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CN-224218571-U - Flexible circuit board and intelligent terminal equipment

CN224218571UCN 224218571 UCN224218571 UCN 224218571UCN-224218571-U

Abstract

The utility model discloses a flexible circuit board and intelligent terminal equipment, wherein the flexible circuit board comprises a base layer and a protective layer, the base layer comprises a first metal layer, a first silica gel layer and a second metal layer which are sequentially overlapped, and the protective layer at least comprises a second silica gel layer. The flexible circuit board belongs to an all-silica-gel flexible circuit board, has lower dielectric constant, can have higher signal transmission rate in a high-frequency circuit when applied to terminal equipment, is applicable to various extreme environments, has higher reliability, has thinner overall thickness compared with the conventional flexible circuit board, accords with miniaturization, light weight and integration trend of flexible electronic technology, and has better application prospect.

Inventors

  • Chen Shangfan
  • XU CAIXIA
  • LI PEISHAN
  • CHEN CHUNYUAN

Assignees

  • 深圳市摩码克来沃化学科技有限公司

Dates

Publication Date
20260508
Application Date
20250422

Claims (10)

  1. 1. A flexible circuit board, the flexible circuit board comprising: A base layer comprising a first metal layer, a first silica gel layer and a second metal layer which are sequentially laminated, and The protective layer is arranged on two sides of the base layer, the protective layer is attached to the first metal layer and the second metal layer, and the protective layer at least comprises a second silica gel layer.
  2. 2. The flexible circuit board of claim 1 wherein, The first silica gel layer bonds the first metal layer and the second metal layer; And/or the second silica gel layer is attached to the first metal layer and the second metal layer and covers the circuit patterns of the first metal layer and the second metal layer.
  3. 3. The flexible circuit board of claim 1 wherein, The thickness of the first silica gel layer is 10-100 mu m.
  4. 4. The flexible circuit board of claim 1 wherein, The first metal layer and the second metal layer are both metal foils; And/or the thickness of the first metal layer is 1-100 μm; And/or the thickness of the second metal layer is 1-100 μm.
  5. 5. The flexible circuit board of claim 1 wherein the second silicone layer comprises a silicone film having a thickness of 1 μm to 50 μm.
  6. 6. The flexible circuit board of claim 5 wherein the second silicone layer further comprises at least one plastic liner, the plastic liner and the silicone film being laminated; wherein the silica gel film is attached to the first metal layer and the second metal layer, the plastic lining is attached to the silica gel film and is arranged back to the base layer; The plastic liner comprises a plastic film; the thickness of the plastic lining is 1-450 mu m.
  7. 7. The flexible circuit board of claim 1 wherein the protective layer further comprises a cover layer attached to the second silicone layer and disposed opposite the base layer.
  8. 8. The flexible circuit board of claim 7 wherein the cover layer comprises any one of polyimide film, polyamide film, polyethylene film, polypropylene film, polyetheretherketone film, polyphenylene sulfide film, polyethylene terephthalate film, polycarbonate film, polyethylene naphthalate film, polytetrafluoroethylene film.
  9. 9. The flexible circuit board of claim 8 wherein the cover layer has a thickness of 2 μm to 75 μm.
  10. 10. An intelligent terminal device, characterized in that it employs the flexible circuit board according to any one of claims 1 to 9.

Description

Flexible circuit board and intelligent terminal equipment Technical Field The utility model relates to the technical field of flexible circuit boards, in particular to a flexible circuit board and intelligent terminal equipment. Background Along with the scale development of portable intelligent terminal products such as mobile phones, intelligent watches, bracelets and the like, new energy automobiles and AI equipment, the application of flexible circuit boards presents a continuous trend of growing, and meanwhile, the flexible circuit boards also tend to be miniaturized, light-weighted, integrated and flexible, and meanwhile, in order to improve the communication efficiency, the manufactured flexible circuit boards are required to have smaller volume and lower transmission loss. Disclosure of utility model The utility model mainly aims to design the flexible circuit board with smaller thickness, better reliability and lower cost. The utility model provides a flexible circuit board which comprises a base layer and protective layers, wherein the base layer comprises a first metal layer, a first silica gel layer and a second metal layer which are sequentially stacked, the protective layers are arranged on two sides of the base layer, the protective layers are attached to the first metal layer and the second metal layer, and the protective layers at least comprise the second silica gel layer. In one embodiment, the first silica gel layer bonds the first metal layer and the second metal layer, and the first metal layer, the second metal layer, and the first silica gel layer are directly compounded without using an adhesive. In an embodiment, the second silica gel layer is attached to the first metal layer and the second metal layer, and covers the circuit patterns of the first metal layer and the second metal layer. In one embodiment, the thickness of the first silica gel layer is 10 μm to 100 μm. In one embodiment, the first metal layer and the second metal layer are both metal foils. In one embodiment, the thickness of the first metal layer is 1 μm to 100 μm. In one embodiment, the thickness of the second metal layer is 1 μm to 100 μm. In one embodiment, the second silica gel layer includes a silica gel film, and the thickness of the silica gel film is 1 μm to 50 μm. In an embodiment, the second silica gel layer further comprises a plastic lining, the plastic lining and the silica gel film are stacked, the silica gel film is attached to the first metal layer and the second metal layer, the plastic lining is attached to the silica gel film and is arranged opposite to the base layer, the plastic lining comprises a plastic film, and the thickness of the plastic lining is 1-450 μm. In an embodiment, the protective layer further includes a cover layer attached to the second silica gel layer and disposed opposite to the base layer. In one embodiment, the cover layer includes any one of polyimide film, polyamide film, polyethylene film, polypropylene film, polyetheretherketone film, polyphenylene sulfide film, polyethylene terephthalate film, polycarbonate film, polyethylene naphthalate film, polytetrafluoroethylene film. In one embodiment, the thickness of the cover layer is 2 μm to 75 μm. The invention further provides intelligent terminal equipment, and the flexible circuit board is applied to the intelligent terminal equipment. The flexible circuit board with the novel structure is designed, the flexible copper-clad plate is used as a base layer, and the surface of the flexible copper-clad plate is covered with a protective layer, wherein a silica gel layer is arranged between the metal layers and the protective layer, so that the flexible circuit board is an all-silica gel type flexible circuit board, has lower dielectric constant and can have higher signal transmission rate in a high-frequency circuit, and the all-silica gel type flexible circuit board can be suitable for various extreme environments in the processing and application processes of the flexible circuit board and has higher reliability because silica gel is more stable and durable than other polymers commonly used in the flexible circuit board. Drawings In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art. Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the utility model; description of the drawings: 1. The substrate, 11, the first silica gel layer, 12, the first metal layer, 13, the second metal layer, 2, the protective layer, 21, the second silica gel