CN-224218481-U - Intelligent sound equipment main board structure based on circuit layered layout

CN224218481UCN 224218481 UCN224218481 UCN 224218481UCN-224218481-U

Abstract

The utility model discloses an intelligent sound main board structure based on circuit layered layout, which comprises a sound main board structure, an assembly component and a connecting component, wherein the sound main board structure comprises a high-frequency board, a low-frequency board and a composite shielding board, the high-frequency board is arranged at the upper end of the low-frequency board, the composite shielding board is arranged in the middle of the high-frequency board and the low-frequency board, the assembly component is arranged at two sides of the high-frequency board and the low-frequency board and comprises clamping grooves formed in two sides of the high-frequency board, moving grooves are formed in two sides of the low-frequency board, auxiliary grooves are formed in the moving grooves, connecting rods are adaptively connected in the moving grooves, the end parts of the connecting rods are connected with supporting plates, the other ends of the connecting rods are connected with connecting bent rods, the end parts of the connecting bent rods are connected with clamping blocks, the main board can be vertically layered, the transverse volume of the main board is reduced, signals are shielded between the high-frequency board and the low-frequency board through the composite shielding board, high-frequency radiation is absorbed, and plane space is compressed, and therefore the problem of signal crosstalk is reduced.

Inventors

WANG JUTAO
Ding Tianhu
CAI ZIQI

Assignees

浙江丁壹智慧科技有限公司

Dates

Publication Date: 20260508
Application Date: 20250605

Claims (9)

1. Intelligent sound main board structure based on circuit layering layout, its characterized in that includes: The sound equipment main board structure comprises a high-frequency board, a low-frequency board and a composite shielding board, wherein the high-frequency board is positioned at the upper end of the low-frequency board, and the composite shielding board is positioned in the middle of the high-frequency board and the low-frequency board; The assembly component is arranged on two sides of the high-frequency plate and the low-frequency plate and comprises clamping grooves formed in two sides of the high-frequency plate, moving grooves are formed in two sides of the low-frequency plate, auxiliary grooves are formed in the moving grooves, connecting rods are connected to the inner adaptation of the moving grooves, end portions of the connecting rods are connected with supporting plates, the other ends of the connecting rods are connected with connecting elbow rods, and clamping blocks are connected to the end portions of the connecting elbow rods.
2. The intelligent sound main board structure based on the circuit layered layout according to claim 1, wherein four groups of positioning grooves are formed in the bottom of the high-frequency board, and the positioning grooves are of a cylindrical structure.
3. The intelligent sound main board structure based on the circuit layered layout according to claim 2, wherein a plurality of groups of neodymium-iron-boron magnet blocks are arranged in the middle of the high-frequency board, the neodymium-iron-boron magnet blocks are distributed in an array, and an installation groove matched with the neodymium-iron-boron magnet blocks is formed in the middle of the high-frequency board.
4. The intelligent sound main board structure based on the circuit layered layout of claim 3, wherein a plurality of groups of spring pins are arranged at the bottom of the high-frequency board near the inner ring of the neodymium-iron-boron magnet block, and the spring pins are distributed in an array.
5. The intelligent sound main board structure based on the circuit layered layout according to claim 4, wherein the length of the spring needle is 2mm, the spring needle is retracted by 0.8mm when pressed, and the outer side of the spring needle is coated with gold plating.
6. The intelligent sound main board structure based on the circuit layered layout according to claim 1, wherein the upper end of the low-frequency board is connected with a soft iron magnetic conductive sheet corresponding to the between the neodymium-iron-boron magnet blocks, and the diameter of the soft iron magnetic conductive sheet is larger than that of the neodymium-iron-boron magnet blocks.
7. The intelligent sound main board structure based on the circuit layered layout according to claim 1, wherein gold-plated bonding pads which are in contact with spring pins are distributed at the upper end of the low-frequency board, and the diameter of each gold-plated bonding pad is 1.2mm.
8. The intelligent sound main board structure based on the circuit layered layout of claim 4, wherein the composite shielding plate is an inner layer and an outer layer, the inner layer is an aluminum substrate, the outer layer is an iron oxide layer, the upper end of the composite shielding plate is fixedly connected with a positioning column matched with the positioning groove, the positioning column is of a cylindrical structure, honeycomb holes for containing spring pins are formed in the middle of the composite shielding plate, and the number of the honeycomb holes is equal to that of the spring pins.
9. The intelligent sound main board structure based on the circuit layered layout according to claim 1, wherein a compression spring is connected between the supporting plate and the auxiliary groove, the compression spring wraps the outer side of the connecting rod, and a round angle is arranged at one side edge of the clamping block.

