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CN-224218464-U - High-power PCB board heat radiation structure

CN224218464UCN 224218464 UCN224218464 UCN 224218464UCN-224218464-U

Abstract

The utility model provides a high-power PCB heat radiation structure, which comprises a heat radiation frame arranged in a polygonal structure, wherein a plurality of heat radiation fins are arranged on the inner side wall of the heat radiation frame, and a heat radiation plane which can be attached to a PCB is arranged on the outer side wall of the heat radiation frame.

Inventors

  • XIE HONG
  • XU YUANXIANG
  • ZHOU WENBO
  • XIAO KUN
  • Zhu Chengben

Assignees

  • 温州合盛电子有限公司

Dates

Publication Date
20260508
Application Date
20250529

Claims (7)

  1. 1. The high-power PCB heat dissipation structure is characterized by comprising a heat dissipation frame (1) which is arranged in a polygonal structure, wherein a plurality of heat dissipation fins (2) are arranged on the inner side wall of the heat dissipation frame (1), and a heat dissipation plane (11) which can be used for bonding the PCB is arranged on the outer side wall of the heat dissipation frame (1).
  2. 2. The high-power PCB heat dissipation structure as set forth in claim 1, wherein a plurality of positioning columns (3) are fixed on the heat dissipation plane (11), positioning holes (31) are formed in the positioning columns (3), the PCB can be inserted into the positioning columns (3), and external screws can be screwed into and fixed in the positioning holes (31).
  3. 3. The heat dissipation structure of a high-power PCB as set forth in claim 2, wherein the heat dissipation plane (11) is further provided with a heat dissipation plate (4), and the PCB is disposed between the heat dissipation plate (4) and the heat dissipation plane (11).
  4. 4. The high-power PCB heat dissipation structure of claim 3, wherein the heat dissipation plate (4) is provided with an extension lug (41), a round hole (42) is formed in the extension lug (41), a connecting column (5) is inserted into the round hole (42), a first extension ring (32) is arranged on the positioning column (3), a second extension ring (51) is arranged on the connecting column (5), a through hole is formed in the PCB, and a positioning cavity (6) for inserting the through hole of the PCB is formed between the first extension ring and the second extension ring (51) in a surrounding mode.
  5. 5. The high-power PCB heat dissipation structure as set forth in claim 3, wherein connecting teeth (52) abutting against the inner side walls of the extending lugs (41) are arranged at the outer side walls of the positioning columns (3).
  6. 6. A high-power PCB heat dissipation structure as set forth in any one of claims 3-5, wherein the heat dissipation plate (4) is a stamped heat dissipation plate or an aluminum extruded heat dissipation plate.
  7. 7. The high-power PCB heat dissipation structure as set forth in claim 6, wherein the lower end surface of the heat dissipation plate (4) is provided with an extension sheet (7) capable of being attached to a PCB chip.

Description

High-power PCB board heat radiation structure Technical Field The utility model relates to the technical field of PCB heat dissipation, in particular to a high-power PCB heat dissipation structure. Background The router has the functions of distributing network signals to a plurality of devices and realizing interconnection, a plurality of PCB boards are required to be placed in the router, and radiating fins are required to be arranged on the PCB boards in order to ensure that components on the PCB boards can normally operate, and in the patent publication number CN1503989A in the prior art, a radiator is disclosed and comprises a substrate and fins arranged above the substrate, but the structure needs to occupy a large space. Disclosure of utility model Therefore, the technical problem to be solved by the utility model is to overcome the defect that the space in the router is limited in the prior art, and a plurality of PCBs and radiating fins occupy a large amount of space, so that the polyhedral combined radiating fin capable of improving the radiating effect and simultaneously saving the occupied space of the radiating fins is provided. Therefore, the utility model provides a high-power PCB heat dissipation structure, which comprises a heat dissipation frame in a polygonal structure, wherein the inner side wall of the heat dissipation frame is provided with a plurality of heat dissipation fins, and the outer side wall of the heat dissipation frame is provided with a heat dissipation plane for the PCB to be attached. Further, a plurality of positioning columns are fixed on the heat dissipation plane, positioning holes are formed in the positioning columns, the PCB can be inserted into the positioning columns, and external screws can be screwed into and fixed in the positioning holes. Further, a radiating plate is arranged on the radiating plane, and the PCB is arranged between the radiating plate and the radiating plane. Further, the heat dissipation plate is provided with an extension lug, a round hole is formed in the extension lug, a connecting column is inserted into the round hole, a first extension ring is arranged on the positioning column, a second extension ring is arranged on the connecting column, a through hole is formed in the PCB, and a positioning cavity for the insertion of the through hole of the PCB is formed between the first extension ring and the second extension ring in a surrounding mode. Further, connecting teeth which are in butt joint with the inner side walls of the extending lugs are arranged at the outer side walls of the positioning columns. Further, the heat dissipation plate is a stamping heat dissipation plate or an aluminum extrusion heat dissipation plate. Further, an extension piece which can be attached to the PCB chip is arranged on the lower end face of the radiating plate. The technical scheme of the utility model has the following advantages: 1. According to the high-power PCB heat dissipation structure, the heat dissipation frame is of the quadrilateral structure, the heat dissipation frame can be well installed in the wireless router in a matching mode, the PCB is adhered to the outer side face of the heat dissipation frame by the special double-sided adhesive, the fixing of the PCB can be completed, the positions of the PCB can be more reasonably distributed through the arrangement of the heat dissipation frame and the heat dissipation plane, the heat dissipation effect is improved, occupied space is saved, the heat dissipation frame is of the quadrilateral structure, good supporting strength is achieved, and deformation in the use process can be effectively avoided. Drawings In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art. FIG. 1 is a schematic diagram of the whole structure of a heat dissipation structure; FIG. 2 is a schematic diagram of another overall structure of the heat dissipating structure; FIG. 3 is a schematic diagram of another overall structure of the heat dissipating structure; FIG. 4 is a schematic diagram of another overall structure of the heat dissipating structure; FIG. 5 is a schematic cross-sectional view of a heat dissipating structure; FIG. 6 is an enlarged view of portion A of FIG. 5; FIG. 7 is a schematic diagram of a heat dissipating structure with a portion of the heat dissipating plate removed; Fig. 8 is a schematic view of the back structure of the heat dissipating plate. Reference numerals illustrate: 1. a heat dissipation frame; 11 parts of heat dissipation plane, 2 parts of heat dissipation fin, 3 parts of positionin