CN-224218681-U - T/R assembly liquid cooling device suitable for high heat flux and high overload environment, T/R assembly and radar

Abstract

The application discloses a T/R component liquid cooling device, a T/R component and a radar suitable for a high heat flux and high overload environment, which are arranged in a liquid cooling cavity of a mounting plate through the mounting plate, wherein the liquid cooling cavity is internally provided with a plurality of branches, a main liquid inlet path and a main loop which are mutually isolated, fins are fixedly arranged in the plurality of branches, the main liquid inlet path and the main loop, the branches are arranged in parallel and are not communicated with each other, the first ends of the branches are communicated with the main liquid inlet path, the second ends of the branches are communicated with the main loop, the heat dissipation area of the plurality of branches and the fins is increased, so that the heat dissipation capacity of the liquid cooling device is enhanced, the strength of the liquid cooling device is increased, the liquid cooling device is ensured to meet the requirement of high overload impact resistance, the branches are not communicated with each other, and the temperature and the flow of the cooling liquid are the same, so that the liquid cooling device has good temperature uniformity.

Inventors

• Geng Shaohang
• HU YAOHUI
• SHI ZHONGHUA
• ZHANG TIANNING

Assignees

• 西安电子工程研究所

Dates

Publication Date

20260508

Application Date

20250210

Claims (9)

1. 1. A T/R assembly liquid cooling apparatus adapted for use in a high heat flux and high overload environment, comprising: The device comprises a mounting plate (1) and a liquid cooling cavity (13) arranged on the mounting plate (1); the liquid cooling cavity (13) is internally provided with a plurality of branches, and a main liquid inlet path (5) and a main loop (6) which are isolated from each other; fins (12) are fixedly arranged in the branches, the main liquid inlet path (5) and the main loop liquid path (6); Each branch is arranged in parallel and is not communicated with each other, the first ends of the branch are communicated with the main liquid inlet path (5), and the second ends of the branch are communicated with the main loop liquid path (6).
2. 2. The T/R assembly liquid cooling apparatus for high heat flux and high overload environment according to claim 1, wherein the mounting plate (1) is rectangular, and the main liquid inlet path (5) and the main liquid return path (6) are respectively disposed inside two adjacent sides of the mounting plate (1).
3. 3. The T/R assembly liquid cooling device suitable for high heat flux and high overload environment according to claim 1, wherein the main liquid inlet (5) and the main liquid return (6) are respectively provided with a liquid inlet (3) and a liquid return (4), and the liquid inlet (3) and the liquid return (4) are both located on the same side of the mounting plate (1).
4. 4. A T/R assembly liquid cooling apparatus adapted for use in high heat flux and high overload environments as claimed in claim 1 wherein each of said branches is located between said main inlet (5) and main return (6).
5. 5. The T/R assembly liquid cooling apparatus for high heat flux and high overload environment of claim 1 wherein each of said legs are isolated from each other by a stiffener (14).
6. 6. The T/R assembly liquid cooling apparatus for use in high heat flux and high overload environments as set forth in claim 1 wherein the number of fins (12) in each of said legs differs by no more than 5.
7. 7. The T/R assembly liquid cooling apparatus for high heat flux and high overload environment according to claim 1 wherein each of said branches includes a first branch (7), a second branch (8), a third branch (9), a fourth branch (10) and a fifth branch (11) juxtaposed with said main inlet (5).
8. 8. A T/R assembly, comprising: the T/R assembly liquid cooling apparatus of any one of claims 1-7 adapted for use in high heat flux and high overload environments; And the T/R assembly module (2) is arranged on the side surface of the liquid cooling cavity (13) away from the mounting plate (1).
9. 9. A radar comprising the T/R assembly of claim 8.

Description

T/R assembly liquid cooling device suitable for high heat flux and high overload environment, T/R assembly and radar Technical Field The application relates to the field of T/R component liquid cooling devices suitable for high heat flux and high overload environments, in particular to a T/R component liquid cooling device, a T/R component and a radar suitable for high heat flux and high overload environments. Background With the rapid development of radar technology, high power, high integration and miniaturization are one of the development directions of T/R components. The research shows that the reliability of the electronic device is closely related to the temperature, and when the temperature is 70-80 ℃, the reliability of the electronic device is reduced by 50% when the temperature rises by 10 ℃. Therefore, with the development of high power components, heat dissipation is becoming a key technology to be solved by high power T/R components. The heat flux density of a certain radar T/R component is high, the front end power consumption is high, the heat aggregation phenomenon is serious, and in order to meet the requirements of heat dissipation and temperature uniformity, a liquid cooling system is adopted to cool the front end of the radar. In addition, the radar also needs to be designed in an air-drop adaptive mode according to the use requirement, and the liquid cooling device needs to bear the impact of tens of times of gravity acceleration in the air-drop process. In view of the foregoing, there is an urgent need to develop a liquid cooling device suitable for use in a high heat flux and high overload environment, so as to meet the operating requirements of the radar. At present, most of the related patents are disclosed for improving the heat dissipation capacity of the liquid cooling plate. In some patents, the heat dissipation capacity of the liquid cooling plate is finally enhanced by optimizing the fins and the heat conducting columns, in other patents, the liquid cooling plate is used for cooling N electric cores distributed along one direction, and in other patents, the heat dissipation liquid cooling plate with a cold and hot pipeline alternating structure is disclosed, and a heat pipe is embedded in the liquid cooling plate to realize the enhanced heat dissipation. In summary, the presently disclosed patent improves the heat dissipation capability of the liquid cooling plate by optimizing the fins, increasing the heat conduction columns, embedding the heat pipes, and the like, but researches on the temperature uniformity and overload resistance of the liquid cooling plate are little available. Disclosure of utility model The application mainly aims to provide a T/R component liquid cooling device, a T/R component and a radar which are suitable for a high heat flux and high overload environment, and aims to solve the technical problem of the T/R component liquid cooling device which is suitable for the high heat flux and high overload environment. In order to achieve the above purpose, the first aspect of the application provides a T/R component liquid cooling device suitable for high heat flux and high overload environment, which comprises a mounting plate and a liquid cooling cavity arranged on the mounting plate, wherein the liquid cooling cavity is internally provided with a plurality of branches, a main liquid inlet path and a main liquid return path which are mutually isolated, fins are fixedly arranged in the plurality of branches, the main liquid inlet path and the main liquid return path, the branches are arranged in parallel and are not communicated with each other, the first ends of the branches are communicated with the main liquid inlet path, and the second ends of the branches are communicated with the main liquid return path. Optionally, the mounting plate is rectangular, and the main liquid inlet path and the main liquid return path are respectively arranged on the inner sides of two adjacent sides of the mounting plate. Optionally, the main liquid inlet and the main liquid return are respectively provided with a liquid inlet and a liquid return, and the liquid inlet and the liquid return are both positioned on the same side of the mounting plate. Optionally, each of the branches is located between the main inlet and the main circuit. Optionally, the branches are isolated from each other by a reinforcing rib. Optionally, the number of fins in each of the branches does not differ by more than 5. Optionally, each branch includes a first branch, a second branch, a third branch, a fourth branch and a fifth branch, which are arranged in parallel with the main liquid inlet path. In addition, in order to achieve the purpose, the second aspect of the application also provides a T/R assembly, which comprises the T/R assembly liquid cooling device suitable for the high heat flux and high overload environment provided by the first aspect, and the T/R assembly module arranged on the