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CN-224218527-U - Heating ring for etching machine cavity

CN224218527UCN 224218527 UCN224218527 UCN 224218527UCN-224218527-U

Abstract

The utility model relates to the technical field of semiconductor equipment, and particularly discloses a heating ring for a cavity of an etching machine, which comprises an inner ring layer, wherein the inner ring layer is a high-heat-conductivity ceramic matrix, a plurality of radial grooves are formed in the surface of the inner ring layer, a resistance wire array is embedded in the grooves, the central area of the cavity is intensively heated through a plurality of groups of independent resistance wires, a continuous S-shaped platinum heating film of the outer ring layer is uniformly distributed along the edge of the cavity, the coverage area of a heat source is prolonged through a snake-shaped path, the heat loss of the edge is compensated, the temperature is controlled in a partitioning way, the temperature uniformity is good, the defect of uneven edge of wafer etching is effectively reduced, the K-type thermocouple on the surface of the inner ring layer and a film temperature sensor on the back of the outer ring layer collect temperature data in real time and feed back to an external PID controller, and the external PID controller dynamically adjusts the power output of the resistance wire array and the platinum heating film according to the temperature difference, so that the temperature precision adjustment is realized.

Inventors

  • WANG DIXING
  • PENG DONGDONG

Assignees

  • 无锡迪渊特科技有限公司

Dates

Publication Date
20260508
Application Date
20250430

Claims (6)

  1. 1. A heating ring for an etcher chamber comprising: the inner ring layer (1), the inner ring layer (1) is a high heat conduction ceramic matrix, a plurality of radial grooves (3) are formed in the surface of the inner ring layer (1), a resistance wire array (4) is embedded in the grooves (3), and two ends of the resistance wire are connected to copper electrode plates (5) on the back of the inner ring layer (1); The outer ring layer (2), the outer ring layer (2) is a corrosion-resistant aluminum alloy matrix, a continuous S-shaped heating film groove (6) is formed in the surface of the outer ring layer (2), a platinum heating film (7) is embedded in the heating film groove (6), and two ends of the platinum heating film (7) are connected with plug-in terminals (8) on the side edge of the outer ring layer (2); An insulating sheet (9) is arranged between the inner ring layer (1) and the outer ring layer (2).
  2. 2. A heating ring for an etcher cavity as in claim 1, characterized in that the outer surface of the outer ring layer (2) is covered with an aluminum nitride radiation reflective coating (10) with a thickness of 50 μm.
  3. 3. The heating ring for an etching machine cavity according to claim 1, wherein the outer wall of the outer ring layer (2) is fixedly connected with a flange ring (11), and a plurality of mounting holes (12) are formed in the outer wall of the flange ring (11) in a penetrating manner.
  4. 4. A heating ring for an etcher cavity as claimed in claim 1, characterized in that the surface of the inner ring layer (1) is provided with a plurality of K-type thermocouples (13) embedded along the circumference, the back of the outer ring layer (2) is provided with a plurality of film temperature sensors (14), and the film temperature sensors (14) are connected to an external PID controller through shielded cables.
  5. 5. A heating ring for an etcher cavity as in claim 1, wherein the side wall of the outer ring layer (2) is provided with a plurality of heat dissipation holes (15) in a rectangular structure.
  6. 6. A heating ring for an etcher chamber as claimed in claim 1, wherein the copper electrode plate (5) is led out through a silica gel insulated high temperature resistant wire.

Description

Heating ring for etching machine cavity Technical Field The utility model relates to the technical field of semiconductor equipment, and particularly discloses a heating ring for a cavity of an etching machine. Background In the field of semiconductor manufacturing, temperature control of the etcher cavity is one of the key factors affecting process accuracy. The heating ring is used as a cavity core temperature control component, and a uniform and stable thermal field needs to be provided in the plasma etching process so as to ensure the consistency of etching rate and the wafer processing yield. The conventional heating ring usually adopts a ring-shaped resistance wire or a single heating film structure, and heat conduction is carried out by directly attaching to the surface of the cavity, so that the performance of the heating ring is directly related to the reliability of an etching process and the stability of long-term operation of equipment. However, the existing heating ring design still has the obvious defects that firstly, the temperature difference between the center and the edge area of the cavity is large due to single layout of the traditional resistance wire or the heating film, and high-precision temperature uniformity is difficult to realize, secondly, the heating element and the cavity are high in integration level, the heating element and the cavity are required to be integrally disassembled and replaced when in faults, the maintenance cost is high, the downtime is long, thirdly, the design of efficient heat dissipation and heat reflection is lacked, heat is easy to dissipate to a non-target area, and energy waste is caused. In addition, the temperature feedback system of the existing structure has a response lag, and is difficult to meet the requirement of an advanced etching process on dynamic temperature control. Therefore, there is a need for a heating ring solution that is structurally optimized, temperature controlled accurately and easy to maintain. Disclosure of utility model The utility model provides a heating ring for an etching machine cavity, which has the advantages of partition temperature control and good temperature uniformity, effectively reduces the defect of uneven edge of wafer etching, and realizes temperature precision adjustment by dynamically adjusting the power output of a resistance wire array and a platinum heating film by an external PID controller according to the temperature difference. The utility model is achieved by a heating ring for an etcher chamber comprising: The inner ring layer is a high-heat-conductivity ceramic matrix, a plurality of radial grooves are formed in the surface of the inner ring layer, a resistance wire array is embedded in the grooves, and two ends of the resistance wire are connected to copper electrode plates at the back of the inner ring layer; The outer ring layer is a corrosion-resistant aluminum alloy substrate, a continuous S-shaped heating film groove is formed in the surface of the outer ring layer, a platinum heating film is embedded into the heating film groove, and two ends of the platinum heating film are connected with plug-in terminals on the side edge of the outer ring layer; an insulating sheet is arranged between the inner ring layer and the outer ring layer. As a preferred heating ring for an etcher cavity of the present utility model, the outer surface of the outer ring layer is covered with an aluminum nitride radiation reflective coating having a thickness of 50 μm. As a heating ring for the etching machine cavity, preferably, the outer wall of the outer ring layer is fixedly connected with a flange ring, and a plurality of mounting holes are formed in the outer wall of the flange ring in a penetrating manner. As a heating ring for the etching machine cavity, preferably, a plurality of K-type thermocouples are embedded in the surface of the inner ring layer along the circumference, a plurality of film temperature sensors are arranged on the back of the outer ring layer, and the film temperature sensors are connected to an external PID controller through shielded cables. As a preferable heating ring for the etching machine cavity, the side wall of the outer ring layer is provided with a plurality of radiating holes with rectangular structures. As a heating ring for the etching machine cavity, the copper electrode plate is preferably led out through a silica gel insulated high-temperature resistant wire. The beneficial effects of the utility model are as follows: The radial groove embedded resistance wire array of inner ring layer carries out central heating to cavity central region through the independent resistance wire of multiunit, and the continuous S shape platinum heating film of outer ring layer is along cavity edge evenly distributed, and through snakelike route extension heat source coverage, compensation edge heat loss, subregion accuse temperature, temperature uniformity is good, effectively reduces t