CN-224218686-U - Circuit board assembly and electronic equipment

Abstract

The application provides a circuit board assembly and electronic equipment, wherein the circuit board assembly comprises a first circuit board, a second circuit board and a first frame board, the first circuit board and the second circuit board are arranged in a stacked mode, the first frame board is arranged between the first circuit board and the second circuit board, the first frame board and the second circuit board enclose a first cavity, a first heat conducting material is filled in the first cavity, a first heat radiating device is arranged on one side, far away from the second circuit board, of the first circuit board, a first heat generating device is connected with the second circuit board, one end of the heat conducting block is in heat conducting connection with the first heat radiating device, the first circuit board is provided with a first through hole, at least part of the heat conducting block penetrates through the first through hole to be in contact with the first heat conducting material, and a gap is reserved between the heat conducting block and the second circuit board. The circuit board assembly and the electronic equipment provided by the application can realize high heat conduction efficiency.

Inventors

• Ren Erbei
• LIU FEI
• PAN YONGWEI
• LUO YUFENG
• CHENG YUPENG
• LUO YUCHEN
• ZHANG SHAOHUA
• HE ZHICHENG

Assignees

• 华为技术有限公司

Dates

Publication Date

20260508

Application Date

20250327

Claims (14)

1. 1. A circuit board assembly, comprising: The circuit board comprises a first circuit board (201), a second circuit board (202) and a first frame board (203), wherein the first circuit board (201) and the second circuit board (202) are arranged in a stacked mode, the first frame board (203) is arranged between the first circuit board (201) and the second circuit board (202), the first circuit board (201), the first frame board (203) and the second circuit board (202) enclose a first cavity, and a first heat conducting material (204) is filled in the first cavity; A first heat sink (206) provided on a side of the first circuit board (201) remote from the second circuit board (202); a first heat generating device (207) connected to the second circuit board (202); The heat conduction block (205), the one end of heat conduction block (205) with first heat dissipation device (206) heat conduction is connected, first circuit board (201) is provided with first through-hole (2011), at least part of heat conduction block (205) pass first through-hole (2011) with first heat conduction material (204) contact, just heat conduction block (205) with have the clearance between second circuit board (202).
2. 2. The circuit board assembly of claim 1, wherein the thermally conductive block (205) comprises a body portion (2051) and an extension portion (2052), the body portion (2051) being disposed between the first circuit board (201) and the first heat sink device (206), at least a portion of the extension portion (2052) contacting the first thermally conductive material (204) through the first through hole (2011); the cross-sectional area of the main body portion (2051) is larger than the cross-sectional area of the first through hole (2011) on a plane perpendicular to a first direction, which is a lamination direction of the first circuit board (201) and the second circuit board (202).
3. 3. The circuit board assembly according to claim 2, wherein the body portion (2051) and the extension portion (2052) are of unitary construction.
4. 4. The circuit board assembly according to claim 2, wherein the main body portion (2051) and the extension portion (2052) are of a split structure, and a thermal interface material is provided between the main body portion (2051) and the extension portion (2052).
5. 5. The circuit board assembly according to any one of claims 2 to 4, wherein the number of extension portions (2052) is plural, and wherein a plurality of extension portions (2052) extend into the first cavity and contact the first thermally conductive material (204), respectively.
6. 6. The circuit board assembly according to any of claims 2 to 4, wherein a projection of the extension (2052) along the first direction overlaps at least part of the first heat generating device (207).
7. 7. The circuit board assembly according to any one of claims 1 to 4, wherein the first heating device (207) is arranged at a side of the second circuit board (202) remote from the first circuit board (201); The circuit board assembly further includes a second heat generating device (2022), the second heat generating device (2022) disposed within the first cavity, and the second heat generating device (2022) is in contact with the first thermally conductive material (204).
8. 8. The circuit board assembly according to claim 7, wherein a projection of the thermally conductive block (205) along the first direction overlaps at least part of the second heat generating device (2022).
9. 9. The circuit board assembly according to any one of claims 1 to 4, further comprising a third heat generating device (2023) and a shielding cover (209), wherein the third heat generating device (2023) is disposed on a side of the second circuit board (202) close to the first circuit board (201) and is located outside the first cavity, the third heat generating device (2023) is covered under the shielding cover (209), a second heat conducting material (211) is filled between the third heat generating device (2023) and the shielding cover (209), and the shielding cover (209) and the heat conducting block (205) are in heat conducting connection through a thermal interface material.
10. 10. The circuit board assembly according to any of claims 1 to 4, wherein the first frame plate (203) comprises a metallized hole (2031), the metallized hole (2031) extending from an end of the first frame plate (203) adjacent to the first circuit board (201) to an end of the first frame plate (203) adjacent to the second circuit board (202).
11. 11. The circuit board assembly according to claim 10, wherein the first frame plate (203) further comprises a metal plating (2032), the metal plating (2032) being plated to a side of the first frame plate (203) adjacent to the first circuit board (201), and/or the metal plating (2032) being plated to a side of the first frame plate (203) adjacent to the second circuit board (202).
12. 12. The circuit board assembly according to claim 11, wherein the first frame plate (203) comprises the metallized hole (2031) and the first frame plate (203) comprises the metal plating (2032), the metal plating (2032) is in communication with the metallized hole (2031).
13. 13. The circuit board assembly according to any one of claims 1 to 4, further comprising a second heat sink (210), the second heat sink (210) being arranged at a side of the first heat generating device (207) remote from the second circuit board (202), and the second heat sink (210) being in thermally conductive connection with the first heat generating device (207).
14. 14. An electronic device comprising the circuit board assembly of any one of claims 1 to 13.

