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CN-224218568-U - Heat conduction and radiation integrated circuit board of mining machine

CN224218568UCN 224218568 UCN224218568 UCN 224218568UCN-224218568-U

Abstract

The utility model relates to the field of circuit boards, in particular to a heat conduction and heat dissipation integrated circuit board of an ore machine, which comprises a heat conduction plate, wherein heat dissipation blocks which are uniformly distributed are fixedly connected to the lower end of the heat conduction plate, and a first high-heat conduction insulating layer is fixedly connected to the upper end of the heat conduction plate. According to the utility model, the aluminum substrate and the heat conduction silicone grease layer are removed, the high heat conduction insulating layer is adopted to directly bridge the chip to be connected with the heat conduction plate, so that the heat transfer level is greatly shortened, the interface thermal resistance is obviously reduced, the rapid directional conduction of heat is realized, the stability of the working temperature of the chip is improved, the performance fluctuation of the traditional structure caused by the thermal attenuation of multiple layers of media is effectively avoided, the three-dimensional heat dissipation channel is constructed through the cooperative design of the T-shaped heat dissipation groove and the columnar heat conduction column, the air convection efficiency is enhanced, the heat conduction plate made of high heat conduction materials is combined, the integral heat dissipation capacity is obviously improved, the continuous and stable operation of the chip under the high-load working condition is ensured, and the space limitation of the traditional heat dissipation system is broken through the compact structural design.

Inventors

  • HUANG PENG
  • YANG SHUANG

Assignees

  • 东莞市康纳电子科技有限公司

Dates

Publication Date
20260508
Application Date
20250327

Claims (5)

  1. 1. The mining machine heat conduction and radiation integrated circuit board comprises a heat conduction plate (1) and is characterized in that a heat radiation block (2) which is uniformly distributed is fixedly connected to the lower end of the heat conduction plate (1), a first high heat conduction insulating layer (3) is fixedly connected to the upper end of the heat conduction plate (1), a first circuit copper foil (4) and a second circuit copper foil (6) are fixedly connected to the upper end of the first high heat conduction insulating layer (3), gaps are reserved at one ends, close to each other, of the first circuit copper foil (4) and the second circuit copper foil (6) respectively, the inner wall of the first circuit copper foil (4) is fixedly connected with a second high heat conduction insulating layer (5), the inner wall of the second circuit copper foil (6) is fixedly connected with a third high heat conduction insulating layer (7), a solder paste layer (8) is fixedly connected to the upper end of the second circuit copper foil (6), a chip body (9) is fixedly connected to the upper end of the solder paste layer (8), the opening directions of the first circuit copper foil (4) and the second circuit copper foil (6) are opposite, gaps are reserved at one ends, which are close to each other, the lengths of the gaps are larger than those of the inner walls of the third copper foil (4) and the third copper foil (14) which are uniformly distributed on the inner sides of the heat radiation plate (1) and penetrate through a third heat radiation groove (10), the heat conducting plate (1) is made of heat conducting materials.
  2. 2. The integrated circuit board for heat conduction and heat dissipation of mineral processing machine as set forth in claim 1, wherein the second heat dissipation grooves (11) are uniformly distributed on one side of the heat conduction board (1), the second heat dissipation grooves (11) are rectangular grooves, and the second heat dissipation grooves (11) are communicated with the first heat dissipation grooves (10).
  3. 3. The integrated circuit board for heat conduction and heat dissipation of a mining machine according to claim 2, wherein the top surface and the bottom surface of the inner wall of the second heat dissipation groove (11) are provided with cylindrical grooves (12), and the inner wall of each cylindrical groove (12) is fixedly connected with a heat conduction column (13).
  4. 4. The integrated circuit board for heat conduction and heat dissipation of mining machine according to claim 3, wherein two sides of the heat conduction column (13) are flush with two sides of the heat conduction plate (1), and two sides of the heat dissipation block (2) are flush with two sides of the heat conduction plate (1).
  5. 5. The integrated circuit board for heat conduction and heat dissipation of a mining machine according to claim 1, wherein the upper end of the first circuit copper foil (4) is flush with the upper end face of the second circuit copper foil (6), and the thicknesses of the first circuit copper foil (4) and the second circuit copper foil (6) are equal.

