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CN-224218272-U - CO for realizing power treatment by adopting integrated PCB2Radio frequency laser power supply

CN224218272UCN 224218272 UCN224218272 UCN 224218272UCN-224218272-U

Abstract

The utility model relates to the technical field of CO 2 radio frequency lasers, in particular to a CO 2 radio frequency laser power supply for realizing power treatment by adopting an integrated PCB, which comprises a control module, an information acquisition and processing module, a primary amplification module, a power distribution module, a main amplification module, a power synthesis module, an impedance matching module and a power supply module, wherein the control module, the information acquisition and processing module, the primary amplification module, the power distribution module, the main amplification module, the power synthesis module, the impedance matching module and the power supply module are arranged on the integrated PCB; the integrated PCB replaces a coaxial cable, the volume of a power supply system is greatly reduced, the integration level is improved, the CO 2 radio frequency laser is more compact and is convenient to install and use, a colleague can accurately control the signal transmission characteristic by arranging a plurality of strip impedance lines, the loss in the high-frequency signal transmission process is reduced, the power transmission efficiency is improved, the output power and the stability of the laser are further improved, the manufacturing cost of the integrated PCB and the microstrip line balun structure is relatively low, the use of the coaxial cable and the coaxial line balun is reduced, and the production cost of the whole power supply system is reduced.

Inventors

  • LI CHUNYUAN
  • ZHANG ZHICHENG
  • YU YANG

Assignees

  • 吉林省栅莱特激光科技有限公司

Dates

Publication Date
20260508
Application Date
20250508

Claims (9)

  1. 1. The CO 2 radio frequency laser power supply for realizing power treatment by adopting the integrated PCB is characterized by comprising a control module, an information acquisition and processing module, a primary amplification module, a power distribution module, a main amplification module, a power synthesis module, an impedance matching module and a power supply module which are arranged on the integrated PCB; One end of the control module is connected with one end of the information acquisition and processing module, the other end of the information acquisition and processing module is connected with one end of the primary amplification module, the primary amplification module is further connected with one end of the strip impedance line B in the power distribution module and the power module, the other end of the strip impedance line B in the power distribution module is connected with one ends of the two strip impedance lines A, the other ends of the two strip impedance lines A are respectively connected with one ends of the first main amplification module and the second main amplification module, the other ends of the first main amplification module and the second main amplification module are respectively connected with one strip impedance line C in the power synthesis module correspondingly, the power synthesis module is further connected with the strip impedance line D in the impedance matching module, and the impedance matching module is further connected with a load.
  2. 2. The power supply of the CO 2 radio frequency laser adopting the integrated PCB to realize power processing according to claim 1, wherein the first main amplifying module and the second main amplifying module are both integrated microstrip line balun structures, specifically are two stacked microstrip lines, and the coils of the two microstrip lines are respectively arranged in 1 turn and 2 turns.
  3. 3. The CO 2 rf laser power supply employing an integrated PCB for power handling of claim 2, wherein the impedance ratio of the two microstrip lines is 1:4.
  4. 4. The power supply of the CO 2 radio frequency laser which adopts the integrated PCB to realize the power processing according to claim 1, wherein the primary amplifying module is connected with one end of the strip impedance line B through the first input port of the power distribution module, and the other ends of the two strip impedance lines a are respectively connected with one ends of the first main amplifying module and the second main amplifying module through the first output port and the second output port of the power distribution module.
  5. 5. The power supply of the CO 2 radio frequency laser which adopts the integrated PCB to realize the power processing according to claim 4, wherein the other ends of the first main amplifying module and the second main amplifying module are respectively connected with one ends of two strip impedance lines C through the second input port and the third input port of the power synthesizing module, and the other ends of the strip impedance lines C are connected with the impedance matching module through the third output port of the power synthesizing module.
  6. 6. The power supply of the CO 2 rf laser for power processing using an integrated PCB according to claim 5, wherein the other ends of the two strip-shaped impedance lines C are connected to the fourth input port of the impedance matching module through the third output port of the power combining module, and further connected to the strip-shaped impedance line D, and the other ends of the strip-shaped impedance line D are connected to the load through the fourth output port of the impedance matching module.
  7. 7. The power supply of the CO 2 rf laser for power handling using an integrated PCB of claim 1, wherein the resistance of the strip line a is 50 Ω and the resistance of the strip line B is 35 Ω.
  8. 8. The CO 2 rf laser power supply for power handling with integrated PCB of claim 1, wherein the resistance of the strip impedance line C is 50Ω.
  9. 9. The CO 2 rf laser power supply for power handling with integrated PCB of claim 1, wherein the strip impedance line D has a resistance of 25 Ω.

