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CN-224218485-U - Microphone and electronic equipment

CN224218485UCN 224218485 UCN224218485 UCN 224218485UCN-224218485-U

Abstract

The utility model provides a microphone and electronic equipment, which comprises a substrate and a chip body, wherein the chip body is positioned above the substrate, a first electrode layer on the chip body is connected with the substrate, a back electrode plate assembly is arranged above the substrate and comprises a supporting frame and is connected with the chip body through a connecting piece, the chip body is positioned between the supporting frame and the substrate, a second electrode layer is arranged on one side of the supporting frame, which faces the chip body, a vibrating diaphragm is arranged at the top of the chip body, a variable capacitor is formed between the vibrating diaphragm and the second electrode layer, a plurality of groups of sound hole groups are arranged on the supporting frame, each sound hole group comprises a sound hole groove, and a plurality of groups of strip-shaped sound holes are formed in the sound hole groove. The microphone changes the sound wave propagation path through a plurality of groups of sound holes, reduces standing wave generation, improves high-frequency response, realizes stable connection of the supporting frame and the chip body by the connecting piece, and reduces vibration conduction.

Inventors

  • XIE QUN
  • ZHANG LI

Assignees

  • 深圳市嘉宏信息有限公司

Dates

Publication Date
20260508
Application Date
20250603

Claims (9)

  1. 1. The microphone comprises a substrate (11) and a chip body (21), and is characterized in that: The chip body (21) is positioned above the substrate (11), a first electrode layer (22) is arranged on one side of the chip body (21) facing the substrate (11), and the first electrode layer (22) is connected with the substrate (11); A back electrode plate assembly is arranged above the base plate (11), the back electrode plate assembly comprises a supporting frame (31), the supporting frame (31) is connected with the chip body (21) through a connecting piece, and the chip body (21) is positioned between the supporting frame (31) and the base plate (11); A second electrode layer (32) is arranged on one side, facing the chip body (21), of the supporting frame (31), a vibrating diaphragm (23) is arranged on the top of the chip body (21), and a variable capacitor is formed between the vibrating diaphragm (23) and the second electrode layer (32); The sound hole assembly comprises a support frame (31), wherein a plurality of groups of sound hole groups are arranged on the support frame (31), sound hole grooves (33) are formed in the support frame (31), and a plurality of groups of strip-shaped sound holes (34) are formed in the sound hole grooves (33).
  2. 2. A microphone according to claim 1, characterized in that: The substrate (11) central part is provided with installation boss (12), first electrode layer (22) are installed on installation boss (12), wear to be equipped with two sets of symmetrical conductive column (24) on first electrode layer (22), conductive column (24) top wears to establish in chip body (21), conductive column (24) bottom with copper foil circuit on substrate (11) is connected, first electrode layer (22) are passed through conductive column (24) with substrate (11) are connected.
  3. 3. A microphone according to claim 2, characterized in that: The connecting piece comprises an elastic arm (41), four groups of mounting grooves (35) are formed in the supporting frame (31), the mounting grooves (35) are located at opposite angles of the supporting frame (31), mounting clamping grooves (25) are formed in the chip body (21) corresponding to the mounting grooves (35), one end of the elastic arm (41) is clamped in the mounting grooves (35), the other end of the elastic arm is clamped in the mounting clamping grooves (25), and a gap is formed between the supporting frame (31) and the chip body (21); The elastic arm (41) is arranged in a U-shaped mode, the opening face faces the center of the supporting frame (31), and the contact face of the elastic arm (41) and the chip body (21) is arranged to be a chamfer.
  4. 4. A microphone according to claim 3, characterized in that: The supporting frame (31) is made of low-stress silicon nitride.
  5. 5. A microphone according to claim 1, characterized in that: anchor points are arranged at four corners of the vibrating diaphragm (23), and the vibrating diaphragm (23) is connected with the chip body (21) through a plurality of groups of anchor points; The chip body (21) is provided with a groove (26), the vibrating diaphragm (23) is in contact with the chip body (21), and a cavity is formed through the groove (26).
  6. 6. A microphone according to claim 4, characterized by: Wherein the sound hole grooves (33) of one sound hole group are intersected with the sound hole grooves (33) of the adjacent sound hole group, wherein the strip-shaped sound holes (34) of the central parts of the two sound hole grooves (33) are intersected.
  7. 7. A microphone according to claim 1, characterized in that: The surface of the second electrode layer (32) is provided with a release coating, and the release coating is a diamond-like carbon film.
  8. 8. A microphone according to claim 1, characterized in that: The packaging structure is characterized in that a packaging shell (42) is arranged above the substrate (11), a plurality of groups of bonding pad pins (43) are arranged on the packaging shell (42), the bonding pad pins (43) are connected with the substrate (11), a packaging cavity is formed between the packaging shell (42) and the substrate (11), and the back electrode plate assembly and the chip body (21) are both located in the packaging cavity.
  9. 9. An electronic device comprising a microphone according to any of the claims 1-8.

