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CN-224218683-U - Electrical connection assembly and electronic device

CN224218683UCN 224218683 UCN224218683 UCN 224218683UCN-224218683-U

Abstract

The application provides an electric connection assembly and electronic equipment, wherein the electric connection assembly comprises a circuit board, a first shielding assembly, a heat dissipation module and a second shielding assembly, the circuit board is provided with an electronic element, the first shielding assembly is connected with the circuit board and surrounds the electronic element, the heat dissipation module is arranged at one side of the first shielding assembly, which is far away from the circuit board, at intervals, the second shielding assembly is arranged between the first shielding assembly and the heat dissipation module and is jointly enclosed with the first shielding assembly and the heat dissipation module to form a heat dissipation air channel, the second shielding assembly comprises a plurality of conductive connecting pieces which are respectively connected with the first shielding assembly and the heat dissipation module, and two adjacent conductive connecting pieces are arranged at intervals to form a first opening of the heat dissipation air channel. The first openings of the heat dissipation air channels can be formed between the two adjacent conductive connecting pieces, which is equivalent to increasing the number of the openings of the heat dissipation air channels, and can accelerate the exchange of the air inside and outside the heat dissipation air channels, so that more air can participate in heat dissipation.

Inventors

  • XU MENGRAN
  • LIU LIZHONG

Assignees

  • 华为技术有限公司

Dates

Publication Date
20260508
Application Date
20250324

Claims (11)

  1. 1. An electrical connection assembly, comprising: a circuit board provided with electronic components; A first shielding assembly connected to the circuit board and surrounding the electronic component; The heat dissipation modules are arranged on one side, away from the circuit board, of the first shielding component at intervals, and at least one part of the heat dissipation modules are opposite to the electronic element in position; The second shielding assembly is arranged between the first shielding assembly and the heat dissipation module and is enclosed together with the first shielding assembly and the heat dissipation module to form a heat dissipation air duct, the second shielding assembly comprises conductive connecting pieces which are connected with the first shielding assembly and the heat dissipation module respectively, a plurality of conductive connecting pieces are arranged, and two adjacent conductive connecting pieces are spaced to form a first opening of the heat dissipation air duct.
  2. 2. The electrical connection assembly of claim 1, wherein the conductive connector is arched, one of the first shielding assembly and the heat dissipation module is abutted against a middle portion of the conductive connector, the other of the first shielding assembly and the heat dissipation module is connected with two side portions of the conductive connector, and the two side portions are spaced to form a second opening of the heat dissipation air duct.
  3. 3. The electrical connection assembly of claim 2, wherein the conductive connector further comprises a ball disposed at the edge, the edge being connected to the first shielding assembly or the heat dissipating module by the ball.
  4. 4. An electrical connection assembly according to claim 2 or claim 3 wherein the distance between two said edges of the same conductive connection is L1, L1 being less than or equal to 5mm.
  5. 5. The electrical connection assembly of any one of claims 1-4, wherein a distance between two adjacent conductive connectors is L2, L2 being 5mm or less.
  6. 6. The electrical connection assembly of any one of claims 1-5, wherein the conductive connection is a metal piece and the surface impedance of the conductive connection is Z,0<Z +.0.1 ohm.
  7. 7. The electrical connection assembly of any one of claims 1-6, wherein the first shielding assembly comprises a plurality of shielding strips connected to the circuit board, the plurality of shielding strips being arranged in sequence to surround the electronic component, adjacent two of the shielding strips being spaced apart to form a third opening of the heat dissipation air duct.
  8. 8. The electrical connection assembly of claim 7, wherein the shielding strip is provided with a heat dissipation aperture in communication with the heat dissipation air duct.
  9. 9. The electrical connection assembly of claim 8, wherein the heat dissipation apertures have a pore size D of 0.7mm +.d +.0.9 mm.
  10. 10. The electrical connection assembly according to claim 8 or 9, wherein a plurality of heat dissipation holes are provided, and a distance between two adjacent heat dissipation holes on the same shielding strip is L3, and L3 is 1 mm-4 mm.
  11. 11. An electronic device comprising a housing, wherein an electrical connection assembly is provided in the housing, the electrical connection assembly being as claimed in any one of claims 1 to 10.