Description

Intelligent sound equipment main board structure based on circuit layered layout Technical Field The utility model relates to the technical field of sound mainboards, in particular to an intelligent sound mainboard structure based on circuit layered layout. Background The intelligent sound main board is a core control module of the intelligent sound, and is usually integrated with a high-performance processor (such as an ARM architecture chip), a memory, a storage unit and a wireless communication module (Wi-Fi/Bluetooth), so as to support voice interaction, network connection and intelligent home control functions. The microphone array is built in, and part of the main boards are also provided with AI acceleration units so as to improve the localization semantic processing capacity. With the development of intelligent audio equipment to high integration and multifunction, the design of a main board of the intelligent audio equipment faces multiple challenges such as electromagnetic compatibility (EMC), space utilization, maintainability and the like. In the traditional PCB layout, the structure of the main board is larger, the occupied area is larger, layering combination cannot be performed, meanwhile, signal crosstalk is easily caused by coplanar wiring of the high-frequency module and the low-frequency module, and audio distortion or communication interruption is caused. Disclosure of utility model The utility model provides an intelligent sound main board structure based on circuit layered layout, which can vertically layer-design a main board, reduce the transverse volume of the main board, shield signals between a high-frequency board and a low-frequency board through a composite shielding board, absorb high-frequency radiation and compress a plane space, thereby reducing the problem of signal crosstalk. The utility model provides an intelligent sound main board structure based on circuit layered layout, which comprises: The sound equipment main board structure comprises a high-frequency board, a low-frequency board and a composite shielding board, wherein the high-frequency board is positioned at the upper end of the low-frequency board, and the composite shielding board is positioned in the middle of the high-frequency board and the low-frequency board; The assembly component is arranged on two sides of the high-frequency plate and the low-frequency plate and comprises clamping grooves formed in two sides of the high-frequency plate, moving grooves are formed in two sides of the low-frequency plate, auxiliary grooves are formed in the moving grooves, connecting rods are connected to the inner adaptation of the moving grooves, end portions of the connecting rods are connected with supporting plates, the other ends of the connecting rods are connected with connecting elbow rods, and clamping blocks are connected to the end portions of the connecting elbow rods. In the intelligent sound main board structure based on the circuit layered layout of the embodiment of the utility model, four groups of positioning grooves are formed in the bottom of the high-frequency board, and the positioning grooves are of a cylindrical structure. In the intelligent sound main board structure based on the circuit layered layout of the embodiment of the utility model, a plurality of groups of neodymium-iron-boron magnet blocks are arranged in the middle of the high-frequency board, the neodymium-iron-boron magnet blocks are distributed in an array, and mounting grooves matched with the neodymium-iron-boron magnet blocks are formed in the middle of the high-frequency board. In the intelligent sound main board structure based on the circuit layered layout, a plurality of groups of spring pins are arranged at the bottom of the high-frequency board and close to the inner ring of the neodymium-iron-boron magnet block, and the spring pins are distributed in an array. In the intelligent sound main board structure based on the circuit layered layout, the length of the spring needle is 2mm, the spring needle is retracted by 0.8mm when pressed, and the outer side of the spring needle is coated with a gold plating layer. In the intelligent sound main board structure based on the circuit layered layout of the embodiment of the utility model, the upper end of the low-frequency board is connected with the soft iron magnetic conduction sheet corresponding to the between the neodymium-iron-boron magnet blocks, and the diameter of the soft iron magnetic conduction sheet is larger than that of the neodymium-iron-boron magnet blocks. In the intelligent sound main board structure based on the circuit layered layout of the embodiment of the utility model, the upper end of the low-frequency board is distributed with gold-plated bonding pads which are contacted with the spring pins, and the diameter of each gold-plated bonding pad is 1.2mm. In the intelligent sound main board structure based on the circuit layered layout of the embodiment of th