Description

Microphone and electronic equipment Technical Field The utility model belongs to the technical field of microphones, and particularly relates to a microphone and electronic equipment. Background The microphone is used as a core acoustic element, can effectively collect acoustic signals, is widely applied to the field of acoustic signal collection, but sound Kong Duowei of the microphone is arranged in a single direction, standing waves are easily formed after the sound waves are reflected on the surface of the back electrode plate, so that high-frequency response is poor, meanwhile, the vibrating diaphragm supporting structure adopts a rigid fixing mode, substrate vibration is easily conducted to the vibrating diaphragm, mechanical noise is increased, and the sound collection quality and the service performance of the microphone are seriously affected. Disclosure of utility model In order to solve the technical problems, the utility model provides a microphone and electronic equipment, which are used for solving the technical problems that in the prior art, the traditional microphone has single sound hole arrangement, which causes poor high-frequency response, mechanical noise is caused by rigid fixation of a vibrating diaphragm, and the sound collection quality is influenced. The utility model provides a microphone and an electronic device, which are achieved by the following specific technical means: The microphone comprises a substrate and a chip body, wherein the chip body is positioned above the substrate, a first electrode layer is arranged on one side of the chip body, which faces the substrate, and the first electrode layer is connected with the substrate; A back electrode plate assembly is arranged above the substrate, the back electrode plate assembly comprises a supporting frame, the supporting frame is connected with the chip body through a connecting piece, and the chip body is positioned between the supporting frame and the substrate; A second electrode layer is arranged on one side, facing the chip body, of the supporting frame, a vibrating diaphragm is arranged at the top of the chip body, and a variable capacitor is formed between the vibrating diaphragm and the second electrode layer; The sound hole assembly comprises a support frame and is characterized in that a plurality of groups of sound hole groups are arranged on the support frame, each sound hole group comprises a sound hole groove formed in the support frame, and a plurality of groups of strip-shaped sound holes are formed in the sound hole grooves. According to a preferred embodiment, the central part of the substrate is provided with a mounting boss, the first electrode layer is mounted on the mounting boss, two groups of symmetrical conductive columns are arranged on the first electrode layer in a penetrating manner, the tops of the conductive columns are arranged in the chip body in a penetrating manner, the bottoms of the conductive columns are connected with copper foil circuits on the substrate, and the first electrode layer is connected with the substrate through the conductive columns. According to a preferred embodiment, the connecting piece comprises an elastic arm, the supporting frame is provided with four groups of mounting grooves, the mounting grooves are positioned at opposite angles of the supporting frame, the chip body is provided with mounting clamping grooves corresponding to the mounting grooves, one end of the elastic arm is clamped in the mounting grooves, the other end of the elastic arm is clamped in the mounting clamping grooves, and a gap is formed between the supporting frame and the chip body; The elastic arm is U-shaped, the opening face faces towards the center of the supporting frame, and the contact face of the elastic arm and the chip body is provided with a chamfer. According to a preferred embodiment, the support frame is of low stress silicon nitride material. According to a preferred embodiment, anchor points are arranged at four corners of the vibrating diaphragm, and the vibrating diaphragm is connected with the chip body through a plurality of groups of anchor points; The chip body is provided with a groove, the vibrating diaphragm is in contact with the chip body, and a cavity is formed through the groove. According to a preferred embodiment, wherein said sound hole slots of one set of said sound hole groups intersect said sound hole slots of an adjacent pair of said sound hole groups, wherein said strip-shaped sound holes of the center portions of two sets of said sound hole slots intersect. According to a preferred embodiment, the surface of the second electrode layer is provided with a release coating, which is a diamond-like carbon film. According to a preferred embodiment, a package housing is arranged above the substrate, a plurality of groups of pad pins are arranged on the package housing, the pad pins are connected with the substrate, a package cavity is formed between the packa