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CN-224218582-U - Circuit board stacking structure and camera

CN224218582UCN 224218582 UCN224218582 UCN 224218582UCN-224218582-U

Abstract

The disclosure relates to the technical field of camera shooting, in particular to a circuit board stacking structure and a camera. The circuit board stacking structure comprises a main board, an imaging chip board and a connecting assembly, wherein the connecting assembly comprises a flexible circuit board, a first board-to-board connector and a second board-to-board connector, the flexible circuit board is connected with the main board through the first board-to-board connector, and the flexible circuit board is connected with the imaging chip board through the second board-to-board connector. The circuit board stacking structure can reduce the size of the circuit board stacking structure, and further reduce the size of a camera with the circuit board stacking structure.

Inventors

  • CAO WEI
  • PEI HONGAN
  • ZHANG JIAN
  • WANG LIANGSHI

Assignees

  • 北京小米移动软件有限公司
  • 上海创米数联智能科技发展股份有限公司

Dates

Publication Date
20260508
Application Date
20250530

Claims (11)

  1. 1. A circuit board stack (20), comprising: A main board (1); An imaging chip board (2); The connecting assembly (3), the connecting assembly (3) comprises a flexible circuit board (31), a first board-to-board connector (32) and a second board-to-board connector (33), the flexible circuit board (31) is connected with the main board (1) through the first board-to-board connector (32), and the flexible circuit board (31) is connected with the imaging chip board (2) through the second board-to-board connector (33).
  2. 2. The circuit board stack structure (20) according to claim 1, wherein the circuit board stack structure (20) further comprises a WIFI board (4), the WIFI board (4) being electrically connected with the motherboard (1).
  3. 3. The circuit board stack structure (20) according to claim 2, wherein the circuit board stack structure (20) further comprises a third board-to-board connector (5), and wherein the WIFI board (4) is connected to the motherboard (1) through the third board-to-board connector (5).
  4. 4. A circuit board stack structure (20) according to claim 3, wherein the imaging chip board (2) is vertically arranged on one side of the main board (1) along a first direction, the WIFI board (4) is vertically arranged on one side of the main board (1) along a second direction and adjacent to the imaging chip board (2), the third board-to-board connector (5) is a rectangular board-to-board connector, and the first direction and the second direction are substantially orthogonal to each other and to a thickness direction of the main board (1).
  5. 5. The circuit board stack structure (20) of claim 2, wherein the circuit board stack structure (20) further comprises a heat dissipating component (6), the heat dissipating component (6) being provided on at least one of the motherboard (1) and the WIFI board (4).
  6. 6. The circuit board stack structure (20) according to claim 5, wherein the circuit board stack structure (20) further comprises a memory card (7), the flexible circuit board (31) is connected to one main board (1) face in the thickness direction of the main board (1), and the memory card (7) is substantially parallel to the main board (1) and located on a side facing away from the one main board (1) face in the thickness direction of the main board (1).
  7. 7. The circuit board stack structure (20) according to claim 6, wherein the circuit board stack structure (20) further comprises a fourth board-to-board connector (8), the memory card (7) being connected with the motherboard (1) by the fourth board-to-board connector (8).
  8. 8. The circuit board stack structure (20) of claim 5, wherein the heat dissipating assembly (6) comprises a thermally conductive silicone (61), a shielding case (62), and a heat sink (63), the heat sink (63) being adhered to an outside of the shielding case (62), the shielding case (62) being placed over the at least one to press the thermally conductive silicone (61) against the at least one.
  9. 9. The circuit board stack structure (20) of claim 8, wherein the heat dissipating assembly (6) further comprises a heat conducting member (64), the heat conducting member (64) being provided on a side of the heat dissipating fin (63) away from the shield case (62) and in contact with the heat dissipating fin (63).
  10. 10. Camera, characterized in that it comprises a circuit board stack (20) according to any one of claims 1-9.
  11. 11. The camera according to claim 10, characterized in that the camera comprises a metal housing (10), the circuit board stack (20) being provided within the metal housing (10), the circuit board stack (20) being in thermally conductive connection with the metal housing (10).

Description

Circuit board stacking structure and camera Technical Field The disclosure relates to the technical field of camera shooting, in particular to a circuit board stacking structure and a camera. Background With the increasing number of indoor cameras, there is an increasing demand for miniaturization of the size of the cameras. In the related art, the camera comprises a base and a ball head, wherein circuit boards are distributed in the base and the ball head, and the circuit boards in the ball head are connected with the circuit boards in the base through wire harnesses, so that the size of the camera is large, and the miniaturization requirement of the camera cannot be met. Disclosure of utility model The present disclosure aims to solve, at least to some extent, one of the technical problems in the related art. For this reason, the embodiments of the present disclosure propose a circuit board stack structure that can be reduced in size, and thus a camera having the circuit board stack structure. The embodiment of the disclosure also provides a camera. The circuit board stacking structure comprises a main board, an imaging chip board and a connecting assembly, wherein the connecting assembly comprises a flexible circuit board, a first board-to-board connector and a second board-to-board connector, the flexible circuit board is connected with the main board through the first board-to-board connector, and the flexible circuit board is connected with the imaging chip board through the second board-to-board connector. According to the circuit board stacking structure, the main board is connected with the flexible circuit board through the first board-to-board connector, the imaging chip board is connected with the flexible circuit board through the second board-to-board connector, that is, the connection between the main board and the imaging chip board is realized through the first board-to-board connector, the second board-to-board connector and the flexible circuit board, compared with the mode of adopting wire harness connection between the main board and the imaging chip board, the wire harness routing space is saved, the size of the circuit board stacking structure is further reduced, and the size of a camera with the circuit board stacking structure is further reduced. In some embodiments, the circuit board stack structure further comprises a WIFI board electrically connected to the motherboard. In some embodiments, the circuit board stack structure further includes a third board-to-board connector through which the WIFI board and the motherboard are connected. In some embodiments, the imaging chip board is disposed vertically on one side of the motherboard along a first direction, the WIFI board is disposed vertically on one side of the motherboard along a second direction and adjacent to the imaging chip board, the third board-to-board connector is a right angle board-to-board connector, and the first direction and the second direction are substantially orthogonal to each other and to a thickness direction of the motherboard. In some embodiments, the circuit board stack structure further includes a heat dissipation assembly disposed on at least one of the motherboard and the WIFI board. In some embodiments, the circuit board stack structure further includes a storage card, the flexible circuit board is connected to one main board surface in a thickness direction of the main board, and the storage card is substantially parallel to the main board and located on a side facing away from the one main board surface in the thickness direction of the main board. In some embodiments, the circuit board stack structure further includes a fourth board-to-board connector through which the memory card is connected to the motherboard. In some embodiments, the heat dissipation assembly comprises a thermally conductive silicone, a shield, and a heat sink attached to an exterior of the shield, the shield being disposed over the at least one to press the thermally conductive silicone against the at least one. In some embodiments, the heat dissipating assembly further comprises a heat conducting member disposed on a side of the heat sink remote from the shield and in contact with the heat sink. The camera of the embodiment of the disclosure includes the circuit board stacking structure described in the above embodiment. The camera of the embodiment of the disclosure further reduces the size of the camera and improves the performance of the camera due to the circuit board stacking structure of the embodiment. In some embodiments, the camera includes a metal housing, the circuit board stack is disposed within the metal housing, and the circuit board stack is thermally conductively coupled to the metal housing. Drawings Fig. 1 is a schematic diagram of a circuit board stack structure of an embodiment of the present disclosure. Fig. 2 is a schematic diagram of a connection assembly of an embodiment of the present disclosure. F