CN-224218610-U - Multilayer circuit board lamination prepositioning and laminating integrated equipment
Abstract
The integrated equipment comprises a processing table, a mounting frame, a feeding assembly, a discharging assembly, a bearing assembly, a detecting assembly and a pressing assembly, wherein the mounting frame is erected on the processing table, the feeding assembly and the discharging assembly are both arranged on the processing table and the mounting frame, the bearing assembly is arranged on the processing table and is positioned on one side of the feeding assembly and one side of the discharging assembly, the detecting assembly and the pressing assembly are both arranged on the mounting frame and are positioned above the bearing assembly, and the bearing assembly comprises a bearing frame, a plurality of laminated prepositioning jigs and a driving motor. The multi-station bearing assembly capable of flexibly rotating is designed, so that lamination pre-positioning and lamination processing can be rapidly and reliably carried out synchronously in the lamination processing process of the multi-layer circuit board, the processing efficiency can be greatly improved, the problem of deviation among circuit board layers in the transfer process can be effectively solved, and the multi-station bearing assembly is high in practicability and has a relatively strong popularization significance.
Inventors
- YE YINGFENG
- OUYANG HUIMIAN
- KUANG CHENGLONG
- REN DANDAN
- SUN JIE
Assignees
- 江西红板科技股份有限公司
Dates
- Publication Date
- 20260508
- Application Date
- 20250521
Claims (8)
- 1. The multilayer circuit board lamination pre-positioning and laminating integrated device is characterized by comprising a processing table, a mounting frame, a feeding assembly, a discharging assembly, a bearing assembly, a detecting assembly and a laminating assembly, wherein the mounting frame is erected on the processing table, the feeding assembly and the discharging assembly are both arranged on the processing table and the mounting frame, the bearing assembly is arranged on the processing table and is positioned on one side of the feeding assembly and one side of the discharging assembly, the detecting assembly and the laminating assembly are both arranged on the mounting frame and are positioned above the bearing assembly, the bearing assembly comprises a bearing frame, a plurality of lamination pre-positioning jigs and a driving motor, the bearing frame is in a cross-shaped design, the bearing frame is connected with the upper end of the processing table in a movable mode in a shaft mode, the outer side ends of the bearing frame correspond to the positions of the feeding assembly, the discharging assembly, the detecting assembly and the laminating assembly respectively, the outer side ends of the bearing assembly are also provided with mounting grooves, the lamination pre-positioning jigs are respectively arranged in the mounting grooves, and the driving motor is arranged in the processing table and is in power connection with the bearing frame.
- 2. The integrated equipment for pre-positioning and laminating the multi-layer circuit board according to claim 1, wherein the pre-positioning jig comprises a bearing plate and a plurality of positioning rods, a plurality of mounting screw holes are further formed in a mounting groove of the bearing frame, the bearing plate is clamped and mounted in the mounting groove, the positioning rods are all arranged on the bearing plate in a penetrating manner and can rotate movably, and the lower ends of the positioning rods are further in threaded connection with the mounting screw holes in the mounting groove.
- 3. The apparatus of claim 2, wherein the positioning rod is further provided with a heating structure.
- 4. The integrated equipment for pre-positioning and laminating a multi-layer circuit board according to claim 1, wherein the bearing assembly further comprises a cover pressing plate, a placing groove is formed in the processing table, the placing groove is formed in one side of the feeding assembly, the cover pressing plate is placed in the placing groove, and the cover pressing plate can be further covered on the pre-positioning jig of the multi-layer circuit board.
- 5. The integrated equipment for pre-positioning and laminating the multi-layer circuit board is characterized in that the feeding assembly comprises a first grabbing mechanical arm and a first conveying belt, the discharging assembly comprises a second grabbing mechanical arm and a second conveying belt, the mounting frame is further provided with a feeding sliding rail and a discharging sliding rail respectively, the feeding sliding rail and the discharging sliding rail are arranged in a crisscross mode and are respectively located above two adjacent outer side ends of the bearing frame, the first grabbing mechanical arm and the second grabbing mechanical arm are respectively arranged on the feeding sliding rail and the discharging sliding rail and can slide and stretch up and down, and the first conveying belt and the second conveying belt are respectively arranged on the processing table and are respectively located below the first grabbing mechanical arm and the second grabbing mechanical arm.
- 6. The integrated equipment for pre-positioning and laminating the multi-layer circuit board according to claim 1, wherein the detection assembly comprises a detection lifting rod, a detection seat, a detection plate and a plurality of elastic detection sensors, the detection lifting rod is arranged on the installation frame and can be lifted up and down movably, the detection seat is arranged at the lower end of the detection lifting rod, a ball shaft sleeve is further arranged at the center of the bottom of the detection seat, a ball shaft rod is correspondingly arranged at the center of the top of the detection plate, the detection plate is arranged below the detection seat at intervals and is clamped in the ball shaft sleeve, the elastic detection sensors are arranged between the detection seat and the detection plate, and two ends of the elastic detection sensors are respectively in propping connection with the bottom of the detection seat and the top of the detection plate.