Description

Circuit board assembly and electronic equipment Technical Field The application relates to the technical field of heat dissipation, in particular to a circuit board assembly and electronic equipment. Background In electronic devices, devices such as a System On Chip (SOC), a camera, a radio frequency chip, etc. release a large amount of heat during operation, so that normal operation of the electronic devices is affected, and a user's holding feel is also easily affected. In order to promote effective heat dissipation of electronic devices, active heat dissipation devices such as an air cooling structure and a liquid cooling structure are generally disposed in the electronic devices. The heat dissipation devices can realize efficient heat dissipation, and the heat on the heating devices can be efficiently conducted to the heat dissipation devices. Providing a thermal interface material (THERMAL INTERFACE MATERIAL, TIM) between the heat-dissipating device and the heat-generating device is a common thermal conduction scheme. The TIM can reduce the contact thermal resistance between the heating device and the heat dissipation device and transfer the heat released by the heating device to the heat dissipation device. However, in the case where the distance between the heat generating device and the heat dissipating device is long, the heat conduction efficiency by using only TIM is low, and the heat dissipating effect is poor. Disclosure of utility model The application provides a circuit board assembly and electronic equipment, which can realize high heat conduction efficiency. In a first aspect, a circuit board assembly is provided, which comprises a first circuit board, a second circuit board and a first frame board, wherein the first circuit board and the second circuit board are arranged in a laminated manner, the first frame board is arranged between the first circuit board and the second circuit board, the first frame board and the second circuit board enclose a first cavity, a first heat conducting material is filled in the first cavity, a first heat radiating device is arranged on one side, far away from the second circuit board, of the first circuit board, a first heat generating device is connected with the second circuit board, one end of the heat conducting block is in heat conducting connection with the first heat radiating device, the first circuit board is provided with a first through hole, at least part of the heat conducting block penetrates through the first through hole to be in contact with the first heat conducting material, and a gap is reserved between the heat conducting block and the second circuit board. In the embodiment provided by the application, one end of the heat conducting block is in heat conducting connection with the first heat radiating device, at least part of the heat conducting block passes through the first through hole to be in contact with the first heat conducting material, and heat generated by the first heat generating device can be transferred to the first heat conducting material through the first circuit board and then transferred to the heat conducting block and then transferred to the first heat radiating device to radiate heat, so that the heat conducting block has higher heat conducting efficiency, and under the condition that the distance between the first heat generating device and the first heat radiating device is longer, the heat radiating efficiency of the first heat generating device can be improved, and the heat radiating performance is optimized. A first cavity is formed between the first circuit board and the second circuit board, so that the board surface utilization rate of the first circuit board and the second circuit board can be improved, and more elements can be conveniently arranged. The gap is arranged between the heat conduction block and the second circuit board, so that the problem that the second circuit board or welding spots of the second circuit board are damaged due to the fact that stress received by the first heat dissipation device is transferred to the second circuit board can be relieved. With reference to the first aspect, in some implementations of the first aspect, the heat conducting block includes a main body portion and an extension portion, the main body portion is disposed between the first circuit board and the first heat dissipating device, at least a portion of the extension portion passes through the first through hole to be in contact with the first heat conducting material, and a cross-sectional area of the main body portion is larger than a cross-sectional area of the first through hole on a plane perpendicular to a lamination direction of the first circuit board and the second circuit board. In the embodiment provided by the application, the heat conducting block comprises the main body part and the extension part, and the cross section area of the main body part is larger than the cross section area of the f