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CN-224218567-U - HDI board

CN224218567UCN 224218567 UCN224218567 UCN 224218567UCN-224218567-U

Abstract

The application discloses an HDI board, and relates to the technical field of circuit board design. The HDI plate comprises a substrate and a wiring layer group which are stacked, wherein the HDI plate is provided with a laser hole group, the laser hole group is positioned on the wiring layer group, the central axis of each laser hole of the laser hole group extends along the thickness direction of the HDI plate, kong Changjun of each laser hole of the laser hole group is smaller than the thickness of the wiring layer group, and the first end of the laser hole group extends to one surface of the wiring layer group, which is away from the substrate. The scheme can solve the problem that laser holes of the existing HDI plate are easy to fail under the condition of high temperature and high pressure.

Inventors

  • HUANG LIYING
  • YE CHUNXIA
  • GAO TAO
  • YE CHANGQING

Assignees

  • 浙江欣旺达电子有限公司

Dates

Publication Date
20260508
Application Date
20250326

Claims (10)

  1. 1. An HDI board is characterized by comprising a stacked substrate (110) and a wiring layer group, The HDI board is provided with a laser perforation group (140), the laser perforation group (140) is located in the wiring layer group, a central axis of each laser perforation (141) of the laser perforation group (140) extends along the thickness direction of the HDI board, kong Changjun of each laser perforation (141) of the laser perforation group (140) is smaller than the thickness of the wiring layer group, and a first end of the laser perforation group (140) extends to one surface of the wiring layer group, which is away from the substrate (110).
  2. 2. The HDI board of claim 1 wherein the wiring layer set includes an adhesive layer (120) and a metal layer (130), the adhesive layer (120) being disposed between the metal layer (130) and the substrate (110), the second end of the laser aperture set (140) extending through the adhesive layer (120) to the metal layer (130) and being electrically connected to the metal layer (130), The surface of the wiring layer group, which is away from the substrate (110), is formed by the bonding layer (120), or the surface of the wiring layer group, which is away from the substrate (110), is formed by the metal layer (130).
  3. 3. The HDI board of claim 2 wherein the set of laser holes (140) includes at least two of the laser holes (141) disposed side-by-side in a direction perpendicular to a thickness direction of the HDI board, adjacent the laser holes (141) being electrically conductive.
  4. 4. The HDI board of claim 3, wherein each of the laser holes (141) includes a first hole section (141 a) and a second hole section (141 b) that are in communication, the first hole section (141 a) being coaxial with the second hole section (141 b), a width of the first hole section (141 a) being larger than a width of the second hole section (141 b) in a direction perpendicular to a thickness direction of the HDI board, the first hole section (141 a) being provided at a layer of the wiring layer group farthest from the substrate (110), an end of the second hole section (141 b) remote from the first hole section (141 a) extending through the adhesive layer (120) to the metal layer (130).
  5. 5. The HDI board according to claim 4, characterized in that the width of the first hole section (141 a) is 0.25-0.35 mm and the width of the second hole section (141 b) is 0.1-0.15 mm in a direction perpendicular to the thickness direction of the HDI board.
  6. 6. The HDI board of claim 3 wherein each of said laser holes (141) are equal in size.
  7. 7. The HDI board according to claim 2, wherein the number of the adhesive layers (120) and the metal layers (130) is at least two, each of the metal layers (130) and each of the adhesive layers (120) is alternately arranged in sequence in a thickness direction of the substrate (110), each of the at least two metal layers (130) includes a first metal layer (131) and a second metal layer (132) arranged at intervals, The number of the laser hole groups (140) is at least two, the at least two laser hole groups (140) comprise a first laser hole group (140 a) and a second laser hole group (140 b) which are arranged at intervals, the first end of the first laser hole group (140 a) and the first end of the second laser hole group (140 b) are both extended to one surface of the wiring layer group, which is away from the substrate (110), the second end of the first laser hole group (140 a) is extended to the first metal layer (131), and the second end of the second laser hole group (140 b) is extended to the second metal layer (132).
  8. 8. The HDI board according to claim 1, wherein the wiring layer groups are provided on first and second sides of the substrate (110) opposite to each other in a thickness direction of the HDI board, the wiring layer groups on the first side are first wiring layer groups, the wiring layer groups on the second side are second wiring layer groups, The number of the laser hole groups (140) is at least two, the at least two laser hole groups (140) comprise a third laser hole group (140 c) and a fourth laser hole group (140 d), the third laser hole group (140 c) is arranged on the first wiring layer group, the first end of the third laser hole group (140 c) extends to the surface, deviating from the substrate (110), of the first wiring layer group, the fourth laser hole group (140 d) is arranged on the second wiring layer group, and the first end of the fourth laser hole group (140 d) extends to the surface, deviating from the substrate (110), of the second wiring layer group.
  9. 9. The HDI board of claim 1, wherein a side of the wiring layer set facing away from the substrate (110) is provided with a pad (150), the laser aperture set (140) is located on the pad (150), and the first end of the laser aperture set (140) extends to a side of the pad (150) facing away from the substrate (110).
  10. 10. The HDI board of claim 1 wherein a land (150) is provided on a side of the wiring layer set facing away from the substrate (110), the laser aperture set (140) being offset from the land (150).