- 7. The device for integrating pre-positioning and laminating of a multi-layer circuit board according to claim 1, wherein the lamination assembly comprises a lamination mechanical arm and a lamination plate, the lamination mechanical arm is arranged on the mounting frame and can be lifted up and down movably, a sliding mounting block is further arranged at the lower end of the lamination mechanical arm, a sliding mounting groove is correspondingly arranged at the top of the lamination plate, and the lamination plate is arranged at the lower end of the lamination mechanical arm and is clamped with the sliding mounting block.
- 8. The integrated equipment for pre-positioning and laminating a multi-layer circuit board according to claim 1, further comprising a jacking assembly, wherein the jacking assembly is arranged on the processing table and comprises a jacking mechanical arm and a jacking plate, the jacking mechanical arm is arranged in the processing table and can be lifted up and down movably, and the jacking plate is arranged at the upper end of the jacking mechanical arm and is positioned below the lamination assembly and the bearing frame.
Description
Multilayer circuit board lamination prepositioning and laminating integrated equipment Technical Field The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board lamination pre-positioning and laminating integrated device. Background The circuit boards are classified into three major categories, namely single-sided boards, double-sided boards and multi-layer circuit boards, according to the number of layers. The multi-layer board is a printed board which is formed by laminating more than three conductive pattern layers and insulating materials between the conductive pattern layers at intervals, and the conductive patterns between the conductive pattern layers are interconnected according to requirements. Multilayer circuit boards are products of electronic information technology that are evolving into high-speed, multifunctional, large-capacity, small-volume, thin, lightweight applications. When the existing multilayer circuit board is subjected to lamination processing, a plurality of layers of boards are laminated and preset on a lamination jig in sequence by adopting manpower, and then the lamination jig and the plurality of layers of boards are combined to be transferred to lamination equipment for lamination processing. The processing mode is low in efficiency, and the problem of offset between the plate layers is easily caused in the transferring process, so that the pressing effect is finally affected. Disclosure of utility model Based on this, it is necessary to provide a multilayer circuit board lamination pre-positioning and lamination integrated device for overcoming the defects in the prior art. The utility model provides a multilayer circuit board lamination is fixed a position and pressfitting integration equipment in advance, its includes processing platform, mounting bracket, material loading subassembly, unloading subassembly, bears subassembly, detection component and pressfitting subassembly, the mounting bracket stands on the processing platform, material loading subassembly and unloading subassembly are all installed on processing platform and mounting bracket, bear the subassembly and install on processing platform and lie in one side of material loading subassembly and unloading subassembly, detection component and pressfitting subassembly are all installed on the mounting bracket and are located the top that bears the subassembly. The bearing assembly comprises a bearing frame, a plurality of laminated pre-positioning jigs and a driving motor. The bearing frame is in a cross-shaped design, the bearing frame is connected with the upper end of the processing table in a shaft mode and can rotate movably, the outer side end of the bearing frame corresponds to the positions of the feeding assembly, the discharging assembly, the detecting assembly and the pressing assembly respectively, mounting grooves are formed in the outer side end of the bearing frame, a plurality of laminated pre-positioning jigs are arranged in the mounting grooves respectively, and the driving motor is arranged in the processing table and is in power connection with the bearing frame. Further, the laminated pre-positioning jig comprises a bearing plate and a plurality of positioning rods, and a plurality of mounting screw holes are further formed in the mounting groove of the bearing frame. The bearing plate is clamped and arranged in the mounting groove, a plurality of positioning rods are arranged on the bearing plate in a penetrating mode and can rotate movably, and the lower ends of the positioning rods are further connected with the mounting screw holes in the mounting groove in a threaded mode. Further, a heating structure is further arranged inside the positioning rod. Further, the bearing assembly further comprises a cover pressing plate, and a placing groove is formed in the processing table. The holding groove is located one side of material loading subassembly, the lid clamp plate is arranged in the holding groove, and this lid clamp plate still can be covered on the stromatolite preset position tool. Further, the feeding assembly comprises a first grabbing mechanical arm and a first conveying belt, the discharging assembly comprises a second grabbing mechanical arm and a second conveying belt, and the mounting frame is further provided with a feeding sliding rail and a discharging sliding rail respectively. The feeding slide rail and the discharging slide rail are arranged in a crisscross manner and are respectively located above two adjacent outer side ends of the bearing frame, the first grabbing mechanical arm and the second grabbing mechanical arm are respectively arranged on the feeding slide rail and the discharging slide rail and can slide and stretch up and down, and the first conveying belt and the second conveying belt are respectively arranged on the processing table and are respectively located below the first grabbing mechanical arm and t