapidly increased, and the air-cooled product is a mainstream design mode of electronic heat dissipation due to simple production structure, high mass production and low cost. Therefore, how to maximize the heat dissipation capability under the conditions of limited space and limited system impedance has become a primary technical problem. Disclosure of utility model The utility model provides a heat abstractor to reduce thermal resistance and promote the radiating effect. An embodiment of the present invention discloses a heat dissipating device, which includes: the radiating fin unit comprises an upper radiating fin group and a lower radiating fin group which are arranged in a laminated manner; A heat dissipation substrate arranged on the lower heat dissipation fin group and covering at least part of the lower heat dissipation fin group, wherein the upper heat dissipation fin group is arranged on the heat dissipation substrate; the heat pipe groups are arranged along the long side direction of the radiating fin units, each heat pipe group is provided with a radiating part and a heat absorbing part, the heat absorbing parts are used for being attached with a heat source, the radiating parts are clamped between the radiating substrate and the upper radiating fin groups, and at least part of the radiating parts are positioned on the radiating substrate; Each radiating part extends into the radiating fin unit from one side of the long side of the radiating fin unit and extends to one side of the two short sides of the radiating fin unit, and at least part of the two adjacent radiating parts are arranged on the radiating substrate in a staggered mode so that heat is uniformly collected in the radiating fin unit. In the heat dissipating device, the plurality of heat pipe sets are opposite to long sides located on the same side or different sides of the heat dissipating fin unit. The heat dissipation device further comprises a heat conduction part, wherein two ends of the heat conduction part are respectively connected with the heat dissipation part and the heat absorption part, and heat received by the heat absorption part is conducted to the heat dissipation part through the heat conduction part. The heat dissipation device comprises a heat pipe group, wherein each heat pipe group comprises at least one heat pipe, each heat pipe is provided with a heat absorption section, a heat conduction section and a heat dissipation section, at least one heat absorption section is mutually attached to form the heat absorption part, at least one heat dissipation section extends into the heat dissipation fin unit from one side of the long side of the heat dissipation fin unit and extends to one side of two short sides of the heat dissipation fin unit to form the heat dissipation part, and two ends of the heat conduction section are respectively connected with the heat absorption section and the heat dissipation section to form the heat conduction part. The heat dissipation device comprises a heat dissipation substrate, a heat dissipation section and a heat dissipation structure, wherein each heat dissipation section comprises a bending structure and a linear structure, two ends of the bending structure are respectively connected with the heat conduction section and the linear structure, the bending structure is arranged on the heat dissipation substrate, and the linear structure extends towards the short sides of the heat dissipation fin units along the long side direction of the heat dissipation fin units. In the abo