Search

CN-224218664-U - Interconnection structure between high-speed circuit boards

CN224218664UCN 224218664 UCN224218664 UCN 224218664UCN-224218664-U

Abstract

The utility model provides an interconnection structure between high-speed circuit board, includes main circuit board and FMC socket, FMC socket is installed to the upper end of main circuit board, FMC socket's upper end and FMC plug peg graft mutually, FMC connector is installed to the upper end of main circuit board, the inner wall in the main circuit board outside is connected with assembly devices. The lower ends of the rubber bumps are abutted against the surface of the main circuit board, four corners of the outer frame plate are inserted into clamping grooves of the rubber pieces, so that after the outer frame plate and the main circuit board are assembled, the auxiliary circuit board is vertically inserted into the outer frame plate, an interface at the end part of the outer frame plate is in electrical contact with a contact, a reserved opening can be formed between the outer frame plate and the auxiliary circuit board, working heat dissipation on the surface of the main circuit board can be achieved, circuit boards of different sizes are stacked and interconnected, and the phenomenon of slow heat circulation in working is reduced.

Inventors

  • YAO FENG
  • ZHOU BIN

Assignees

  • 桂林创研科技有限公司
  • 桂林光启光电子科技有限公司

Dates

Publication Date
20260508
Application Date
20250513

Claims (6)

  1. 1. The interconnection structure between high-speed circuit boards comprises a main circuit board (1) and an FMC socket (2), wherein the FMC socket (2) is arranged at the upper end of the main circuit board (1), and the interconnection structure is characterized in that the upper end of the FMC socket (2) is spliced with an FMC plug (3), an FMC connector (4) is arranged at the upper end of the main circuit board (1), and an assembly mechanism (5) is connected with the inner wall of the outer side of the main circuit board (1).
  2. 2. The interconnection structure between high-speed circuit boards according to claim 1, wherein the assembly mechanism (5) comprises a rubber ring (501) and a bump (504), the upper end of the rubber ring (501) is attached to the main circuit board (1), the outer wall of the bump (504) is abutted against the main circuit board (1), the upper end of the rubber ring (501) is fixedly connected with a rubber piece (502), a threaded hole (503) is formed in the inner wall of the rubber piece (502), and the outer wall of the rubber piece (502) is fixedly connected with the bump (504).
  3. 3. The interconnection structure between high-speed circuit boards according to claim 2, wherein a clamping groove (6) is formed in the middle of the rubber piece (502), and a splicing mechanism (7) is connected to the inner wall of the clamping groove (6).
  4. 4. The interconnect structure between high-speed circuit boards according to claim 3, wherein said splice mechanism (7) comprises an outer frame plate (701), an outer wall of said outer frame plate (701) is engaged with said engaging groove (6), a contact (702) is mounted on an inner wall of said outer frame plate (701), and an outer wall of said contact (702) is electrically connected to said sub-circuit board (703).
  5. 5. The interconnection structure between high-speed circuit boards according to claim 4, wherein the lower end of the outer frame plate (701) is mounted with an FMC plug (3).
  6. 6. The interconnection structure between high-speed circuit boards according to claim 5, wherein the output end of the FMC plug (3) is electrically connected to the contact (702), and the outer wall of the secondary circuit board (703) abuts against the outer frame plate (701).

Description

Interconnection structure between high-speed circuit boards Technical Field The utility model relates to the technical field of circuit boards, in particular to an interconnection structure between high-speed circuit boards. Background With the continuous development of high-performance embedded systems, the requirements of bandwidth, cost, flexibility and reliability of the interconnection between circuit boards are increasing. At present, common interconnection modes between high-speed circuit boards comprise PXI, CPCI, VPX and other standard back boards, and the interconnection modes between the high-speed circuit boards can meet most of design requirements. For example, although the interconnection structure between high-speed circuit boards with the publication number of CN207834615U solves the problems of complex design and long development period of the conventional interconnection structure between high-speed circuit boards, the signal processing boards, the FMC connectors, the signal generating boards and the system structure are arranged in the system structure, the FMC connectors are positioned between the signal processing boards and the signal generating boards, the FMC connectors are connected with the signal generating boards in a surface-to-bottom bonding manner, the plurality of signal processing boards are in the same size in consideration of the conventional interconnection structure between the high-speed circuit boards, the signal processing boards at the upper end are in stacked interconnection with each other, the whole area at the lower end can be shielded, and air circulation can only be carried out by gaps between the two signal processing boards, so that heat generated in the working of the signal processing boards can not be quickly circulated easily. Disclosure of Invention The utility model aims to solve the problems in the prior art and provides an interconnection structure between high-speed circuit boards, which adopts the same signal processing boards with different sizes to perform stacking interconnection, so that the phenomenon of slow heat circulation in the working process is reduced. The utility model solves the technical problems by adopting the technical scheme that: The utility model provides an interconnect structure between high-speed circuit board, includes main circuit board and FMC socket, FMC socket is installed to the upper end of main circuit board, FMC socket's upper end and FMC plug peg graft mutually, FMC connector is installed to the upper end of main circuit board, the inner wall in the main circuit board outside is connected with assembly devices. Further perfecting, the assembly mechanism comprises a rubber ring and a lug, the upper end of the rubber ring is attached to the main circuit board, the outer wall of the lug is abutted against the main circuit board, the upper end of the rubber ring is fixedly connected with a rubber piece, a threaded hole is formed in the inner wall of the rubber piece, and the outer wall of the rubber piece is fixedly connected with the lug. Further perfecting, the middle part of the rubber piece is provided with a clamping groove, and the inner wall of the clamping groove is connected with a splicing mechanism. Further perfecting, the splicing mechanism comprises an outer frame plate, the outer wall of the outer frame plate is clamped with the clamping groove, the inner wall of the outer frame plate is provided with a contact, and the outer wall of the contact is electrically connected with the auxiliary circuit board. Further perfecting, the lower end of the outer frame plate is provided with an FMC plug. Further perfecting, the output end of the FMC plug is electrically connected with the contact, and the outer wall of the secondary circuit board is abutted against the outer frame plate. The utility model has the beneficial effects that the lower ends of the rubber bumps are abutted against the surface of the main circuit board, the four corners of the outer frame plate are inserted into the clamping grooves of the rubber parts, so that after the outer frame plate and the main circuit board are assembled, the auxiliary circuit board is vertically inserted into the outer frame plate, the interfaces at the end parts of the outer frame plate are in electrical contact with the contacts, a reserved opening can be formed between the outer frame plate and the auxiliary circuit board, the working heat dissipation of the surface of the main circuit board can be realized, the circuit boards with different sizes are connected in a stacking manner, and the phenomenon of slow heat circulation in the working process is reduced. Drawings FIG. 1 is a schematic perspective view of the present utility model; FIG. 2 is a schematic elevational cross-sectional view of FIG. 1; FIG. 3 is a schematic top cross-sectional view of FIG. 2; fig. 4 is an enlarged cross-sectional view of the portion a in fig. 2: fig. 5 is an enlarged cross-sectiona