CN-224217897-U - Packaging structure of high-stability laser

CN224217897UCN 224217897 UCN224217897 UCN 224217897UCN-224217897-U

Abstract

The utility model discloses a packaging structure of a high-stability laser, which relates to the technical field of lasers, wherein the packaging structure of the high-stability laser comprises a shell, a first cavity and a second cavity, wherein the shell is provided with a containing cavity with an opening; the heat dissipation device comprises a containing cavity, a chip component arranged in the containing cavity, a cover body fixed on the opening to seal the containing cavity, and a first heat dissipation piece fixed on the cover body, wherein one end of the first heat dissipation piece is abutted with the top of the chip component, and the other end of the first heat dissipation piece penetrates through the cover body and extends to the outside of the containing cavity. The technical scheme provided by the utility model improves the stability of the laser.

Inventors

MAO SEN
Tan Wulie
LU KAIKAI
JIAO YINGHAO
MAO HU

Assignees

深圳市利拓光电有限公司

Dates

Publication Date: 20260508
Application Date: 20250423

Claims (10)

1. A package structure of a high stability laser, comprising: A housing provided with a receiving cavity with an opening; The chip assembly is arranged in the accommodating cavity; a cover body fixed on the opening to close the accommodating cavity, and The first heat dissipation piece is fixed in the lid, the one end of first heat dissipation piece be equipped with the corresponding first groove of dodging in chip assembly's top, just the inner wall in first groove of dodging with the top butt of chip assembly, the other end of first heat dissipation piece passes the lid extends to the outside of acceping the chamber.
2. The package structure of a high stability laser of claim 1, wherein the first heat sink comprises: the first substrate is attached to one side of the cover body, which faces the chip assembly; A plurality of first fins, one ends of which are fixed on the first substrate, the other ends of which extend towards the direction close to the chip assembly and are abutted against the top of the chip assembly, wherein one end of each of the first fins close to the chip assembly is provided with a first opening, the first openings of the plurality of first fins jointly form a first avoidance groove, and And one end of the first heat conduction part is connected with the first substrate, and the other end of the first heat conduction part penetrates through the cover body to extend to the outside of the accommodating cavity.
3. The package structure of claim 2, wherein a first accommodating groove is formed in a side, facing away from the accommodating cavity, of the cover body, and one end, located outside the accommodating cavity, of the first heat conducting portion is bent and fixed in the first accommodating groove.
4. The package structure of claim 2, wherein the first heat conducting portion is disposed on both sides of the first substrate in the width direction.
5. The package structure of claim 2, further comprising a second heat sink, wherein one end of the second heat sink abuts a side portion of the chip assembly, and the other end of the second heat sink extends to an outside of the receiving cavity through a bottom wall of the housing.
6. The package structure of claim 5, wherein the second heat sink is disposed on both sides of the chip assembly in the width direction.
7. The package structure of claim 5, wherein the second heat sink is provided with a second avoidance groove corresponding to a side portion of the chip assembly, and an inner wall of the second avoidance groove abuts against the side portion of the chip assembly.
8. The package structure of claim 7, wherein the second heat sink comprises: The second substrate is arranged in the accommodating cavity; A second fin, one end of which is fixed on the second substrate, the other end of which extends towards the direction close to the chip assembly and is abutted against the side part of the chip assembly, the second fins are provided with a plurality of second openings, one end of each second fin, which is close to the chip assembly, is provided with a second gap, and the second openings of the plurality of second fins jointly form the second avoidance groove; and And one end of the second heat conduction part is connected with the second substrate, and the other end of the second heat conduction part penetrates through the bottom wall of the shell and extends to the outside of the accommodating cavity.
9. The package structure of claim 8, wherein the first fin is perpendicular to the second fin.
10. The package structure of claim 8, wherein a second receiving groove is formed on the outer side of the bottom of the housing, and one end of the second heat conducting portion, which is located outside the receiving cavity, is bent and fixed in the second receiving groove.

Description

Packaging structure of high-stability laser Technical Field The utility model relates to the technical field of lasers, in particular to a packaging structure of a high-stability laser. Background The laser is widely applied to the fields of optical fiber communication, laser processing, medical equipment and the like. At present, a common laser mainly comprises a shell, a chip assembly and a cover body, wherein the shell forms an accommodating cavity for accommodating the chip assembly, and the cover body is used for sealing the accommodating cavity to protect the chip assembly from the external environment. However, after the existing laser is used for a period of time, thermal stress is generated between each component due to temperature change in the working process of the laser, and under the effect of the thermal stress, a chip assembly inside the laser is easy to loose, so that the stability of the laser is reduced. Disclosure of utility model The utility model mainly aims to provide a packaging structure of a high-stability laser, and aims to improve the stability of the laser. In order to achieve the above object, the package structure of a high stability laser according to the present utility model includes: A housing provided with a receiving cavity with an opening; The chip assembly is arranged in the accommodating cavity; a cover body fixed on the opening to close the accommodating cavity, and The first heat dissipation piece is fixed in the lid, the one end of first heat dissipation piece be equipped with the corresponding first groove of dodging in chip assembly's top, just the inner wall in first groove of dodging with the top butt of chip assembly, the other end of first heat dissipation piece passes the lid extends to the outside of acceping the chamber. In one embodiment, the first heat sink includes: the first substrate is attached to one side of the cover body, which faces the chip assembly; A plurality of first fins, one ends of which are fixed on the first substrate, the other ends of which extend towards the direction close to the chip assembly and are abutted against the top of the chip assembly, wherein one end of each of the first fins close to the chip assembly is provided with a first opening, the first openings of the plurality of first fins jointly form a first avoidance groove, and And one end of the first heat conduction part is connected with the first substrate, and the other end of the first heat conduction part penetrates through the cover body to extend to the outside of the accommodating cavity. In an embodiment, a first accommodating groove is formed in one side, away from the accommodating cavity, of the cover body, and one end, located outside the accommodating cavity, of the first heat conducting portion is bent and fixed in the first accommodating groove. In an embodiment, the first heat conducting portion is disposed on two sides of the first substrate in the width direction. In an embodiment, the electronic device further comprises a second heat dissipation element, one end of the second heat dissipation element is abutted against the side portion of the chip assembly, and the other end of the second heat dissipation element penetrates through the bottom wall of the shell and extends to the outside of the accommodating cavity. In an embodiment, the second heat dissipation element is disposed on two sides of the chip assembly in the width direction. In an embodiment, the second heat dissipation member is provided with a second avoidance groove corresponding to the side part of the chip assembly, and the inner wall of the second avoidance groove abuts against the side part of the chip assembly. In one embodiment, the second heat sink includes: The second substrate is arranged in the accommodating cavity; A second fin, one end of which is fixed on the second substrate, the other end of which extends towards the direction close to the chip assembly and is abutted against the side part of the chip assembly, the second fins are provided with a plurality of second openings, one end of each second fin, which is close to the chip assembly, is provided with a second gap, and the second openings of the plurality of second fins jointly form the second avoidance groove; and And one end of the second heat conduction part is connected with the second substrate, and the other end of the second heat conduction part penetrates through the bottom wall of the shell and extends to the outside of the accommodating cavity. In one embodiment, the first fin is perpendicular to the second fin. In an embodiment, a second accommodating groove is formed in the outer side of the bottom of the shell, and one end of the second heat conducting portion, located outside the accommodating cavity, is bent and fixed in the second accommodating groove. The packaging structure of the high-stability laser in the technical scheme of the utility model comprises a shell, a chip assembly, a cover body and