Description

CO 2 radio frequency laser power supply for realizing power treatment by adopting integrated PCB Technical Field The utility model relates to the technical field of CO 2 radio frequency lasers, in particular to a CO 2 radio frequency laser power supply for realizing power treatment by adopting an integrated PCB. Background In conventional CO 2 rf laser power systems, power distribution, power combining, and impedance matching are typically accomplished by means of coaxial cables. Meanwhile, balun (balun) is often of a conventional coaxial line structure. Coaxial cables have certain flexibility and transmission properties, but have many limitations in practical applications. The coaxial balun also has the defects in the aspects of integration and performance optimization due to the structural characteristics, and is particularly characterized by the following points: 1. The coaxial cable occupies a large space, which is unfavorable for miniaturization and integration design of the power supply system. The whole CO 2 radio frequency laser device is huge in size and is difficult to use in some application scenes with strict space requirements; 2. The coaxial cable can generate certain signal loss in the high-frequency signal transmission process, so that the power transmission efficiency is reduced, and the output power and stability of the laser are affected; 3. The manufacturing cost of the coaxial cable and the coaxial balun is relatively high, so that the production cost of the whole power supply system is increased; 4. the installation of coaxial cables is complex, requires specialized tools and techniques, and is difficult to troubleshoot and replace during maintenance. Disclosure of utility model Therefore, the technical problem to be solved by the utility model is to overcome the defects in the prior art, so as to provide the CO 2 radio frequency laser power supply for realizing power treatment by adopting the integrated PCB. The CO 2 radio frequency laser power supply for realizing power treatment by adopting the integrated PCB comprises a control module, an information acquisition and processing module, a primary amplifying module, a power distribution module, a main amplifying module, a power synthesis module, an impedance matching module and a power supply module which are arranged on the integrated PCB; One end of the control module is connected with one end of the information acquisition and processing module, the other end of the information acquisition and processing module is connected with one end of the primary amplification module, the primary amplification module is further connected with one end of the strip impedance line B in the power distribution module and the power module, the other end of the strip impedance line B in the power distribution module is connected with one ends of the two strip impedance lines A, the other ends of the two strip impedance lines A are respectively connected with one ends of the first main amplification module and the second main amplification module, the other ends of the first main amplification module and the second main amplification module are respectively connected with one strip impedance line C in the power synthesis module correspondingly, the power synthesis module is further connected with the strip impedance line D in the impedance matching module, and the impedance matching module is further connected with a load. Further, the first main amplifying module and the second main amplifying module are integrated microstrip line balun structures, specifically, two layers of stacked microstrip lines, and the coils of the two layers of microstrip lines are respectively arranged into 1 circle and 2 circles. Further, the impedance ratio of the two layers of microstrip lines is 1:4. Further, the primary amplifying module is connected with one end of the strip impedance line B through a first input port of the power distribution module, and the other ends of the two strip impedance lines A are correspondingly connected with one ends of the first main amplifying module and the second main amplifying module through a first output port and a second output port of the power distribution module respectively. Further, the other ends of the first main amplifying module and the second main amplifying module are correspondingly connected with one ends of two strip impedance lines C through a second input port and a third input port of the power synthesis module respectively, and the other ends of the strip impedance lines C are connected with the impedance matching module through a third output port of the power synthesis module. Further, the other ends of the two strip-shaped impedance lines C are connected with a fourth input port of the impedance matching module through a third output port of the power synthesis module, and then are connected with a strip-shaped impedance line D, and the other ends of the strip-shaped impedance lines D are connected with a loa