Description

HDI board Technical Field The application belongs to the technical field of circuit board design, and particularly relates to an HDI board. Background The HDI board (HIGH DENSITY Interconnector, high-density interconnection board) is a circuit board with higher circuit distribution density by using micro blind buried hole technology, and has higher electrical performance and signal accuracy than that of a common PCB, and in addition, the HDI board has better improvement on radio frequency interference, electromagnetic wave interference, electrostatic discharge, heat conduction and the like. At present, the HDI board is a circuit board type applied to more and more products at present, and the market demand is large, but the production and manufacturing technology process of the HDI board is more complex than that of a conventional circuit board, and more working procedures are needed for manufacturing and monitoring. In practical application, the HDI board needs to be tested at high temperature and high pressure, in this case, the requirements on the high temperature resistance and the high temperature resistance of the HDI board are high, and delamination of different material layers after high temperature and high pressure is usually unavoidable, which leads to failure of part of laser perforation on the HDI board. Disclosure of utility model The embodiment of the application aims to provide an HDI board, which can solve the problem that laser holes of the existing HDI board are easy to fail under the condition of high temperature and high pressure. In order to solve the technical problems, the application is realized as follows: The embodiment of the application provides an HDI board which comprises a stacked substrate and a wiring layer group, The HDI board is equipped with radium perforation group, radium perforation group is located wiring layer group, the center pin of each radium perforation of radium perforation group is followed the thickness direction of HDI board extends, just each radium perforation of radium perforation group Kong Changjun is less than the thickness of wiring layer group, the first end of radium perforation group extends to the wiring layer group deviates from the one side of base plate. In the embodiment of the application, the HDI plate is provided with the radium perforation group, the radium perforation group is positioned on the wiring layer group, the central axis of each radium perforation of the radium perforation group extends along the thickness direction of the HDI plate, kong Changjun of each radium perforation of the radium perforation group is smaller than the thickness of the wiring layer group, and the first end of the radium perforation group extends to one surface of the wiring layer group, which is away from the substrate, namely the radium perforation group is of a blind hole structure. When the HDI plate is at high temperature and high pressure, the laser hole group in the scheme can disperse heat in a single laser hole relative to the single laser hole, so that the expansion amount of a metal coating coated on the inner wall of the laser hole is reduced, the acting force between the metal coating and a metal layer in a wiring layer group is reduced, the risk of splitting at the joint of the metal coating and the wiring layer group is further reduced, the single laser hole is prevented from being invalid, and further, even if one laser hole in the laser hole group is invalid, other laser holes can work to meet the normal electric connection requirement. Drawings FIG. 1 is a top view of a portion of the structure of an HDI plate according to an embodiment of the present application; fig. 2 is a cross-sectional view showing a part of the structure of an HDI board according to an embodiment of the present application. Reference numerals illustrate: 110-substrate, 120-adhesive layer, 130-metal layer, 131-first metal layer, 132-second metal layer, 140-laser aperture set, 140 a-first laser aperture set, 140 b-second laser aperture set, 140 c-third laser aperture set, 140 d-fourth laser aperture set, 141-laser aperture, 141 a-first aperture segment, 141 b-second aperture segment, 150-pad. Detailed Description The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that some, but not all embodiments of the application are described. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application. The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments o