CN-224218682-U - Heat dissipation module and electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation and discloses a heat dissipation module which comprises a first heat dissipation unit, a second heat dissipation unit and at least one solder filling layer, wherein the first heat dissipation unit is used for providing a first heat conduction surface, the second heat dissipation unit is used for providing a second heat conduction surface, the at least one solder filling layer is arranged between the first heat conduction surface and the second heat conduction surface, the solder filling layer is composed of metal balls and solder materials for filling gaps between the first heat conduction surface and the second heat conduction surface, and the melting point of the metal balls is higher than the welding temperature. The utility model also discloses electronic equipment comprising the heat radiation module. The heat radiation module provided by the utility model has controllable welding thickness and higher heat conduction stability, and can be applied to electronic equipment.

Inventors

• ZHENG XUZHANG
• WANG SHAOHUA
• LIU WENKUN

Assignees

• 厦门市及时雨焊料有限公司

Dates

Publication Date

20260508

Application Date

20250224

Claims (10)

1. 1. A heat dissipation module, the heat dissipation module comprising: the first heat dissipation unit provides a first heat conduction surface; The second heat dissipation unit provides a second heat conduction surface; The solder filling layer is formed by metal balls and solder materials filling gaps between the first heat-conducting surface and the second heat-conducting surface; The melting point of the metal ball is greater than the welding temperature.
2. 2. The heat dissipating module of claim 1, The thickness of the solder filling layer is 10-50 mu m.
3. 3. The heat dissipating module of claim 1, The heat conductivity coefficient of the metal ball is 300W/(m) K) The above.
4. 4. The heat dissipating module of claim 1, The metal balls are pure metal balls, alloy metal balls or metal balls containing surface plating layers.
5. 5. The heat dissipating module of claim 1, The metal balls are copper metal balls, copper alloy metal balls or copper metal balls containing surface plating layers.
6. 6. The heat dissipating module of claim 1, The diameter of the metal ball is 10-50 mu m.
7. 7. The heat dissipating module of claim 1, The ratio of the long diameter to the short diameter of the metal ball is smaller than 1.2, and the mass of the metal ball with the ratio of the long diameter to the short diameter smaller than 1.2 accounts for more than 90% of the total mass of the metal ball.
8. 8. The heat dissipating module of claim 1, The first heat dissipation unit is a flat heat conduction pipe, a vapor chamber or a heat conduction bottom plate, and/or The second heat dissipation unit is a heat conduction pipe or a fin.
9. 9. The heat dissipating module of claim 1, The first heat dissipation unit is made of copper or aluminum nickel plating and/or The material of the second heat dissipation unit is copper or aluminum nickel plating.
10. 10. An electronic device, characterized in that, Comprises a main board, a heat source and a heat dissipation module; a mounting carrier for electronic components; Heat source, electronic components with different functions; The heat radiation module is arranged on the heat radiation surface of the heat source and used for radiating the heat source; The heat dissipation module employs the heat dissipation module as defined in any one of claims 1-9.

Description

Heat dissipation module and electronic equipment Technical Field The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation module and electronic equipment. Background The advent of artificial intelligence and the big data age has put higher demands on CPU computing power and GPU image processing capabilities. And the CPU and the GPU have higher power consumption and simultaneously have higher requirements on the heat dissipation module contacted with the CPU and the GPU. The heat radiation module combines the heat pipe, the fins and the base together in a reflow oven through welding materials. Because the heat pipe material cannot withstand high temperature, low Wen Xigao (melting point 138 ℃) becomes the first welding material of the heat dissipation module. The existing low Wen Xigao is in a disordered state due to the functions of volume change, wick effect and the like, so that the thickness of a welding layer is uneven, and the heat conduction stability of a welded heat dissipation module is affected. In view of the above, it is actually required to construct a heat dissipation module with high heat conduction stability by adjusting the soldering layer. Disclosure of utility model The utility model aims to provide a heat radiation module, wherein the welding thickness of the heat radiation module is controllable, and the heat radiation module has higher heat conduction stability and can be applied to electronic equipment. A first aspect of the present utility model provides a heat dissipation module, including: the first heat dissipation unit provides a first heat conduction surface; The second heat dissipation unit provides a second heat conduction surface; The solder filling layer is formed by metal balls and solder materials filling gaps between the first heat-conducting surface and the second heat-conducting surface; The melting point of the metal ball is greater than the welding temperature. In some embodiments, the solder fill layer has a thickness of 10-50 μm. In some embodiments, the metal balls have a thermal conductivity of 300W/(m×k) or more. In some embodiments, the metal spheres are pure metal spheres, alloy metal spheres, or metal spheres having a surface coating. In some embodiments, the metal balls are copper metal balls, copper alloy metal balls, or metal balls with surface copper plating. In some embodiments, the metal spheres have a diameter of 10-50 μm. In some embodiments, the ratio of the long diameter to the short diameter of the metal ball is less than 1.2, and the mass of the metal ball with the ratio of the long diameter to the short diameter of less than 1.2 in the metal ball accounts for more than 90% of the total mass of the metal ball. In some embodiments, the first heat dissipating unit is a flat heat pipe, a vapor chamber, or a heat conducting base plate, and/or The second heat dissipation unit is a heat conduction pipe or a fin. In some embodiments, the first heat dissipating unit is made of copper or aluminum nickel plating, and/or The material of the second heat dissipation unit is copper or aluminum nickel plating. A second aspect of the present utility model provides an electronic device comprising: a motherboard, a mounting carrier for various electronic components; Heat source, electronic components with different functions; the heat dissipation module is arranged on the heat source heat dissipation surface and used for dissipating heat of the heat source, and the heat dissipation module is provided in the first aspect. Compared with the prior art, the utility model has the following beneficial technical effects: The utility model controls the welding thickness by using the metal balls which are not melted at the welding temperature, so that the thickness of the welding filling layer is uniform, and the heat conduction stability of the heat dissipation module is improved. Drawings Fig. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the utility model. Detailed Description The present utility model will be described in further detail with reference to specific examples, which will enable those skilled in the art to more fully understand the utility model, but which are not intended to limit the utility model in any way. With the wider application of portable electronic devices, the functional requirements of people On the electronic devices are increasing, so that the requirements On the computing capacities of the processing centers such as a CPU (Central Processing Unit, a central processing unit), a GPU (Graphic Processing Unit, a graphics processor), an SOC (System On Chip) and the like of the electronic devices are also increasing, which means that more heating values exist in the electronic devices, and more complex heat dissipation components with stronger heat dissipation capacity are needed to ensure the performance of the processing centers. However, in the prior art, due