CN-224217113-U - LED smart card convenient to manufacture

Abstract

The utility model belongs to the technical field of smart cards, in particular to an LED smart card convenient to manufacture, which comprises an IC module. The design not only reduces errors and defective products in the manufacturing process, but also remarkably improves the production efficiency. Meanwhile, the FPC board designed by the double-sided circuit board is combined with the compact LED light-emitting module with the pad spacing less than or equal to 0.5mm and the flip chip structure, so that the integration level of the circuit and the manufacturing fineness are further improved, different turns and spacing are carefully set according to the capacitance condition through the FPC board LED antenna so as to match the working frequency of the IC module, interference to the IC module circuit is avoided, and the electromagnetic compatibility of the product is further improved through the frequency separation design. In addition, four-layer structure's FPC board LED smart card INLAY bonds through hot pressing mode, has guaranteed the firm installation of each components and parts in the plastics substrate, has improved the whole roughness and the durability of product.

Inventors

• JIAO XIAODONG
• WU SHUAISHUAI

Assignees

• 上海一芯智能科技有限公司

Dates

Publication Date

20260508

Application Date

20250527

Claims (6)

1. 1. The LED smart card is characterized by comprising an IC module, an FPC board LED module and a batching structure, wherein the IC module comprises an IC chip (001) and an IC antenna (002), the FPC board LED module comprises an FPC board (003), a plurality of LEDs (005), diodes (006) and an FPC board LED antenna (004), and the batching structure comprises an upper printed layer (013) of the FPC board LED smart card, a lower printed layer (014) of the FPC board LED smart card and a lower printed layer (014) of the FPC board LED smart card.
2. 2. The LED smart card of claim 1, wherein said FPC board (003) is a double sided circuit board with clearance holes (007) machined thereon for fixing and routing requirements according to product conditions, and said FPC board (003) carries LEDs (005), diodes (006) and FPC board LED antennas (004).
3. 3. The LED smart card of claim 1, wherein said LED light module is a flip chip structure, and is directly attached to said conductive pads of said FPC board (003), and the pad pitch is less than or equal to 0.5mm.
4. 4. The LED smart card of claim 1, wherein said diode (006) has a rectifying function for converting ac generated by the FPC board LED antenna (004) into dc to supply LED (005) to light, and said FPC board LED antenna (004) is provided with different turns and pitches according to the capacitance conditions to match the operating frequency of the IC module while avoiding interference with the IC module circuit.
5. 5. The LED smart card convenient to manufacture according to claim 1 is characterized in that the FPC board LED smart card INLAY structure comprises an FPC board fixing layer (009), an IC antenna layer (010) and an INLAY upper covering film (011) and an INLAY lower covering film (012), wherein the thickness of the FPC board fixing layer is 0.1+/-0.02 mm, the IC antenna layer (010) is subjected to clearance treatment according to different thicknesses selected by a product process, the INLAY upper covering film (011) and the INLAY lower covering film (012) are compensated according to the product thickness requirement, and the four layers of structures are bonded in a hot-pressing mode, so that components are fully bonded in a plastic base material, and the flatness of the product is kept.
6. 6. The LED smart card of claim 1, wherein the edge of the FPC board (003) is provided with FPC clearance holes (007) for precisely aligning with the manufacturing equipment, and the FPC clearance holes (007) have a diameter of 1.0-2.0mm.

Description

LED smart card convenient to manufacture Technical Field The utility model relates to the technical field of smart cards, in particular to an LED smart card convenient to manufacture. Background In the technical field of smart cards, along with the rapid development of applications such as the internet of things and mobile payment, higher requirements are put forward on the functionality, the integration level and the manufacturing efficiency of the smart card. The LED smart card is used as a smart card integrated with a luminous display function, so that the data storage and interaction capability of the traditional smart card are required, and visual feedback or state indication is required to be provided through LED luminescence in a specific scene, thereby improving user experience. However, the existing LED smart card faces many technical challenges in the design and manufacturing process, these problems directly affect the performance, stability and manufacturing cost of the product, and in the manufacturing process of the conventional LED smart card, component mounting deviation is often caused by inaccurate positioning, so that the circuit connection performance and the overall quality of the product are affected. In addition, with the improvement of the circuit integration level, the distance between components is continuously reduced, and more stringent requirements are put on the precision control in the manufacturing process. The existing manufacturing process is difficult to meet the requirements of high-precision positioning and high-efficiency production, the production efficiency is low, the defective rate is increased, the manufacturing cost is increased, the stable power supply of the LED light-emitting module is required to be ensured in the working process of the LED smart card, and meanwhile, the interference to an IC module circuit is avoided, so that the overall performance of the smart card is maintained. However, the existing design has the defects in the aspects of power management, electromagnetic compatibility and component fixation, so that the problems of unstable LED light emission, interference on an IC module or easy falling of components and the like are caused, and the reliability and the service life of the product are influenced. Particularly, under a complex electromagnetic environment, the existing LED smart card is more prone to performance fluctuation, and the requirements of users on high-quality products are difficult to meet. Disclosure of utility model In order to solve the above problems, the present utility model proposes an LED smart card that is easy to manufacture, so as to solve the above problems in the background art more precisely. The utility model is realized by the following technical scheme: The utility model provides an LED smart card convenient to manufacture, which comprises an IC module, an FPC board LED module and a batching structure, wherein the IC module comprises an IC chip and an IC antenna, the FPC board LED module comprises an FPC board, a plurality of LEDs, a diode and an FPC board LED antenna, and the batching structure comprises an upper printed layer of the FPC board LED smart card, a lower printed layer of the FPC board LED smart card and a lower printed layer of the FPC board LED smart card. Preferably, the FPC board is a double-sided circuit board, and the FPC board is provided with a clearance hole for fixing and wiring according to the condition of products, and is used for bearing the LED, the diode and the LED antenna of the FPC board. Preferably, the LED smart card convenient to manufacture is characterized in that the LED light-emitting module is of a flip chip structure and is directly attached to the conductive bonding pad of the FPC board, and the bonding pad distance is less than or equal to 0.5mm. Preferably, the diode has rectifying function, is used for converting the alternating current that FPC board LED antenna produced into direct current to supply the LED to light up, just FPC board LED antenna sets up different numbers of turns and interval according to the electric capacity condition to match the operating frequency of IC module, avoid interfering with IC module circuit simultaneously. The FPC board LED smart card INLAY structure comprises an FPC board fixing layer, an IC antenna layer, an INLAY upper covering film and an INLAY lower covering film, wherein the thickness of the material is 0.1+/-0.02 mm, the IC antenna layer is subjected to clearance treatment according to different thicknesses selected by a product process, the INLAY upper covering film and the INLAY lower covering film are compensated according to the thickness requirement of the product, and the four layers of structures are bonded in a hot-pressing mode to ensure that all components are fully bonded in a plastic substrate and the flatness of the product is maintained. Preferably, the edge of the FPC board is provided with FPC clearance holes