Search

CN-224218569-U - Mounting device

CN224218569UCN 224218569 UCN224218569 UCN 224218569UCN-224218569-U

Abstract

The utility model discloses a mounting device which is arranged on a substrate of a circuit board and is used for mounting a heating film. The mounting device comprises a connecting structure and a mounting structure, wherein the connecting structure is mounted on the substrate, an extension line of the axis of a through hole of the connecting structure penetrates through the surface of the substrate, and the end face of the through hole is arranged at intervals with the surface of the substrate. The part of mounting structure sets up in the through-hole, along the axial of through-hole, and mounting structure is close to the one end installation heating film of base plate, and it is used for facing to or deviate from the face removal of base plate. By adopting the mounting device provided by the utility model, the moving distance of the heating film towards the substrate can be adjusted by the mounting structure according to different thicknesses of the heating film, so that the universality of the mounting device is improved. When the heating film is abutted with the plate surface of the substrate, the part, deviating from the substrate, of the mounting structure is abutted with the end surface, deviating from the substrate, of the through hole, so that the mounting structure is limited to move towards the substrate continuously, and the risk of damage to the heating film caused by the mounting device is reduced.

Inventors

  • SU YAN
  • CHEN YONGHAO
  • WANG QIANKUN
  • LIU YANG

Assignees

  • 浙江大华技术股份有限公司

Dates

Publication Date
20260508
Application Date
20250414

Claims (11)

  1. 1. The utility model provides a mounting device, sets up in the face of the base plate of circuit board, and is used for installing the heating film, the component of circuit board install in the base plate deviates from the face of one side of mounting device, and with the heating film sets up relatively, its characterized in that, mounting device includes, connection structure and mounting structure, connection structure be used for install in the base plate, wherein: The connecting structure comprises a through hole, wherein an extension line of the axis of the through hole is used for penetrating through the board surface of the substrate, and the end surface of the through hole is arranged at intervals with the board surface of the substrate; The part of the mounting structure is arranged in the through hole, and one end, close to the substrate, of the mounting structure is used for mounting the heating film along the axial direction of the through hole; the mounting structure is used for moving towards or away from the plate surface of the substrate along the axial direction of the through hole; When the heating film is abutted with the plate surface of the substrate, the part of the mounting structure, which is away from the substrate, is abutted with the end surface of the through hole, which is away from one side of the substrate.
  2. 2. The mounting device of claim 1, wherein the mounting structure is threadably coupled to an inner wall of the through hole.
  3. 3. The mounting device according to claim 2, wherein the mounting structure comprises a first body and a limiting portion, the first body is arranged in the through hole, the limiting portion is arranged on the first body, and a part of the limiting portion extends out of the first body along the radial direction of the first body; when the heating film is abutted with the plate surface of the substrate, the part of the limiting part extending out of the first body is used for being abutted with the end surface of one side, away from the substrate, of the through hole.
  4. 4. A mounting device according to claim 3, wherein one end of the stopper portion is fixed to an end surface of the first body facing away from the base plate in an axial direction of the through hole.
  5. 5. A mounting arrangement according to claim 3, wherein the limit stop is a resilient cantilever.
  6. 6. The mounting device of claim 5, wherein the connection structure further comprises a groove, and a notch of the groove is positioned on an end face of the through hole on one side away from the substrate; when the heating film is abutted with the surface of the substrate, the free end of the elastic cantilever is embedded into the groove and is abutted with the bottom of the groove.
  7. 7. The mounting device according to claim 6, wherein the connecting structure is provided with a plurality of the grooves distributed along the circumferential direction of the through hole.
  8. 8. The mounting device of any one of claims 1-7, wherein the connection structure further comprises a connection portion and a mounting portion, the through hole being provided in the connection portion; the mounting part is used for being mounted on the substrate, and the connecting part is used for being clamped with the mounting part.
  9. 9. The mounting device according to claim 8, wherein the connecting structure includes two mounting portions spaced apart in a radial direction of the through hole, the through hole being located between the two mounting portions; The connecting part comprises a second body, a bending structure and an elastic arm, wherein the through hole is formed in the second body, and the distance between the two mounting parts is larger than the distance between the bending structure and the elastic arm along the radial direction of the through hole; The fixed end of the bending structure is arranged on the second body, and the open end of the bending structure is inserted into one mounting part; The fixed end of the elastic arm is arranged on the second body, and the free end of the elastic arm is clamped with the other mounting part.
  10. 10. The mounting device according to claim 9, wherein the mounting portion is spaced apart from the board surface of the board in the axial direction of the through hole, and the free ends of the elastic arms and the open ends of the bending structure are in one-to-one correspondence with gaps between the mounting portion and the board surface of the board.
  11. 11. The mounting device according to claim 8, wherein the connecting structure includes two mounting portions spaced apart in a radial direction of the through hole, the through hole being located between the two mounting portions; the connecting part comprises a second body and two elastic arms, wherein the through holes are formed in the second body, one ends of the elastic arms are arranged on the second body, and the free ends of the two elastic arms are in one-to-one corresponding clamping connection with the two mounting parts.