Description

Heat conduction and radiation integrated circuit board of mining machine Technical Field The utility model belongs to the field of circuit boards, and particularly relates to a heat conduction and radiation integrated circuit board of a mining machine. Background In the cryptocurrency mining industry, the mining machine is used as core equipment, the performance improvement of the mining machine brings higher requirements to a heat radiation system, and high heat generated by a chip during the operation of the mining machine is led out through a high-efficiency heat radiation path, otherwise, the performance of the equipment is reduced, the service life is shortened and even the equipment fails. Traditional ore deposit machine heat radiation structure relies on multilayer medium conduction heat, including chip, solder paste, copper foil, insulating layer, aluminium base board, heat conduction silicone grease and radiator, and the heat needs to pass through multiple interface transmission, leads to thermal resistance accumulation, and heat conduction silicone grease layer easily receives thickness, homogeneity and ageing problem influence, further reduces heat dissipation stability, and in addition, complicated structure leads to the ore deposit organism huge, the assembly is loaded down with trivial details, is difficult to satisfy intensive deployment demand. Therefore, the heat conduction and heat dissipation integrated circuit board of the ore machine is provided, an aluminum substrate and a heat conduction silicone grease layer are omitted, a heat dissipation function is integrated on a PCB substrate, a chip and a radiator are directly connected by adopting a high heat conduction material, a heat conduction path is shortened, and the number of components, the size and the weight are reduced on the premise that the heat dissipation efficiency is ensured. Disclosure of utility model In order to solve the problems that the existing mining machine circuit board is poor in heat dissipation effect and large in size and affects installation, the mining machine heat conduction and dissipation integrated circuit board is provided. The technical scheme is that the integrated circuit board comprises a heat conducting plate, wherein heat radiating blocks which are uniformly distributed are fixedly connected to the lower end of the heat conducting plate, a first high-heat-conductivity insulating layer is fixedly connected to the upper end of the heat conducting plate, a first circuit copper foil and a second circuit copper foil are fixedly connected to the upper end of the first high-heat-conductivity insulating layer, the first circuit copper foil and the second circuit copper foil are all U-shaped blocks, a second high-heat-conductivity insulating layer is fixedly connected to the inner wall of the first circuit copper foil, a third high-heat-conductivity insulating layer is fixedly connected to the inner wall of the second circuit copper foil, a solder paste layer is fixedly connected to the upper end of the second circuit copper foil, a chip body is fixedly connected to the upper end of the solder paste layer, the opening directions of the first circuit copper foil and the second circuit copper foil are opposite, gaps are reserved at one ends, close to each other, and the lengths of the gaps are more than three millimeters. Preferably, one side of the heat conducting plate is provided with uniformly distributed first heat dissipation grooves in a penetrating mode, the upper end of the heat conducting plate is provided with uniformly distributed third heat dissipation grooves in a penetrating mode, and the lower end of the third heat dissipation grooves are communicated with the inner portion of the first heat dissipation grooves. Preferably, the third heat dissipation groove is T-shaped, and the heat conduction plate is made of a heat conduction material. Preferably, one side of the heat conducting plate is provided with second heat dissipation grooves in a penetrating mode, the second heat dissipation grooves are rectangular groove bodies, and the second heat dissipation grooves are communicated with the first heat dissipation grooves. Preferably, the top surface and the bottom surface of the inner wall of the second heat dissipation groove are provided with cylindrical grooves, and the inner wall of each cylindrical groove is fixedly connected with a heat conduction column. Preferably, the two sides of the heat conducting column are flush with the two sides of the heat conducting plate, and the two sides of the heat radiating block are flush with the two sides of the heat conducting plate. Preferably, the upper end of the first circuit copper foil is flush with the upper end surface of the second circuit copper foil, and the thicknesses of the first circuit copper foil and the second circuit copper foil are equal. The utility model has the beneficial effects that: 1. The aluminum substrate and the heat conduct