Description

Electrical connection assembly and electronic device Technical Field The present application relates to the field of electronic devices, and in particular, to an electrical connection assembly and an electronic device. Background Electronic equipment is widely applied to various fields of life and work, and along with the improvement of the internal integration level and the increase of the power of a functional module, the heat dissipation of the electronic equipment becomes a key factor for restricting the improvement of the performance of the electronic equipment. In order to improve the heat transfer efficiency, the heat dissipation module, the conductive foam and the shielding frame in the electronic equipment can be enclosed to form a heat dissipation air channel with an opening, and heat generated by the electronic element in the enclosing area of the shielding frame can be discharged through air flowing in the heat dissipation air channel. However, this kind of mode that carries out the heat dissipation through heat dissipation wind channel cooperation fan, although alleviated electronic equipment's heat dissipation problem to a certain extent, the opening size in heat dissipation wind channel is limited, has limited the air quantity that gets into in the heat dissipation wind channel, is difficult to further promote electronic equipment's heat design consumption. Disclosure of utility model The embodiment of the application provides an electric connection assembly and electronic equipment, which enable more air to participate in heat dissipation by optimizing a heat dissipation structure of the electronic equipment, and improve the heat design power consumption of the electronic equipment. In a first aspect, there is provided an electrical connection assembly comprising: a circuit board provided with electronic components; A first shielding assembly connected to the circuit board and surrounding the electronic component; The heat dissipation modules are arranged on one side, away from the circuit board, of the first shielding component at intervals, and at least one part of the heat dissipation modules are opposite to the electronic element in position; The second shielding assembly is arranged between the first shielding assembly and the heat dissipation module and is enclosed together with the first shielding assembly and the heat dissipation module to form a heat dissipation air duct, the second shielding assembly comprises conductive connecting pieces which are connected with the first shielding assembly and the heat dissipation module respectively, a plurality of conductive connecting pieces are arranged, and two adjacent conductive connecting pieces are spaced to form a first opening of the heat dissipation air duct. It should be noted that the circuit board may be provided with one electronic component or may be provided with a plurality of electronic components, and examples of the electronic components include a system on a chip, a metal-oxide semiconductor field effect transistor, a power integrated circuit, a central processing unit, a memory, a microcontroller, a flash memory, a gravity sensor, and the like. The second shielding component of the electric connection component comprises a plurality of conductive connecting pieces, the plurality of conductive connecting pieces are arranged at intervals, a first opening of a heat dissipation air duct can be formed between two adjacent conductive connecting pieces, so that the number of the openings of the heat dissipation air duct is increased, the equivalent opening size of the heat dissipation air duct is increased, air in the heat dissipation air duct flows out more easily, external air can flow into the heat dissipation air duct more easily, exchange of air inside and outside the heat dissipation air duct can be accelerated, more air can participate in heat dissipation, heat dissipation performance of the electric connection component is improved, heat design power consumption of electronic equipment is improved, in addition, in the process of assembling the electric connection component, the size of the first opening can be controlled by adjusting the distance between two adjacent conductive connecting pieces, so that influence of the first opening on electromagnetic noise shielding effect is reduced, and performance of the electronic equipment is guaranteed. In some embodiments, a fan used in cooperation with the electrical connection assembly may be disposed in the electronic device, the fan may face a portion of the first opening of the heat dissipation air duct, at this time, the first opening opposite to the fan may be used as an inlet, the remaining first openings may be used as outlets, when the fan is started, air may be caused to flow into the heat dissipation air duct from the inlet, and hot air in the heat dissipation air duct may also flow out from the outlets under the driving of the air flow. In one possible implementatio