Description

Mounting device Technical Field The utility model relates to the technical field of electronic equipment, in particular to a mounting device. Background With the development of economy, the application range of electronic devices is also becoming wider and wider. However, the starting temperature of the internal components of the electronic device is generally above-10 ℃, and when the environmental temperature of the electronic device is lower than-20 ℃, the electronic device is difficult to realize normal starting, so that a heating film (electrothermal film) is required to be arranged on the internal components of the electronic device for realizing normal starting of the electronic device. Currently, most of the mounting members for mounting the heating film are dedicated members, which lack a certain versatility, and the dimensional accuracy of the dedicated members needs to be strictly controlled for reducing the risk of damage to the heating film. Therefore, how to improve the versatility of the heating film mounting member and reduce the risk of damage to the heating film by the mounting member has become a problem to be solved by those skilled in the art. Disclosure of utility model The utility model provides a mounting device, which can improve the universality of the heating film mounting device and reduce the risk of damaging the heating film by the mounting device. The utility model provides a mounting device which is arranged on the surface of a substrate of a circuit board and is used for mounting a heating film, and elements of the circuit board are arranged on the surface of one side of the substrate, which is away from the mounting device, and are opposite to the heating film. The mounting device comprises a connecting structure and a mounting structure, wherein the connecting structure is used for being mounted on the substrate, the connecting structure comprises a through hole, an extension line of the axis of the through hole is used for penetrating through the surface of the substrate, and the end face of the through hole is arranged at intervals with the surface of the substrate. The part of the mounting structure is arranged in the through hole, and one end, close to the substrate, of the mounting structure is used for mounting the heating film along the axial direction of the through hole. Along the axial direction of the through hole, the mounting structure is used for moving towards or away from the plate surface of the substrate. When the heating film is abutted with the plate surface of the substrate, the part of the mounting structure, which is deviated from the substrate, is abutted with the end surface of the through hole, which is deviated from one side of the substrate. By adopting the mounting device provided by the utility model, the moving distance of the heating film towards the substrate can be adjusted by the mounting structure according to different thicknesses of the heating film, so that the universality of the mounting device is improved. And when the face butt of heating film and base plate, through the terminal surface butt of the part that deviates from the base plate with mounting structure and the one side of deviating from the base plate of through-hole to be used for restricting mounting structure and continue to remove towards the base plate, it is favorable to reducing the risk that mounting device caused the damage to the heating film. In one possible implementation of the utility model, the mounting structure is screwed with the inner wall of the through hole. This can simplify the structure of the mounting device while achieving movement of the mounting structure relative to the through-hole. In one possible implementation of the present utility model, the mounting structure includes a first body and a limiting portion, where the first body is disposed in the through hole. The limiting part is arranged on the first body, and along the radial direction of the first body, part of the limiting part extends out of the first body. When the heating film is abutted with the plate surface of the substrate, the part of the limiting part extending out of the first body is used for being abutted with the end surface of one side, away from the substrate, of the through hole. This can simplify the mounting structure while satisfying the need to restrict the mounting structure from continuing to move toward the substrate. In one possible implementation manner of the present utility model, along the axial direction of the through hole, one end of the limiting portion is fixed to an end surface of the first body facing away from the substrate. So as to simplify the installation structure while meeting the functional requirement of the limiting part. In one possible implementation of the present utility model, the limiting portion is an elastic cantilever. In the process of moving the mounting structure, the free end of the elastic cantilever is lifted up, so that the f