CN-224218574-U - Small-spacing lamp bead circuit board

Abstract

The utility model discloses a small-spacing lamp bead circuit board, which comprises a multilayer circuit board formed by laminating a single core board or a plurality of core boards with inner layer circuits, a through hole penetrating through the multilayer circuit board, a first copper plating layer deposited on the wall of the through hole, hole plugging resin filled in the through hole, a copper plating layer deposited on the surface of the hole plugging resin, and a second copper plating layer deposited on the surface of an outer copper foil of the multilayer circuit board through a full-board electroplating process, wherein the hole plugging resin is flush with the surface of the outer copper foil of the multilayer circuit board, the outer copper foil of the multilayer circuit board is combined with the second copper plating layer to form a surface copper layer of the circuit board, and an outer layer circuit is designed on the surface copper layer. The small-spacing lamp bead circuit board provided by the utility model has the advantages of low manufacturing cost, high yield and the like.

Inventors

• LU ZHONGYANG
• SHI XIAOFENG
• ZHAO HU
• ZHOU HONGGEN

Assignees

• 江西旭昇电子股份有限公司

Dates

Publication Date

20260508

Application Date

20250513

Claims (6)

1. 1. The utility model provides a small-pitch lamp pearl circuit board which characterized in that, includes by single or the lamination of the core that many have accomplished inlayer circuit preparation forms multilayer circuit board, runs through multilayer circuit board's through-hole, deposit in the first copper plating layer of through-hole pore wall, fill in the hole resin of through-hole, deposit in the copper layer of hole resin surface, deposit the second copper plating layer that forms at multilayer circuit board's outer copper foil surface through full board electroplating process, hole resin flushes with multilayer circuit board's outer copper foil surface, multilayer circuit board's outer copper foil combines with the second copper plating layer and forms the face copper layer of circuit board, the design has outer circuit on the face copper layer.
2. 2. The small-pitch bead circuit board according to claim 1, wherein the aperture of the through hole is 0.2-0.3mm.
3. 3. The small-pitch bead circuit board according to claim 2, wherein the thickness of the first copper plating layer on the wall of the through hole is more than or equal to 18um.
4. 4. The small-pitch bead circuit board according to claim 1, wherein the thickness of the copper layer is 0.3-0.5um.
5. 5. The small-pitch bead circuit board according to claim 1 or 4, wherein the thickness of copper on the hole plugging resin is more than or equal to 12um.
6. 6. The small pitch bead circuit board of claim 1, wherein the bead PAD pitch of the circuit board is P1.0 or P1.25.

Description

Small-spacing lamp bead circuit board Technical Field The utility model relates to the technical field of circuit boards, in particular to a small-space lamp bead circuit board. Background The traditional manufacturing process of the small-spacing LED lamp panel adopts an HDI process, and the process flow comprises the steps of pressing, browning, laser blind holes, glue (or plasma) removal, copper deposition, hole filling electroplating and outer layer circuit. The blind hole alignment precision requirement is extremely high (P1.25 space needs hole position error <10 um), and laser drilling is easy to cause bad blind hole type, blind hole filling efficiency is difficult to control due to blind hole electroplating control and parameters, and blind hole angle copper breaking, cold joint and other quality problems are caused by easy poor hole filling electroplating and sinking (generally <5 um), so that the product yield is affected. In addition, the plating solution special for blind holes has the defects of high cost, complex production process and the like because the traditional HDI process needs to be pressed and drilled for multiple times (such as 2 times of pressing and 3 times of laser process are needed for one 6-layer plate). In view of the above, the present utility model is directed to providing a low-cost and high-yield circuit board with small-pitch lamp beads. Disclosure of utility model The utility model aims to provide a small-spacing lamp bead circuit board which has the advantages of low manufacturing cost, high yield and the like. The technical scheme of the utility model is as follows: the utility model provides a small-pitch lamp pearl circuit board, includes by single or many core pressfitting that accomplish the inlayer circuit preparation forms the multilayer circuit board, runs through the through-hole of multilayer circuit board, deposit in the first copper plating layer of through-hole pore wall, fill in the hole resin that fills in the through-hole, deposit in the copper layer of the superficial copper layer of formation of hole resin, deposit the second copper plating layer that forms at the outer copper foil surface of multilayer circuit board through full board electroplating process, hole resin flushes with the outer copper foil surface of multilayer circuit board, the outer copper foil of multilayer circuit board combines with the second copper plating layer and forms the face copper layer of circuit board, the design has outer circuit on the face copper layer. Further, the aperture of the through hole is 0.2-0.3mm. Further, the thickness of the first copper plating layer on the wall of the through hole is more than or equal to 18um. Further, the thickness of the copper melting layer is 0.3-0.5um. Further, the thickness of copper on the hole plugging resin is more than or equal to 12um. Further, the pitch of the circuit board lamp beads PAD is P1.0 or P1.25. Compared with the prior art, the small-spacing lamp bead circuit board provided by the utility model has the beneficial effects that: 1. The small-spacing lamp bead circuit board provided by the utility model has the advantages that the inner circuit board is communicated by adopting the through holes, the PAD and hole alignment precision can be improved to be within 20um, because the vacuum resin hole filling is adopted, the resin hole filling void ratio is less than 0.1%, the blind hole void ratio is generally more than 0.5% and is concave due to electroplating hole filling liquid medicine and parameter control in the traditional blind hole filling process, after the through holes are filled with the through holes, the hole filling resin is enabled to be flush with the copper surface of the laminated multilayer circuit board by the ceramic grinding plate, the hole filling efficiency can reach more than 98%, the degree of the concave is generally less than 2um after the circuit board is baked, and the virtual welding risk of the circuit board when components are welded can be reduced. Therefore, the small-spacing lamp bead circuit board provided by the utility model can obviously improve the PAD and hole alignment precision and the PAD surface evenness, and reduce the quality problems of poor downstream welding and the like. 2. The small-spacing lamp bead circuit board provided by the utility model adopts the through holes to communicate the inner circuit board, so that compared with the prior art, the laser blind hole drilling process is omitted, the equipment cost is reduced, and meanwhile, compared with blind hole electroplating in the prior art, through hole electroplating can save the cost of liquid medicine. 3. The small-spacing lamp bead circuit board provided by the utility model can meet the requirement of on-alignment degree through testing the offset of the lamp bead PAD and the hole site to be less than 5um, the adhesive force of the copper layer on the surface of the resin hole plugging area is more than or